PL367099A1 - Ekranowanie pakietów elektronicznych od zakłóceń elektromagnetycznych (EMI) - Google Patents

Ekranowanie pakietów elektronicznych od zakłóceń elektromagnetycznych (EMI)

Info

Publication number
PL367099A1
PL367099A1 PL02367099A PL36709902A PL367099A1 PL 367099 A1 PL367099 A1 PL 367099A1 PL 02367099 A PL02367099 A PL 02367099A PL 36709902 A PL36709902 A PL 36709902A PL 367099 A1 PL367099 A1 PL 367099A1
Authority
PL
Poland
Prior art keywords
emi
electromagnetic interference
electronic packages
shielding electronic
shielding
Prior art date
Application number
PL02367099A
Other languages
English (en)
Inventor
David James Alcoe
Jeffrey Thomas Coffin
Michael Anthony Gaynes
Harvey Charles Hamel
Mario Interrante
Brenda Lee Peterson
Megan Shannon
William Edward Sablinski
Christopher Todd Spring
Randall Joseph Stutzman
Renee Weisman
Jeffrey Allen Zitz
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Publication of PL367099A1 publication Critical patent/PL367099A1/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
PL02367099A 2001-08-01 2002-07-26 Ekranowanie pakietów elektronicznych od zakłóceń elektromagnetycznych (EMI) PL367099A1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/921,062 US6740959B2 (en) 2001-08-01 2001-08-01 EMI shielding for semiconductor chip carriers

Publications (1)

Publication Number Publication Date
PL367099A1 true PL367099A1 (pl) 2005-02-21

Family

ID=25444862

Family Applications (1)

Application Number Title Priority Date Filing Date
PL02367099A PL367099A1 (pl) 2001-08-01 2002-07-26 Ekranowanie pakietów elektronicznych od zakłóceń elektromagnetycznych (EMI)

Country Status (12)

Country Link
US (1) US6740959B2 (pl)
EP (1) EP1412982A2 (pl)
JP (1) JP4437919B2 (pl)
KR (1) KR100590382B1 (pl)
CN (1) CN1539167A (pl)
AU (1) AU2002319480A1 (pl)
HU (1) HUP0401737A2 (pl)
IL (2) IL160070A0 (pl)
MY (1) MY126247A (pl)
PL (1) PL367099A1 (pl)
TW (1) TW577164B (pl)
WO (1) WO2003012867A2 (pl)

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JP2004537861A (ja) 2004-12-16
TW577164B (en) 2004-02-21
KR20040020948A (ko) 2004-03-09
US20030025180A1 (en) 2003-02-06
CN1539167A (zh) 2004-10-20
IL160070A0 (en) 2004-06-20
WO2003012867A2 (en) 2003-02-13
WO2003012867A3 (en) 2003-05-22
US6740959B2 (en) 2004-05-25
AU2002319480A1 (en) 2003-02-17
HUP0401737A2 (en) 2004-12-28
MY126247A (en) 2006-09-29
IL160070A (en) 2008-06-05

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