PL368717A1 - Zastosowanie różnych materiałów w obudowach z wnęką powietrzną dla przyrządów elektronicznych - Google Patents

Zastosowanie różnych materiałów w obudowach z wnęką powietrzną dla przyrządów elektronicznych

Info

Publication number
PL368717A1
PL368717A1 PL02368717A PL36871702A PL368717A1 PL 368717 A1 PL368717 A1 PL 368717A1 PL 02368717 A PL02368717 A PL 02368717A PL 36871702 A PL36871702 A PL 36871702A PL 368717 A1 PL368717 A1 PL 368717A1
Authority
PL
Poland
Prior art keywords
sidewalls
base
die
cover
attached
Prior art date
Application number
PL02368717A
Other languages
English (en)
Other versions
PL205553B1 (pl
Inventor
Raymond S. Bregante
Tony Shaffer
K.Scott Mellen
Richard J. Ross
Original Assignee
Rjr Polymers, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr Polymers, Inc. filed Critical Rjr Polymers, Inc.
Publication of PL368717A1 publication Critical patent/PL368717A1/pl
Publication of PL205553B1 publication Critical patent/PL205553B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Casings For Electric Apparatus (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Packaging Frangible Articles (AREA)
  • Organic Insulating Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Przyrządy półprzewodnikowe (struktury półprzewodnikowe) są wprowadzane do nieprzepuszczalnych dla wilgoci obudów zespołów elektronicznych przez utworzenie obudów wokół struktury półprzewodnikowej, w trzech oddzielnych częściach: podstawie, ścianach bocznych i pokrywie. Struktura półprzewodnikowa zostaje najpierw przylutowana lub inaczej przyłączona do podstawy, po czym następuje zamocowanie ścian bocznych do podstawy i w końcu pokrywy do ścian bocznych. W przypadku procedur wykorzystujących podstawę przewodzącą ciepło i wysoką temperaturę lutowania, struktura półprzewodnikowa może być zamocowana do podstawy w wysokiej temperaturze lutowania, po czym następuje nałożenie ścian bocznych na podstawę przy znacznie niższej temperaturze, zapobiegając potencjalnemu uszkodzeniu ścian bocznych w wysokiej temperaturze. Zatem można zastosować ściany boczne z tworzywa sztucznego, które inaczej uszkodziłyby się lub odkształciły pod wpływem wysokiej temperatury lutowania. W przypadku obudów zespołów elektronicznych zwykle zastosowanie ścian bocznych z tworzywa sztucznego umożliwia zastosowanie kombinacji materiałów na pokrywę i podstawę, które są inaczej niezgodne, i zmniejsza lub eliminuje przypadkowe uszkodzenie związane z pęknięciami pod wpływem naprężeń, co następuje przy wysokich temperaturach występujących przy wytwarzaniu, montażu, badaniu lub stosowaniu obudowy.
PL368717A 2001-07-12 2002-06-19 Sposób obudowania przyrządu półprzewodnikowego PL205553B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/904,583 US6511866B1 (en) 2001-07-12 2001-07-12 Use of diverse materials in air-cavity packaging of electronic devices

Publications (2)

Publication Number Publication Date
PL368717A1 true PL368717A1 (pl) 2005-04-04
PL205553B1 PL205553B1 (pl) 2010-04-30

Family

ID=25419388

Family Applications (1)

Application Number Title Priority Date Filing Date
PL368717A PL205553B1 (pl) 2001-07-12 2002-06-19 Sposób obudowania przyrządu półprzewodnikowego

Country Status (16)

Country Link
US (1) US6511866B1 (pl)
EP (1) EP1415335B1 (pl)
JP (1) JP4362366B2 (pl)
KR (1) KR100815740B1 (pl)
CN (1) CN1266751C (pl)
AT (1) ATE343851T1 (pl)
AU (1) AU2002310466B2 (pl)
CA (1) CA2453003C (pl)
DE (1) DE60215669T2 (pl)
IL (1) IL159727A0 (pl)
MA (1) MA26134A1 (pl)
MX (1) MXPA04000248A (pl)
MY (1) MY122915A (pl)
PL (1) PL205553B1 (pl)
TW (1) TW554504B (pl)
WO (1) WO2003007362A1 (pl)

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US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
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US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
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US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
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US9293350B2 (en) * 2008-10-28 2016-03-22 Stats Chippac Ltd. Semiconductor package system with cavity substrate and manufacturing method therefor
US8110445B2 (en) * 2009-05-06 2012-02-07 Infineon Technologies Ag High power ceramic on copper package
US8013429B2 (en) 2009-07-14 2011-09-06 Infineon Technologies Ag Air cavity package with copper heat sink and ceramic window frame
US8759965B2 (en) * 2009-10-14 2014-06-24 Stmicroelectronics, Inc. Modular low stress package technology
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US8907467B2 (en) * 2012-03-28 2014-12-09 Infineon Technologies Ag PCB based RF-power package window frame
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
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DE102015209892A1 (de) * 2015-05-29 2016-12-01 Rolls-Royce Deutschland Ltd & Co Kg Adaptives Flugzeugtriebwerk und Flugzeug mit einem adaptiven Triebwerk
US9629246B2 (en) 2015-07-28 2017-04-18 Infineon Technologies Ag PCB based semiconductor package having integrated electrical functionality
US9997476B2 (en) 2015-10-30 2018-06-12 Infineon Technologies Ag Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
US10225922B2 (en) 2016-02-18 2019-03-05 Cree, Inc. PCB based semiconductor package with impedance matching network elements integrated therein
US10115605B2 (en) 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates
US11791251B2 (en) 2021-07-29 2023-10-17 Qorvo Us, Inc. High power laminate RF package
US12136615B2 (en) 2021-11-30 2024-11-05 Qorvo Us, Inc. Electronic package with interposer between integrated circuit dies

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Also Published As

Publication number Publication date
MY122915A (en) 2006-05-31
AU2002310466B2 (en) 2006-07-20
MA26134A1 (fr) 2004-04-01
CN1266751C (zh) 2006-07-26
EP1415335A4 (en) 2005-12-21
DE60215669T2 (de) 2007-08-23
JP2004535675A (ja) 2004-11-25
ATE343851T1 (de) 2006-11-15
EP1415335A1 (en) 2004-05-06
CN1526162A (zh) 2004-09-01
CA2453003C (en) 2009-12-22
JP4362366B2 (ja) 2009-11-11
MXPA04000248A (es) 2004-05-04
KR20040036898A (ko) 2004-05-03
US20030013234A1 (en) 2003-01-16
KR100815740B1 (ko) 2008-03-20
CA2453003A1 (en) 2003-01-23
US6511866B1 (en) 2003-01-28
PL205553B1 (pl) 2010-04-30
IL159727A0 (en) 2004-06-20
DE60215669D1 (de) 2006-12-07
WO2003007362A1 (en) 2003-01-23
EP1415335B1 (en) 2006-10-25
TW554504B (en) 2003-09-21
HK1065641A1 (en) 2005-02-25

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