PL3715040T3 - Stop lutowniczy, pasta lutownicza, kulki lutownicze, lut z rdzeniem żywicznym oraz złącze lutownicze - Google Patents

Stop lutowniczy, pasta lutownicza, kulki lutownicze, lut z rdzeniem żywicznym oraz złącze lutownicze

Info

Publication number
PL3715040T3
PL3715040T3 PL18908704T PL18908704T PL3715040T3 PL 3715040 T3 PL3715040 T3 PL 3715040T3 PL 18908704 T PL18908704 T PL 18908704T PL 18908704 T PL18908704 T PL 18908704T PL 3715040 T3 PL3715040 T3 PL 3715040T3
Authority
PL
Poland
Prior art keywords
solder
alloy
paste
joint
ball
Prior art date
Application number
PL18908704T
Other languages
English (en)
Inventor
Takahiro Yokoyama
Kanta Dei
Takahiro Matsufuji
Hikaru Nomura
Shunsaku Yoshikawa
Original Assignee
Senju Metal Industry Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd filed Critical Senju Metal Industry Co., Ltd
Publication of PL3715040T3 publication Critical patent/PL3715040T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PL18908704T 2018-03-08 2018-12-21 Stop lutowniczy, pasta lutownicza, kulki lutownicze, lut z rdzeniem żywicznym oraz złącze lutownicze PL3715040T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018042040 2018-03-08
JP2018138511A JP6418349B1 (ja) 2018-03-08 2018-07-24 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
PCT/JP2018/047180 WO2019171710A1 (ja) 2018-03-08 2018-12-21 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
EP18908704.2A EP3715040B1 (en) 2018-03-08 2018-12-21 Solder alloy, solder paste, solder ball, resin cored solder, and solder joint

Publications (1)

Publication Number Publication Date
PL3715040T3 true PL3715040T3 (pl) 2022-01-17

Family

ID=64098779

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18908704T PL3715040T3 (pl) 2018-03-08 2018-12-21 Stop lutowniczy, pasta lutownicza, kulki lutownicze, lut z rdzeniem żywicznym oraz złącze lutownicze

Country Status (19)

Country Link
US (1) US12636738B2 (pl)
EP (1) EP3715040B1 (pl)
JP (1) JP6418349B1 (pl)
KR (1) KR102194027B1 (pl)
CN (1) CN111683785B (pl)
BR (1) BR112020013321B1 (pl)
CA (1) CA3093091C (pl)
ES (1) ES2893576T3 (pl)
HR (1) HRP20211729T1 (pl)
HU (1) HUE056461T2 (pl)
MX (1) MX386147B (pl)
MY (1) MY194476A (pl)
PH (1) PH12020551403A1 (pl)
PL (1) PL3715040T3 (pl)
PT (1) PT3715040T (pl)
SG (1) SG11202008635PA (pl)
TW (1) TWI677581B (pl)
UA (1) UA126095C2 (pl)
WO (1) WO2019171710A1 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6706351B2 (ja) * 2017-01-20 2020-06-03 レノボ・シンガポール・プライベート・リミテッド はんだ接合方法、およびはんだ継手
JP6795778B1 (ja) * 2020-03-30 2020-12-02 千住金属工業株式会社 フラックス、フラックスを用いたやに入りはんだ、フラックスを用いたフラックスコートはんだ、およびはんだ付け方法
KR102832208B1 (ko) 2020-07-23 2025-07-10 현대모비스 주식회사 모터용 버스바 유닛
CN112620649B (zh) * 2020-11-30 2022-04-12 华中科技大学 一种铝合金材料及基于该材料的激光3d打印铝合金构件
CN113798722B (zh) * 2021-09-30 2022-09-27 大连理工大学 一种复合焊膏及应用其制备组织为细晶β-Sn晶粒的BGA焊锡球/焊点的方法
KR102852732B1 (ko) 2021-10-07 2025-08-29 엠케이전자 주식회사 무연 솔더 합금 및 이를 이용한 전자 장치 제조 방법
WO2024042663A1 (ja) * 2022-08-24 2024-02-29 株式会社タムラ製作所 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

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JPS51108624A (en) * 1975-03-20 1976-09-27 Tokyo Shibaura Electric Co Biisnnin keigokin
JPS5810451B2 (ja) * 1975-03-20 1983-02-25 株式会社東芝 Ｂｉ−ｓｎ−ｉｎ ケイゴウキン
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
JP3224185B2 (ja) 1994-09-29 2001-10-29 富士通株式会社 はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP4230194B2 (ja) 2002-10-30 2009-02-25 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用線材
JP4337326B2 (ja) * 2002-10-31 2009-09-30 千住金属工業株式会社 鉛フリーはんだおよびはんだ付け物品
CN101351296A (zh) * 2005-11-11 2009-01-21 千住金属工业株式会社 焊膏和焊料接头
JP2007196289A (ja) 2005-12-27 2007-08-09 Toshiba Corp 電子部品用無鉛金属材料
JP4904953B2 (ja) 2006-04-06 2012-03-28 日立電線株式会社 配線用導体及びその製造方法並びに端末接続部並びにＰｂフリーはんだ合金
CN101051535B (zh) 2006-04-06 2012-09-19 日立电线株式会社 配线用导体及其制造方法、终端连接部、无铅焊锡合金
JP4789198B2 (ja) * 2006-06-07 2011-10-12 有限会社ナプラ 無鉛ハンダ合金
US9636784B2 (en) * 2010-05-03 2017-05-02 Indium Corporation Mixed alloy solder paste
TWI464031B (zh) * 2011-12-14 2014-12-11 Univ Yuan Ze 抑制柯肯達爾孔洞形成於銲料與銅銲墊之間的方法
JP2013163207A (ja) * 2012-02-10 2013-08-22 Nihon Superior Co Ltd Ｓｎ−Ｂｉ系はんだ合金
WO2013142335A1 (en) * 2012-03-20 2013-09-26 Fry's Metals, Inc. Solder preforms and solder alloy assembly methods
JP5585746B2 (ja) * 2012-08-10 2014-09-10 千住金属工業株式会社 高温鉛フリーはんだ合金
KR101513494B1 (ko) * 2013-12-04 2015-04-21 엠케이전자 주식회사 무연 솔더, 솔더 페이스트 및 반도체 장치

Also Published As

Publication number Publication date
MY194476A (en) 2022-11-30
JP2019155469A (ja) 2019-09-19
JP6418349B1 (ja) 2018-11-07
CN111683785B (zh) 2021-07-30
EP3715040A4 (en) 2020-09-30
TW201938809A (zh) 2019-10-01
BR112020013321B1 (pt) 2021-01-12
CA3093091A1 (en) 2019-09-12
MX2020006919A (es) 2021-09-14
UA126095C2 (uk) 2022-08-10
US20210001431A1 (en) 2021-01-07
WO2019171710A1 (ja) 2019-09-12
MX386147B (es) 2025-03-18
KR102194027B1 (ko) 2020-12-22
PT3715040T (pt) 2021-09-08
CN111683785A (zh) 2020-09-18
PH12020551403A1 (en) 2021-05-31
HRP20211729T1 (hr) 2022-02-18
HUE056461T2 (hu) 2022-02-28
EP3715040B1 (en) 2021-08-18
BR112020013321A2 (pt) 2020-08-18
ES2893576T3 (es) 2022-02-09
TWI677581B (zh) 2019-11-21
SG11202008635PA (en) 2020-10-29
CA3093091C (en) 2021-11-02
US12636738B2 (en) 2026-05-26
EP3715040A1 (en) 2020-09-30
KR20200091932A (ko) 2020-07-31

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