PT3238861T - Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo - Google Patents

Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo

Info

Publication number
PT3238861T
PT3238861T PT158732263T PT15873226T PT3238861T PT 3238861 T PT3238861 T PT 3238861T PT 158732263 T PT158732263 T PT 158732263T PT 15873226 T PT15873226 T PT 15873226T PT 3238861 T PT3238861 T PT 3238861T
Authority
PT
Portugal
Prior art keywords
solder
foam
joining member
flux coating
coating material
Prior art date
Application number
PT158732263T
Other languages
English (en)
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PT3238861T publication Critical patent/PT3238861T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3033—Ni as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/15—Nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Powder Metallurgy (AREA)
PT158732263T 2014-12-26 2015-12-24 Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo PT3238861T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014264998A JP6106154B2 (ja) 2014-12-26 2014-12-26 はんだ材料の製造方法

Publications (1)

Publication Number Publication Date
PT3238861T true PT3238861T (pt) 2025-09-25

Family

ID=56150671

Family Applications (1)

Application Number Title Priority Date Filing Date
PT158732263T PT3238861T (pt) 2014-12-26 2015-12-24 Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo

Country Status (9)

Country Link
US (1) US10675719B2 (pt)
EP (1) EP3238861B1 (pt)
JP (1) JP6106154B2 (pt)
KR (1) KR102180824B1 (pt)
CN (1) CN107107188B (pt)
ES (1) ES3050113T3 (pt)
PT (1) PT3238861T (pt)
TW (1) TWI659788B (pt)
WO (1) WO2016104658A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6256616B2 (ja) * 2015-04-22 2018-01-10 日立金属株式会社 金属粒子およびその製造方法、被覆金属粒子、金属粉体
JP2018140427A (ja) * 2017-02-28 2018-09-13 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ及びはんだ継手
US10730150B2 (en) * 2017-08-07 2020-08-04 Honeywell International Inc. Flowable brazing compositions and methods of brazing metal articles together using the same
JP6376266B1 (ja) * 2017-10-24 2018-08-22 千住金属工業株式会社 核材料およびはんだ継手およびバンプ電極の形成方法
CN107877030B (zh) * 2017-11-07 2020-01-14 深圳市汉尔信电子科技有限公司 一种纳米锡铋复合焊膏及制备方法
CN107717261A (zh) * 2017-12-05 2018-02-23 佛山君帝环保科技有限公司 一种环保焊条
CN111417488A (zh) * 2017-12-22 2020-07-14 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体及连接结构体的制造方法
JP6493603B1 (ja) * 2018-06-12 2019-04-03 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
KR20210103850A (ko) 2020-02-14 2021-08-24 엘지전자 주식회사 태양 전지, 그리고 태양 전지 패널 및 이의 제조 방법
JP7817922B2 (ja) * 2020-03-02 2026-02-19 積水化学工業株式会社 はんだペースト、はんだペースト用金属被覆粒子及び接続構造体
KR20220032918A (ko) 2020-09-08 2022-03-15 삼성전자주식회사 하이브리드 접합 구조물 및 이를 포함한 반도체 소자
JP6892621B1 (ja) * 2020-09-10 2021-06-23 千住金属工業株式会社 核材料、電子部品及びバンプ電極の形成方法
KR102912595B1 (ko) 2020-09-23 2026-01-13 삼성전자주식회사 하이브리드 접합 구조물, 이를 포함한 반도체 소자, 및 반도체 소자 제조방법
CN112458334A (zh) * 2020-11-27 2021-03-09 台州正兴阀门有限公司 水龙头本体铸造用低铅易切削铜合金及其制造方法
KR20220107851A (ko) * 2021-01-26 2022-08-02 삼성전자주식회사 접착 페이스트용 금속 입자, 이를 포함하는 솔더 페이스트 조성물, 및 상기 접착 페이스트용 금속 입자의 제조방법
CN113737228A (zh) * 2021-09-30 2021-12-03 天长市飞龙金属制品有限公司 一种镀锌液及其配置方法
CN117123966A (zh) * 2023-09-26 2023-11-28 大连理工大学 可低温焊接的高可靠性核壳型复合钎料的制备方法
CN117067334B (zh) * 2023-10-19 2023-12-19 江苏零界科技集团有限公司 一种木材表面防火防腐处理工艺

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831502B1 (pt) 1969-10-01 1973-09-29
JPS5036265B1 (pt) 1971-02-26 1975-11-22
JPS5612546A (en) 1979-06-07 1981-02-06 Ajinomoto Co Inc Method and apparatus for measuring bod
JP3288457B2 (ja) * 1992-02-28 2002-06-04 株式会社日立製作所 金めっき液及び金めっき方法
JP4023526B2 (ja) 1997-10-09 2007-12-19 株式会社Ｎｅｏｍａｘマテリアル 微小金属球の製造方法
CN1055883C (zh) 1997-12-22 2000-08-30 北京有色金属研究总院 可焊接不锈钢容器的高熔点低蒸气压钎料合金粉及制法
JP2001319994A (ja) * 2000-02-29 2001-11-16 Allied Material Corp 半導体パッケージとその製造方法
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
US6680128B2 (en) * 2001-09-27 2004-01-20 Agilent Technologies, Inc. Method of making lead-free solder and solder paste with improved wetting and shelf life
US7265046B2 (en) 2002-09-27 2007-09-04 Neomax Material Co., Ltd. Method of making a solder ball
JP5036265B2 (ja) 2005-09-21 2012-09-26 株式会社新菱 接続端子用ボールのめっき方法
JP2007125610A (ja) * 2005-11-02 2007-05-24 Akemichi Takizawa 熱硬化性プラスチック製半田ボール
JP4831502B2 (ja) 2008-09-25 2011-12-07 日立金属株式会社 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品
CN102051657A (zh) 2011-01-21 2011-05-11 哈尔滨工业大学 一种纳米级Sn/SiC复合镀层的制备方法
JP5690917B2 (ja) * 2011-03-07 2015-03-25 Jx日鉱日石金属株式会社 銅又は銅合金、ボンディングワイヤ、銅の製造方法、銅合金の製造方法及びボンディングワイヤの製造方法
JP2013089913A (ja) * 2011-10-21 2013-05-13 Hitachi Chemical Co Ltd 半導体チップ搭載用基板及びその製造方法
JP2013152867A (ja) 2012-01-25 2013-08-08 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP6097162B2 (ja) 2012-07-02 2017-03-15 積水化学工業株式会社 導電性粒子及びはんだ接合材料
WO2014203348A1 (ja) * 2013-06-19 2014-12-24 千住金属工業株式会社 Ｃｕ核ボール
KR101858884B1 (ko) 2013-11-05 2018-05-16 센주긴조쿠고교 가부시키가이샤 Cu 핵 볼, 땜납 페이스트, 폼 땜납 및 납땜 조인트
WO2015114771A1 (ja) * 2014-01-30 2015-08-06 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、フォームはんだ、およびはんだペースト
JP5585751B1 (ja) * 2014-02-04 2014-09-10 千住金属工業株式会社 Ｃｕボール、Ｃｕ核ボール、はんだ継手、はんだペースト、およびフォームはんだ
KR101699256B1 (ko) * 2014-06-30 2017-01-24 엠케이전자 주식회사 솔더볼 및 이를 이용한 반도체 장치

Also Published As

Publication number Publication date
US10675719B2 (en) 2020-06-09
CN107107188B (zh) 2019-09-17
WO2016104658A1 (ja) 2016-06-30
KR102180824B1 (ko) 2020-11-19
KR20170100594A (ko) 2017-09-04
ES3050113T3 (en) 2025-12-19
JP6106154B2 (ja) 2017-03-29
CN107107188A (zh) 2017-08-29
TWI659788B (zh) 2019-05-21
TW201642973A (zh) 2016-12-16
EP3238861A1 (en) 2017-11-01
US20180015572A1 (en) 2018-01-18
EP3238861B1 (en) 2025-08-27
JP2016125076A (ja) 2016-07-11
EP3238861A4 (en) 2018-08-01

Similar Documents

Publication Publication Date Title
PT3238861T (pt) Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo
GB2566476B (en) Conduction welding
EP3216553A4 (en) Solder material, solder paste, foam solder, solder joint, and method for controlling solder material
EP3219433A4 (en) Flux for solder paste, solder paste, and joined body
EP3103565A4 (en) Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
SG11202000023QA (en) Flux and solder material
EP3124167A4 (en) Flux and solder paste
EP3112080A4 (en) Lead-free solder alloy, solder material, and joined structure
PT3603877T (pt) Liga de soldadura, pasta de soldadura, e junta de soldadura
PT3281739T (pt) Dispositivo de revestimento de fluxo e solda
GB201410093D0 (en) Solder flux
EP3238872A4 (en) Flux for fast-heating method, and solder paste for fast-heating method
PT3603879T (pt) Composição de fundente e composição de pasta para soldar
EP3308901A4 (en) Flux for lead-free solder, and lead-free solder paste
GB2562477B (en) Joining method
SG11201607232WA (en) Metal paste and use thereof for the connecting of components
ZA201707295B (en) Bonding objects together
SG11201601914QA (en) Cleaning flux, cleaning solder paste, and solder joint
PL3254800T3 (pl) Środek aktywujący topnik, topnik i lutowie
GB2608711B (en) Brazing components and techniques
GB201507393D0 (en) Joining method
GB2533698B (en) A joint assembly and a method of using the same
EP3103566A4 (en) Ni BALL, Ni CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
GB201504988D0 (en) Weldable elements, joints and associated methods
GB201718438D0 (en) Joining components