PL391856A1 - Sposób i układ z dwiema anodami do nadmiarowego napylania anodowego - Google Patents

Sposób i układ z dwiema anodami do nadmiarowego napylania anodowego

Info

Publication number
PL391856A1
PL391856A1 PL391856A PL39185608A PL391856A1 PL 391856 A1 PL391856 A1 PL 391856A1 PL 391856 A PL391856 A PL 391856A PL 39185608 A PL39185608 A PL 39185608A PL 391856 A1 PL391856 A1 PL 391856A1
Authority
PL
Poland
Prior art keywords
anode
anodes
cathode
time
current supply
Prior art date
Application number
PL391856A
Other languages
English (en)
Other versions
PL217715B1 (pl
Inventor
Goetz Teschner
Enno Mirring
Johannes Struempfel
Andreas Heisig
Original Assignee
Von Ardenne Anlagentechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne Anlagentechnik Gmbh filed Critical Von Ardenne Anlagentechnik Gmbh
Publication of PL391856A1 publication Critical patent/PL391856A1/pl
Publication of PL217715B1 publication Critical patent/PL217715B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Przedmiotem zgłoszenia jest sposób, w którym dwie przeciwległe do siebie anody są eksploatowane przemiennie jako anoda do wyładowania plazmy i jako katoda samooczyszczająca się i katoda do wyładowania plazmy jest powrotnie krótkotrwale przebiegunowywana, oraz układ zawierający katodę (3) oraz pierwszą i drugą anodę (12), które są zasilane napięciem za pomocą układu mostkowego typu H. Zasilanie prądem stałym jest zaprojektowane jako zasilanie prądem pulsacyjnym; przebiegunowanie napięcia katodowego spowodowane jest przez zasilanie prądem pulsacyjnym. W każdej chwili co najmniej jedna anoda ma potencjał dodatni, a tymczasowo podczas czasu trawienia druga anoda ma potencjał ujemny, a układ mostkowy typu H (V1 ... V4)jest tak połączony funkcjonalnie z zasilaniem prądem pulsacyjnym, że w każdej chwili co najmniej jedna anoda ma potencjał dodatni.
PL391856A 2007-09-25 2008-09-25 Sposób i układ z dwiema anodami do nadmiarowego napylania anodowego PL217715B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007045863 2007-09-25

Publications (2)

Publication Number Publication Date
PL391856A1 true PL391856A1 (pl) 2011-02-28
PL217715B1 PL217715B1 (pl) 2014-08-29

Family

ID=40260843

Family Applications (1)

Application Number Title Priority Date Filing Date
PL391856A PL217715B1 (pl) 2007-09-25 2008-09-25 Sposób i układ z dwiema anodami do nadmiarowego napylania anodowego

Country Status (5)

Country Link
US (1) US8980072B2 (pl)
CH (1) CH700002B1 (pl)
DE (1) DE112008002242B4 (pl)
PL (1) PL217715B1 (pl)
WO (1) WO2009040406A2 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010047963A1 (de) 2010-10-08 2012-04-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Magnetron-Vorrichtung und Verfahren zum gepulsten Betreiben einer Magnetron-Vorrichtung
US9595424B2 (en) * 2015-03-02 2017-03-14 Lam Research Corporation Impedance matching circuit for operation with a kilohertz RF generator and a megahertz RF generator to control plasma processes
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US9812305B2 (en) 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US10373811B2 (en) 2015-07-24 2019-08-06 Aes Global Holdings, Pte. Ltd Systems and methods for single magnetron sputtering
DE102016116762B4 (de) 2016-09-07 2021-11-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Abscheiden einer Schicht mittels einer Magnetronsputtereinrichtung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4042289A1 (de) * 1990-12-31 1992-07-02 Leybold Ag Verfahren und vorrichtung zum reaktiven beschichten eines substrats
DE4233720C2 (de) 1992-10-07 2001-05-17 Leybold Ag Einrichtung für die Verhinderung von Überschlägen in Vakuum-Zerstäubungsanlagen
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
DE4438463C1 (de) 1994-10-27 1996-02-15 Fraunhofer Ges Forschung Verfahren und Schaltung zur bipolaren pulsförmigen Energieeinspeisung in Niederdruckplasmen
US5917286A (en) 1996-05-08 1999-06-29 Advanced Energy Industries, Inc. Pulsed direct current power supply configurations for generating plasmas
DE19702187C2 (de) 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren und Einrichtung zum Betreiben von Magnetronentladungen
SE9704607D0 (sv) * 1997-12-09 1997-12-09 Chemfilt R & D Ab A method and apparatus for magnetically enhanced sputtering
US5897753A (en) * 1997-05-28 1999-04-27 Advanced Energy Industries, Inc. Continuous deposition of insulating material using multiple anodes alternated between positive and negative voltages
DE19949394A1 (de) * 1999-10-13 2001-04-19 Balzers Process Systems Gmbh Elektrische Versorgungseinheit und Verfahren zur Reduktion der Funkenbildung beim Sputtern
JP3635538B2 (ja) * 2002-07-05 2005-04-06 株式会社京三製作所 プラズマ発生用直流電源装置
EP2355126B1 (de) 2005-03-24 2015-12-02 Oerlikon Surface Solutions AG, Trübbach Hartstoffschicht
DE112006003188B4 (de) * 2005-11-04 2013-12-24 Von Ardenne Anlagentechnik Gmbh Verfahren und Anordnung zum Redundanten Anoden-Sputtern
US7517437B2 (en) * 2006-03-29 2009-04-14 Applied Materials, Inc. RF powered target for increasing deposition uniformity in sputtering systems

Also Published As

Publication number Publication date
CH700002B1 (de) 2013-03-15
US8980072B2 (en) 2015-03-17
WO2009040406A2 (de) 2009-04-02
DE112008002242A5 (de) 2010-08-26
WO2009040406A3 (de) 2009-06-04
PL217715B1 (pl) 2014-08-29
US20100230275A1 (en) 2010-09-16
DE112008002242B4 (de) 2016-01-14

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