PL392419A1 - Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych - Google Patents

Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych

Info

Publication number
PL392419A1
PL392419A1 PL392419A PL39241910A PL392419A1 PL 392419 A1 PL392419 A1 PL 392419A1 PL 392419 A PL392419 A PL 392419A PL 39241910 A PL39241910 A PL 39241910A PL 392419 A1 PL392419 A1 PL 392419A1
Authority
PL
Poland
Prior art keywords
temperature applications
conductive paste
high temperature
electronics
high current
Prior art date
Application number
PL392419A
Other languages
English (en)
Other versions
PL218232B1 (pl
Inventor
Małgorzata Jakubowska
Anna Młożniak
Mateusz Jarosz
Original Assignee
Instytut Technologii Materiałów Elektronicznych
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Technologii Materiałów Elektronicznych filed Critical Instytut Technologii Materiałów Elektronicznych
Priority to PL392419A priority Critical patent/PL218232B1/pl
Priority to EP11173430.7A priority patent/EP2441796B1/en
Priority to PL11180709T priority patent/PL2447313T3/pl
Priority to EP11180709A priority patent/EP2447313B1/en
Publication of PL392419A1 publication Critical patent/PL392419A1/pl
Publication of PL218232B1 publication Critical patent/PL218232B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Conductive Materials (AREA)

Abstract

Przedmiotem wynalazku jest pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych, mająca zastosowanie w elektronice, zwłaszcza do nanoszenia metodą sitodruku, w technologii wytwarzania warstw do zastosowań w elektronice, w tym w elektronice drukowanej i elastycznej. Pasta charakteryzuje się tym, że składa się z 80-85% wagowych nanoproszku srebra oraz 15-20% wagowych nośnika organicznego na bazie polimetakrylanu metylu.
PL392419A 2010-09-16 2010-09-16 Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych PL218232B1 (pl)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PL392419A PL218232B1 (pl) 2010-09-16 2010-09-16 Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych
EP11173430.7A EP2441796B1 (en) 2010-09-16 2011-07-11 Conductive nanosilver paste, especially for high current and high temperature applications
PL11180709T PL2447313T3 (pl) 2010-09-16 2011-09-09 Sposób srebrzenia powierzchni, zwłaszcza aluminium
EP11180709A EP2447313B1 (en) 2010-09-16 2011-09-09 Method of silvering surfaces, especially aluminium surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL392419A PL218232B1 (pl) 2010-09-16 2010-09-16 Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych

Publications (2)

Publication Number Publication Date
PL392419A1 true PL392419A1 (pl) 2012-03-26
PL218232B1 PL218232B1 (pl) 2014-10-31

Family

ID=44510732

Family Applications (1)

Application Number Title Priority Date Filing Date
PL392419A PL218232B1 (pl) 2010-09-16 2010-09-16 Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych

Country Status (2)

Country Link
EP (1) EP2441796B1 (pl)
PL (1) PL218232B1 (pl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447313A1 (en) 2010-09-16 2012-05-02 Instytut Technologii Materialów Elektronicznych Method of silvering surfaces, especially aluminium surfaces

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014037475A1 (en) * 2012-09-07 2014-03-13 Hawilko Gmbh Nano Granular Materials (NGM) material, methods and arrangements for manufacturing said material and electrical components comprising said material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075262A (en) 1990-02-21 1991-12-24 Johnson Matthey, Inc. Silver-glass pastes
US5183784A (en) 1990-02-21 1993-02-02 Johnson Matthey Inc. Silver-glass pastes
US8257795B2 (en) 2004-02-18 2012-09-04 Virginia Tech Intellectual Properties, Inc. Nanoscale metal paste for interconnect and method of use
KR100702595B1 (ko) 2005-07-22 2007-04-02 삼성전기주식회사 금속 나노 입자 및 이의 제조방법
JP4257621B2 (ja) 2007-05-16 2009-04-22 Dic株式会社 銀含有ナノ構造体の製造方法及び銀含有ナノ構造体
KR101316253B1 (ko) * 2007-06-27 2013-10-08 동우 화인켐 주식회사 도전성 페이스트 조성물, 이를 포함하는 전극 및 상기전극의 제조방법
US8158140B2 (en) 2008-10-14 2012-04-17 Eastman Kodak Company Silver polyamide composite
US7857998B2 (en) 2008-11-24 2010-12-28 E. I. Du Pont De Nemours And Company High conductivity polymer thick film silver conductor composition for use in RFID and other applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447313A1 (en) 2010-09-16 2012-05-02 Instytut Technologii Materialów Elektronicznych Method of silvering surfaces, especially aluminium surfaces

Also Published As

Publication number Publication date
EP2441796A1 (en) 2012-04-18
EP2441796B1 (en) 2017-04-19
PL218232B1 (pl) 2014-10-31

Similar Documents

Publication Publication Date Title
BR112013004884A2 (pt) pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico
WO2014200595A3 (en) Direct writing for additive manufacturing systems
EP2868424A4 (en) SOLDERING, SOLDERING PASTE AND ELECTRONIC PCB
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
EP2875898A4 (en) SOLDERING, SOLDERING PASTE AND ELECTRONIC PCB
GB2516560A (en) Superconducting quantum circuit having a resonant cavity thermalized with metal components
JP2008542840A5 (pl)
PH12015500962A1 (en) Portable electronic device body having laser perforation apertures and associated fabrication method
JP2014526795A5 (ja) プリント基板、および磁界/電流センサ
EP2860742A3 (en) Multilayer ceramic electronic component and board having the same mounted thereon
EP2886671A3 (en) Conductive paste composition and method for manufacturing electrode
EP2991162A4 (en) PCB AND WIRELESS TERMINAL WITH MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA TECHNOLOGY
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
MY189234A (en) Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device
TWI562885B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法
EP3121819A4 (en) Conductive paste, laminated ceramic component, printed circuit board, and electronic device
WO2014184102A3 (en) Method for depositing thick copper layers onto sintered materials
BR112016006975A2 (pt) revestimento protetor para padrão condutivo impresso em condutores transparentes de nanofio dotados de um padrão
EP2752880A3 (en) Graphene electronic devices and methods of manufacturing the same
EP2738799A4 (en) MULTILAYER SINTERED CERAMIC PCB AND SEMICONDUCTOR HOUSING WITH LADDER PLATE
WO2014160789A3 (en) Mobile print email reply with thumbnails
PE20160229A1 (es) Aleacion de zinc con firma electromagnetica unica y conductividad reducida
SG158064A1 (en) Integrated circuit system employing alternating conductive layers
PL403550A1 (pl) Sposób obniżania rezystancji termicznej w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych
GB201211278D0 (en) Memristor and method of manufacture thereof