PL3957459T3 - Sposób wytwarzania struktury elektromechanicznej i układ do realizacji tego sposobu - Google Patents
Sposób wytwarzania struktury elektromechanicznej i układ do realizacji tego sposobuInfo
- Publication number
- PL3957459T3 PL3957459T3 PL21203098.5T PL21203098T PL3957459T3 PL 3957459 T3 PL3957459 T3 PL 3957459T3 PL 21203098 T PL21203098 T PL 21203098T PL 3957459 T3 PL3957459 T3 PL 3957459T3
- Authority
- PL
- Poland
- Prior art keywords
- arrangement
- carrying
- manufacturing
- electromechanical structure
- electromechanical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361883484P | 2013-09-27 | 2013-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3957459T3 true PL3957459T3 (pl) | 2025-11-03 |
Family
ID=52742142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL21203098.5T PL3957459T3 (pl) | 2013-09-27 | 2014-09-25 | Sposób wytwarzania struktury elektromechanicznej i układ do realizacji tego sposobu |
Country Status (9)
| Country | Link |
|---|---|
| US (9) | US10660211B2 (pl) |
| EP (2) | EP3957459B1 (pl) |
| JP (4) | JP2016539034A (pl) |
| KR (4) | KR102539522B1 (pl) |
| CN (4) | CN117601354A (pl) |
| ES (2) | ES2900225T3 (pl) |
| PL (1) | PL3957459T3 (pl) |
| TW (1) | TWI610881B (pl) |
| WO (1) | WO2015044523A1 (pl) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102539522B1 (ko) | 2013-09-27 | 2023-06-05 | 택토텍 오와이 | 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열 |
| US20160113118A1 (en) * | 2014-09-23 | 2016-04-21 | Osram Sylvania Inc. | Formable light source and method of making |
| EP3124197B1 (en) * | 2015-07-31 | 2017-12-20 | C.R.F. Società Consortile per Azioni | Method for manufacturing a component for a motor-vehicle interior |
| EP3187322A1 (en) | 2015-12-31 | 2017-07-05 | Arjo Wiggins Fine Papers Limited | Use of printed electronics on paper to embed a circuit into plastic moulded objects |
| US10065369B2 (en) * | 2015-12-07 | 2018-09-04 | Nike, Inc. | Tunnel spring structures |
| EP3443824A4 (en) | 2016-04-13 | 2020-01-01 | TactoTek Oy | ILLUMINATED MULTILAYER STRUCTURE WITH INTEGRATED LIGHT SOURCES |
| FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
| FR3061800B1 (fr) * | 2017-01-12 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur |
| FR3069476A1 (fr) * | 2017-07-31 | 2019-02-01 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique |
| DE102017129975A1 (de) * | 2017-12-14 | 2019-06-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauteils und Halbleiterbauteil |
| US10119869B1 (en) * | 2017-12-21 | 2018-11-06 | Tactotek Oy | Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device |
| CN108556246B (zh) * | 2018-04-27 | 2020-08-18 | 滁州迪蒙德模具制造有限公司 | 一种使零件与薄膜一体成型的便捷式成型模具 |
| DE102018112649B3 (de) * | 2018-05-25 | 2019-08-08 | Uwe Beier | Eingabevorrichtung zur Steuerung eines elektronischen Gerätes und Verfahren zu ihrer Herstellung |
| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| EP3991525A1 (en) | 2019-06-28 | 2022-05-04 | Lumileds LLC | Three-dimensional light emitting appliance |
| FR3102083B1 (fr) * | 2019-10-16 | 2021-10-08 | Safran Seats | Procede de fabrication d'une piece finie |
| JP7473175B2 (ja) * | 2020-06-01 | 2024-04-23 | 国立研究開発法人産業技術総合研究所 | 立体デバイスの製造方法 |
| JP7514137B2 (ja) * | 2020-07-31 | 2024-07-10 | 株式会社日本製鋼所 | 成形方法および成形システム |
| KR102357563B1 (ko) | 2020-12-14 | 2022-02-07 | 인탑스 주식회사 | 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법 |
| KR102418622B1 (ko) | 2020-12-30 | 2022-07-07 | 인탑스 주식회사 | 가열 및 발광 기능 동시 구현 레이돔 구조 |
| KR102394587B1 (ko) | 2021-07-19 | 2022-05-06 | 인탑스 주식회사 | 다중 ime 구조 및 그 제조 방법 |
| TWI872486B (zh) * | 2022-03-23 | 2025-02-11 | 美商阿爾發金屬化工公司 | 可成形及可撓性觸覺材料及結構 |
| EP4561269A1 (en) | 2023-11-22 | 2025-05-28 | Grupo Antolin-Ingenieria, S.A. | Method for manufacturing trim panels for vehicles having an electronic function |
Family Cites Families (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850582B2 (ja) * | 1979-08-24 | 1983-11-11 | 道男 長田 | 半導体封入成形方法とその金型装置 |
| US4680079A (en) * | 1984-03-16 | 1987-07-14 | Fujitsu Limited | Printed circuit board laminating apparatus |
| US4584767A (en) * | 1984-07-16 | 1986-04-29 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
| JPS61176139A (ja) * | 1985-01-31 | 1986-08-07 | Alps Electric Co Ltd | 混成集積回路およびその製造方法 |
| US5220488A (en) * | 1985-09-04 | 1993-06-15 | Ufe Incorporated | Injection molded printed circuits |
| JPH0712111B2 (ja) * | 1985-09-04 | 1995-02-08 | ユーエフイー・インコーポレイテッド | 電気回路埋設方法及びプラスチック製品 |
| JPS63284888A (ja) | 1987-05-18 | 1988-11-22 | Furukawa Electric Co Ltd:The | 回路成形体の製造方法 |
| JPH0170349U (pl) * | 1987-10-29 | 1989-05-10 | ||
| JP2751450B2 (ja) | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | テープキャリアの実装構造及びその実装方法 |
| JP2747096B2 (ja) * | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | 3次元回路基板の製造方法 |
| JPH07500951A (ja) * | 1992-06-15 | 1995-01-26 | ディコネックス パテンテ アーゲー | 信号誘導のための超高密度配線を有するメタルクラッドラミネートを使用するプリント配線回路基板の製造方法 |
| JPH066010A (ja) * | 1992-06-19 | 1994-01-14 | Murata Mfg Co Ltd | 立体回路基板の製造方法 |
| US5264061A (en) | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
| US5780965A (en) * | 1993-12-09 | 1998-07-14 | Key Plastics, Inc. | Three dimensional electroluminescent display |
| US5758575A (en) * | 1995-06-07 | 1998-06-02 | Bemis Company Inc. | Apparatus for printing an electrical circuit component with print cells in liquid communication |
| US5979043A (en) * | 1997-07-14 | 1999-11-09 | Ford Motor Company | Method of manufacturing a circuit assembly from two or more layers of flexible film |
| JPH1158680A (ja) | 1997-08-22 | 1999-03-02 | Canon Inc | スクリーン印刷機および画像形成装置の製造方法 |
| US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
| JP2000277893A (ja) * | 1999-03-23 | 2000-10-06 | Seiko Epson Corp | 熱圧着用ヘッド及びこれを備えた熱圧着装置 |
| JP2001177224A (ja) | 1999-12-17 | 2001-06-29 | Sony Corp | 立体回路基板及びその製造方法 |
| KR20050103913A (ko) * | 2003-02-12 | 2005-11-01 | 데이꼬꾸 쓰신 고교 가부시키가이샤 | 전자부품용 보드 및 그 제조방법 |
| US7200009B2 (en) | 2003-07-01 | 2007-04-03 | Nokia Corporation | Integrated electromechanical arrangement and method of production |
| US7080787B2 (en) | 2003-07-03 | 2006-07-25 | Symbol Technologies, Inc. | Insert molded antenna |
| JP2007529889A (ja) * | 2004-03-16 | 2007-10-25 | ヴイエイチエフ・テクノロジーズ・エスエー | 二次元プロフィールを有する電気エネルギー発生モジュールおよびこれを作成する方法 |
| GB2412247B (en) | 2004-03-16 | 2007-08-22 | In2Tec Ltd | Contoured circuit boards |
| US7157309B2 (en) * | 2004-04-09 | 2007-01-02 | Tessera, Inc. | Manufacture of microelectronic fold packages |
| US7486280B2 (en) * | 2005-08-04 | 2009-02-03 | Uniplas Enterprises Pte, Ltd. | Contoured capacitive touch control panel |
| US20070069418A1 (en) | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| US20100196651A1 (en) * | 2005-09-28 | 2010-08-05 | Sipix Chemical Inc. | Mold manufacturing of an object comprising a functional element, transfering process and object |
| US20070184273A1 (en) * | 2006-02-09 | 2007-08-09 | Husky Injection Molding Systems Ltd. | Overmolding of Inserts |
| JP4857859B2 (ja) | 2006-03-30 | 2012-01-18 | 凸版印刷株式会社 | 印刷方法および薄膜トランジスタの製造方法 |
| DE102006028816B4 (de) * | 2006-06-21 | 2008-05-15 | Hansatronic Gmbh | Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten |
| FR2905198B1 (fr) | 2006-08-22 | 2008-10-17 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
| US8198979B2 (en) * | 2007-04-20 | 2012-06-12 | Ink-Logix, Llc | In-molded resistive and shielding elements |
| EP2149143A4 (en) * | 2007-04-20 | 2012-01-11 | Ink Logix Llc | ENGAGED CAPACITIVE SWITCH |
| US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
| EP2963675A1 (en) | 2008-03-05 | 2016-01-06 | The Board of Trustees of The University of Illinois | Stretchable and foldable electronic devices |
| CN101587980A (zh) | 2008-05-20 | 2009-11-25 | 李建宏 | 在机壳上形成天线的方法 |
| KR101484944B1 (ko) | 2008-10-02 | 2015-01-22 | 삼성전자 주식회사 | 전자기기 케이스 및 이의 제조방법 |
| US9545216B2 (en) * | 2011-08-05 | 2017-01-17 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| FI121862B (fi) * | 2008-10-24 | 2011-05-13 | Valtion Teknillinen | Järjestely kosketusnäyttöä varten ja vastaava valmistusmenetelmä |
| US20100151118A1 (en) * | 2008-12-17 | 2010-06-17 | Eastman Chemical Company | Carrier solvent compositions, coatings compositions, and methods to produce thick polymer coatings |
| JP2012525065A (ja) | 2009-04-21 | 2012-10-18 | モレックス インコーポレイテド | 3次元アンテナ |
| FI124221B (fi) | 2009-04-24 | 2014-05-15 | Valtion Teknillinen | Käyttäjäsyötejärjestely ja siihen liittyvä valmistusmenetelmä |
| WO2011008459A2 (en) * | 2009-06-29 | 2011-01-20 | Infinite Corridor Technology, Llc | Structured material substrates for flexible, stretchable electronics |
| FI20096062A (fi) | 2009-10-15 | 2011-04-16 | Valtion Teknillinen | Käyttöliittymäjärjestely ja menetelmä sen valmistamiseksi |
| US9090456B2 (en) * | 2009-11-16 | 2015-07-28 | Qualcomm Mems Technologies, Inc. | System and method of manufacturing an electromechanical device by printing raised conductive contours |
| JP5323668B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | 照明装置及びその製造方法 |
| CN102264198A (zh) * | 2010-05-27 | 2011-11-30 | 昆山同寅兴业机电制造有限公司 | 电子产品外壳的结构及其加工工艺 |
| EP2395572A1 (de) | 2010-06-10 | 2011-12-14 | Bayer MaterialScience AG | Schichtaufbau umfassend elektrotechnische Bauelemente |
| JPWO2012049898A1 (ja) | 2010-10-15 | 2014-02-24 | 日本電気株式会社 | 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法 |
| JP5636947B2 (ja) * | 2010-12-21 | 2014-12-10 | 日本電気株式会社 | 部品内蔵モジュール及びこれを備える電子機器 |
| EP2378846A1 (de) | 2011-01-25 | 2011-10-19 | Bayer Material Science AG | Dekorative Produktoberfläche mit Leiterplattenfunktion |
| CN102651723B (zh) | 2011-02-25 | 2015-06-10 | 澜起科技(上海)有限公司 | 基于时域训练序列的信道估计方法及系统 |
| US8804344B2 (en) * | 2011-06-10 | 2014-08-12 | Scott Moncrieff | Injection molded control panel with in-molded decorated plastic film |
| WO2013052919A2 (en) * | 2011-10-05 | 2013-04-11 | Mc10, Inc. | Cardiac catheter employing conformal electronics for mapping |
| SG191883A1 (en) * | 2011-10-18 | 2013-08-30 | Fischer Technology Pte Ltd | A method of moulding |
| US20130152386A1 (en) | 2011-12-15 | 2013-06-20 | Praveen Pandojirao-S | Methods and apparatus to form electrical interconnects on ophthalmic devices |
| US10748867B2 (en) | 2012-01-04 | 2020-08-18 | Board Of Regents, The University Of Texas System | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices |
| GB2500037A (en) | 2012-03-08 | 2013-09-11 | Tactotek Oy | An integrated light guide. |
| US9226402B2 (en) * | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| JP2013258172A (ja) * | 2012-06-11 | 2013-12-26 | Panasonic Corp | 電子部品実装システムおよび電子部品実装方法 |
| WO2014012024A2 (en) * | 2012-07-12 | 2014-01-16 | Massachusetts Institute Of Technology | Strain engineered band gaps |
| DE102012109820B4 (de) * | 2012-10-15 | 2014-09-18 | Leonhard Kurz Stiftung & Co. Kg | Durch In-Mould-Verfahren hergestellter Körper und Verfahren zu seiner Herstellung |
| US20140160692A1 (en) * | 2012-12-07 | 2014-06-12 | Pc Concepts Limited | Method for surface decoration of an object with 3-dimensional geometry and the object obtained therefrom |
| US9451714B2 (en) | 2012-12-21 | 2016-09-20 | Gurit (USA) Inc. | Housing components of handheld electronic devices |
| US20140182875A1 (en) * | 2012-12-28 | 2014-07-03 | Mark Sprenger | Case for an electronic device |
| CH708048A2 (de) | 2013-05-13 | 2014-11-14 | Abatek Internat Ag | Funktionsträger mit Tastenfunktionen. |
| KR102539522B1 (ko) * | 2013-09-27 | 2023-06-05 | 택토텍 오와이 | 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열 |
| US9335034B2 (en) * | 2013-09-27 | 2016-05-10 | Osram Sylvania Inc | Flexible circuit board for electronic applications, light source containing same, and method of making |
| US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
| TWI709481B (zh) * | 2014-08-25 | 2020-11-11 | 日商東洋紡股份有限公司 | 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法 |
| US20160282977A1 (en) * | 2015-03-23 | 2016-09-29 | Synaptics Inc. | Capacitive sensing assembly including a thin film plastic |
| KR101762807B1 (ko) * | 2016-01-28 | 2017-07-28 | 주식회사 탑앤씨 | 이차전지용 파우치필름 실링장치 |
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