PL397996A1 - Sensor pojemnosciowy do plytek obwodu drukowanego i zestaw sensora pojemnosciowego i plytki obwodu drukowanego - Google Patents

Sensor pojemnosciowy do plytek obwodu drukowanego i zestaw sensora pojemnosciowego i plytki obwodu drukowanego

Info

Publication number
PL397996A1
PL397996A1 PL397996A PL39799612A PL397996A1 PL 397996 A1 PL397996 A1 PL 397996A1 PL 397996 A PL397996 A PL 397996A PL 39799612 A PL39799612 A PL 39799612A PL 397996 A1 PL397996 A1 PL 397996A1
Authority
PL
Poland
Prior art keywords
circuit board
platform
printed circuit
capacitive sensor
support
Prior art date
Application number
PL397996A
Other languages
English (en)
Other versions
PL223023B1 (pl
Inventor
Adam Popiel
Original Assignee
Diehl Ako Stiftung & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Ako Stiftung & Co. Kg filed Critical Diehl Ako Stiftung & Co. Kg
Priority to PL397996A priority Critical patent/PL223023B1/pl
Priority to EP13000504.4A priority patent/EP2624452B1/en
Publication of PL397996A1 publication Critical patent/PL397996A1/pl
Publication of PL223023B1 publication Critical patent/PL223023B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/96076—Constructional details of capacitive touch and proximity switches with spring electrode

Landscapes

  • Geophysics And Detection Of Objects (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)

Abstract

Sensor pojemnosciowy (1) do plytek obwodu drukowanego, zawiera platforme (2) do wyczuwania obecnosci elementu poprzez plyte izolujaca. Platforma (2) jest polaczona przegubowo z co najmniej jedna sprezyscie podatna na odksztalcenie podpora (3), dostosowana do mocowania do plytki obwodów drukowanych i utrzymywania platformy (2) nad ta plytka obwodów drukowanych. Podpora (3) jest polaczona z platforma (2) poprzez polaczenie przegubowe o osi obrotu (X-X), po obu stronach której jest usytuowana czesc platformy górnej (2a, 2b) dla zapewnienia ustawienia platformy (2) na podporze (3) w dowolnie nachylonej plaszczyznie wzgledem powierzchni plytki obwodu drukowanego lub wygiecie platformy (2) po zamocowaniu sensora (1) do plytki obwodu drukowanego. Sensor pojemnosciowy (1) moze zawierac jedna lub dwie podpory (3), które sa zakonczone zaczepami (6) lub trzpieniami. Podpora (3) moze byc zamocowana na brzegach platformy (2) lub w jej srodkowym obszarze.
PL397996A 2012-02-03 2012-02-03 Sensor pojemnościowy do płytek obwodu drukowanego i zestaw sensora pojemnościowego i płytki obwodu drukowanego PL223023B1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL397996A PL223023B1 (pl) 2012-02-03 2012-02-03 Sensor pojemnościowy do płytek obwodu drukowanego i zestaw sensora pojemnościowego i płytki obwodu drukowanego
EP13000504.4A EP2624452B1 (en) 2012-02-03 2013-02-01 A capacitive sensor for printed circuit boards and set made up of capacitive sensor and a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL397996A PL223023B1 (pl) 2012-02-03 2012-02-03 Sensor pojemnościowy do płytek obwodu drukowanego i zestaw sensora pojemnościowego i płytki obwodu drukowanego

Publications (2)

Publication Number Publication Date
PL397996A1 true PL397996A1 (pl) 2013-08-05
PL223023B1 PL223023B1 (pl) 2016-09-30

Family

ID=47683493

Family Applications (1)

Application Number Title Priority Date Filing Date
PL397996A PL223023B1 (pl) 2012-02-03 2012-02-03 Sensor pojemnościowy do płytek obwodu drukowanego i zestaw sensora pojemnościowego i płytki obwodu drukowanego

Country Status (2)

Country Link
EP (1) EP2624452B1 (pl)
PL (1) PL223023B1 (pl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111413611A (zh) * 2020-05-19 2020-07-14 华侨大学 一种电路板节点性能检测平台

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4560922A1 (en) * 2023-11-27 2025-05-28 HUF Hülsbeck & Fürst GmbH & Co. KG Actuation unit for motor vehicles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2742575B1 (fr) 1995-12-19 1998-01-09 Europ Equip Menager Dispositif a touche sensitive
US6045653A (en) * 1998-07-24 2000-04-04 Xemod, Inc. Glue deposit device for power printed circuit board
TW201019199A (en) * 2008-10-04 2010-05-16 Atmel Corp Capacitive matrix touch sensor
DE102009021033A1 (de) * 2009-05-07 2010-09-16 E.G.O. Elektro-Gerätebau GmbH Bedieneinrichtung und Verfahren zur Herstellung einer Bedieneinrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111413611A (zh) * 2020-05-19 2020-07-14 华侨大学 一种电路板节点性能检测平台
CN111413611B (zh) * 2020-05-19 2024-05-17 华侨大学 一种电路板节点性能检测平台

Also Published As

Publication number Publication date
EP2624452B1 (en) 2019-01-02
PL223023B1 (pl) 2016-09-30
EP2624452A1 (en) 2013-08-07

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