ATE479903T1 - Sondenkarte - Google Patents

Sondenkarte

Info

Publication number
ATE479903T1
ATE479903T1 AT07013272T AT07013272T ATE479903T1 AT E479903 T1 ATE479903 T1 AT E479903T1 AT 07013272 T AT07013272 T AT 07013272T AT 07013272 T AT07013272 T AT 07013272T AT E479903 T1 ATE479903 T1 AT E479903T1
Authority
AT
Austria
Prior art keywords
silicon substrate
sheets
probe card
circuit board
current
Prior art date
Application number
AT07013272T
Other languages
English (en)
Inventor
Takashi Amemiya
Syuichi Tsukada
Original Assignee
Tokyo Electron Ltd
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Jsr Corp filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE479903T1 publication Critical patent/ATE479903T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT07013272T 2006-07-10 2007-07-06 Sondenkarte ATE479903T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006189723 2006-07-10
JP2007176048A JP5008005B2 (ja) 2006-07-10 2007-07-04 プローブカード

Publications (1)

Publication Number Publication Date
ATE479903T1 true ATE479903T1 (de) 2010-09-15

Family

ID=38549788

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07013272T ATE479903T1 (de) 2006-07-10 2007-07-06 Sondenkarte

Country Status (8)

Country Link
US (1) US7679385B2 (de)
EP (1) EP1879035B1 (de)
JP (1) JP5008005B2 (de)
KR (1) KR100915643B1 (de)
AT (1) ATE479903T1 (de)
DE (1) DE602007008794D1 (de)
SG (1) SG139640A1 (de)
TW (1) TW200821586A (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009139298A (ja) * 2007-12-10 2009-06-25 Tokyo Electron Ltd プローブカード
US7816932B2 (en) * 2008-02-21 2010-10-19 Teradyne, Inc. Test system with high frequency interposer
CN101971037A (zh) * 2008-03-14 2011-02-09 富士胶片株式会社 探针卡
WO2009130794A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
WO2009130793A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
KR101221079B1 (ko) 2008-05-21 2013-01-11 가부시키가이샤 어드밴티스트 시험용 웨이퍼 유닛 및 시험 시스템
JP4555362B2 (ja) * 2008-06-02 2010-09-29 株式会社アドバンテスト プローブ、電子部品試験装置及びプローブの製造方法
JP5374079B2 (ja) * 2008-06-20 2013-12-25 東京エレクトロン株式会社 検査用接触構造体
US10359145B2 (en) * 2015-09-18 2019-07-23 Ubs Business Solutions Ag Display system
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
KR102175797B1 (ko) * 2019-03-25 2020-11-06 주식회사 아이에스시 검사용 소켓
JP7471778B2 (ja) * 2019-03-29 2024-04-22 株式会社日本マイクロニクス プローブカード
JP7287849B2 (ja) * 2019-07-03 2023-06-06 デクセリアルズ株式会社 電気特性の検査冶具
US12055578B2 (en) * 2020-07-08 2024-08-06 Tektronix, Inc. Securing a probe to a device under test
TWI755919B (zh) * 2020-11-03 2022-02-21 中華精測科技股份有限公司 板狀連接器與其雙環式串接件、及晶圓測試組件
KR102541594B1 (ko) * 2020-12-23 2023-06-12 주식회사 비이링크 Mlcc 및 파인피치용 검침헤드

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
JPH0338859A (ja) 1989-07-06 1991-02-19 Toshiba Corp 大規模集積回路における配線要素のレイアウト
JP3038859B2 (ja) 1989-09-29 2000-05-08 ジェイエスアール株式会社 異方導電性シート
JPH05211202A (ja) * 1991-06-27 1993-08-20 Motorola Inc 複合フリップ・チップ半導体装置とその製造およびバーンインの方法
JP3978905B2 (ja) * 1998-11-19 2007-09-19 Ｊｓｒ株式会社 異方導電性積層体およびその製法
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6228687B1 (en) * 1999-06-28 2001-05-08 Micron Technology, Inc. Wafer-level package and methods of fabricating
US7059874B2 (en) * 2002-03-19 2006-06-13 Paricon Technologies, Inc. Anisotropic conductive elastomer based electrical interconnect with enhanced dynamic range
KR20050115297A (ko) * 2003-03-26 2005-12-07 제이에스알 가부시끼가이샤 전기 저항 측정용 커넥터, 전기 저항 측정용 커넥터 장치및 그 제조 방법 및 회로 기판의 전기 저항 측정 장치 및측정 방법
JP3726839B2 (ja) * 2004-03-31 2005-12-14 Ｊｓｒ株式会社 プローブ装置およびこのプローブ装置を具えたウエハ検査装置並びにウエハ検査方法
US7384280B2 (en) * 2004-07-15 2008-06-10 Jsr Corporation Anisotropic conductive connector and inspection equipment for circuit device
KR101167748B1 (ko) * 2004-11-12 2012-07-23 제이에스알 가부시끼가이샤 웨이퍼 검사용 탐침 부재, 웨이퍼 검사용 프로브 카드 및웨이퍼 검사 장치
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体

Also Published As

Publication number Publication date
EP1879035B1 (de) 2010-09-01
JP2008039768A (ja) 2008-02-21
TW200821586A (en) 2008-05-16
KR100915643B1 (ko) 2009-09-04
SG139640A1 (en) 2008-02-29
EP1879035A1 (de) 2008-01-16
US20080007280A1 (en) 2008-01-10
JP5008005B2 (ja) 2012-08-22
KR20080005880A (ko) 2008-01-15
US7679385B2 (en) 2010-03-16
DE602007008794D1 (de) 2010-10-14

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties