PL410445A1 - Multi-lead surface mount for BGA packages - Google Patents

Multi-lead surface mount for BGA packages

Info

Publication number
PL410445A1
PL410445A1 PL410445A PL41044514A PL410445A1 PL 410445 A1 PL410445 A1 PL 410445A1 PL 410445 A PL410445 A PL 410445A PL 41044514 A PL41044514 A PL 41044514A PL 410445 A1 PL410445 A1 PL 410445A1
Authority
PL
Poland
Prior art keywords
surface mount
lead surface
bga packages
board
printed circuit
Prior art date
Application number
PL410445A
Other languages
Polish (pl)
Other versions
PL225758B1 (en
Inventor
Konrad Futera
Wojciech Stęplewski
Original Assignee
Instytut Tele- I Radiotechniczny
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Tele- I Radiotechniczny filed Critical Instytut Tele- I Radiotechniczny
Priority to PL410445A priority Critical patent/PL225758B1/en
Publication of PL410445A1 publication Critical patent/PL410445A1/en
Publication of PL225758B1 publication Critical patent/PL225758B1/en

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Wielowyprowadzeniowa podstawka pod układy w obudowie BGA do modułowego montażu typu płytka-płytka charakteryzuje się tym, że składa się z wielowarstwowej płytki obwodu drukowanego (1) z wieloma polami montażowymi (2) pod wielowyprowadzeniowy układ w obudowie BGA z połączeniami elektrycznymi (3) i terminalami (4) ukształtowanymi w postaci otwartych otworów przelotowych metalizowanych na ich wewnętrznych powierzchniach (5), które są rozmieszone w specjalnie ukształtowanych otworach (6) na powierzchni płytki obwodu drukowanego (1).The multi-lead stand for BGA housing for modular board-to-board mounting is characterized by the fact that it consists of a multi-layer printed circuit board (1) with multiple mounting fields (2) for a multi-lead system in a BGA housing with electrical connections (3) and terminals (4) shaped as open metallized through holes on their inner surfaces (5), which are arranged in specially shaped holes (6) on the surface of the printed circuit board (1).

PL410445A 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages PL225758B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL410445A PL225758B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL410445A PL225758B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Publications (2)

Publication Number Publication Date
PL410445A1 true PL410445A1 (en) 2016-06-20
PL225758B1 PL225758B1 (en) 2017-05-31

Family

ID=56120637

Family Applications (1)

Application Number Title Priority Date Filing Date
PL410445A PL225758B1 (en) 2014-12-08 2014-12-08 Multi-lead surface mount for BGA packages

Country Status (1)

Country Link
PL (1) PL225758B1 (en)

Also Published As

Publication number Publication date
PL225758B1 (en) 2017-05-31

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