PL4117853T3 - Sposób i urządzenie do nakłuwania przedmiotu obrabianego za pomocą wiązki laserowej - Google Patents

Sposób i urządzenie do nakłuwania przedmiotu obrabianego za pomocą wiązki laserowej

Info

Publication number
PL4117853T3
PL4117853T3 PL21711220.0T PL21711220T PL4117853T3 PL 4117853 T3 PL4117853 T3 PL 4117853T3 PL 21711220 T PL21711220 T PL 21711220T PL 4117853 T3 PL4117853 T3 PL 4117853T3
Authority
PL
Poland
Prior art keywords
workpiece
cutting
laser beam
laser
Prior art date
Application number
PL21711220.0T
Other languages
English (en)
Inventor
Niklas WECKENMANN
Jannik LIND
Original Assignee
Precitec Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Precitec Gmbh & Co. Kg filed Critical Precitec Gmbh & Co. Kg
Publication of PL4117853T3 publication Critical patent/PL4117853T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PL21711220.0T 2020-03-12 2021-03-09 Sposób i urządzenie do nakłuwania przedmiotu obrabianego za pomocą wiązki laserowej PL4117853T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020106734.8A DE102020106734A1 (de) 2020-03-12 2020-03-12 Verfahren und Vorrichtung zum Einstechen in ein Werkstück mittels eines Laserstrahls
PCT/EP2021/055900 WO2021180711A1 (de) 2020-03-12 2021-03-09 Verfahren und vorrichtung zum einstechen in ein werkstück mittels eines laserstrahls

Publications (1)

Publication Number Publication Date
PL4117853T3 true PL4117853T3 (pl) 2025-09-15

Family

ID=74870826

Family Applications (1)

Application Number Title Priority Date Filing Date
PL21711220.0T PL4117853T3 (pl) 2020-03-12 2021-03-09 Sposób i urządzenie do nakłuwania przedmiotu obrabianego za pomocą wiązki laserowej

Country Status (7)

Country Link
US (1) US20230141278A1 (pl)
EP (1) EP4117853B1 (pl)
CN (1) CN115279540A (pl)
DE (1) DE102020106734A1 (pl)
ES (1) ES3036954T3 (pl)
PL (1) PL4117853T3 (pl)
WO (1) WO2021180711A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115178899B (zh) * 2022-08-26 2025-12-09 济南邦德激光股份有限公司 一种激光穿孔加工方法及数控系统
DE102023130778A1 (de) * 2023-11-07 2025-05-08 Precitec Gmbh & Co. Kg Verfahren und Vorrichtung zum Schneiden eines Werkstücks mittels eines Laserstrahls

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05111783A (ja) 1991-10-19 1993-05-07 Fanuc Ltd レーザ加工における穴明け加工方法
JPH10323781A (ja) * 1997-05-23 1998-12-08 Amada Co Ltd レーザ加工方法
JPH11145581A (ja) * 1997-11-10 1999-05-28 Hitachi Seiko Ltd プリント基板の穴明け方法および装置
JP2002331377A (ja) 2001-05-08 2002-11-19 Koike Sanso Kogyo Co Ltd レーザピアシング方法
US6784399B2 (en) * 2001-05-09 2004-08-31 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses
JP4527003B2 (ja) 2005-05-24 2010-08-18 三菱電機株式会社 レーザ加工装置
DE112009001200B4 (de) 2008-06-04 2016-03-10 Mitsubishi Electric Corp. Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung hierfür
TWI611857B (zh) * 2010-05-04 2018-01-21 伊雷克托科學工業股份有限公司 使用一系列雷射脈衝用於鑽孔之方法
EP2392429A1 (fr) * 2010-06-03 2011-12-07 Lasag Ag Procédé et installation d'usinage laser pulsé, en particulier pour le soudage, avec variation de l' apuissance de chaque impulsion laser
DE102012219196B3 (de) 2012-10-22 2014-02-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum Einstechen, Bohren oder Schneiden metallischer Werkstücke
DE102013210857B3 (de) * 2013-06-11 2014-08-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Einstechen in metallische Werkstücke mittels eines Laserstrahls
WO2016059730A1 (ja) * 2014-10-17 2016-04-21 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
US9694446B2 (en) 2014-12-01 2017-07-04 Resonetics, LLC Wall thickness compensation during laser orifice drilling
US20160199941A1 (en) * 2015-01-08 2016-07-14 General Electric Company Method and system for confined laser drilling
JP6451421B2 (ja) * 2015-03-12 2019-01-16 オムロン株式会社 接合構造体の製造方法
DE102016105560B3 (de) 2016-03-24 2017-05-11 Messer Cutting Systems Gmbh Verfahren und Vorrichtung zur Durchstich-Erkennung beim thermisch unterstützten Durchstechen eines Werkstücks
CN106799544B (zh) * 2017-01-23 2019-06-14 大族激光科技产业集团股份有限公司 激光穿孔方法
DE102018105592A1 (de) 2018-03-12 2019-09-12 Messer Cutting Systems Gmbh Verfahren zum Einstechen in ein metallisches Werkstück unter Einsatz eines Laserstrahls und Vorrichtung dafür
CN110773885B (zh) * 2019-11-05 2022-02-15 济南邦德激光股份有限公司 一种激光穿孔方法

Also Published As

Publication number Publication date
CN115279540A (zh) 2022-11-01
DE102020106734A1 (de) 2021-09-16
EP4117853A1 (de) 2023-01-18
EP4117853B1 (de) 2025-07-09
US20230141278A1 (en) 2023-05-11
ES3036954T3 (en) 2025-09-26
WO2021180711A1 (de) 2021-09-16

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