PL414778A1 - Method for modification of laminates used in manufacturing of printed circuits - Google Patents
Method for modification of laminates used in manufacturing of printed circuitsInfo
- Publication number
- PL414778A1 PL414778A1 PL414778A PL41477815A PL414778A1 PL 414778 A1 PL414778 A1 PL 414778A1 PL 414778 A PL414778 A PL 414778A PL 41477815 A PL41477815 A PL 41477815A PL 414778 A1 PL414778 A1 PL 414778A1
- Authority
- PL
- Poland
- Prior art keywords
- diaelectric
- laminate
- metal
- printed circuit
- metallization
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 8
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000012986 modification Methods 0.000 title abstract 2
- 230000004048 modification Effects 0.000 title abstract 2
- 238000001465 metallisation Methods 0.000 abstract 4
- 230000003197 catalytic effect Effects 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000006911 nucleation Effects 0.000 abstract 2
- 238000010899 nucleation Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000004408 titanium dioxide Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
Abstract
Przedmiot wynalazku pozwala na wykorzystanie laminatów stosowanych do metody subtraktywnej do przemysłowego wytwarzania obwodów drukowanych w technologii semiaddytywnej i addytywnej. Modyfikacja laminatów stosowanych do wytwarzania obwodów drukowanych polega na wykorzystaniu dwóch procesów: 1. Dodanie do żywic wchodzących w skład laminatu substancji katalitycznej, którą stanowi fotoaktywny dwutlenek tytanu lub złożone tlenki typu TiO2-MenOm w ilości nie mniej niż 10% wagowych w stosunku do wagi żywicy, korzystnie 10% do 40% wagowych. 2. Rozwinięcie powierzchni wytworzonego w procesie pierwszym laminatu o co najmniej 150%. Dla uzyskania wymaganej adhezji miedzi do diaelektrycznego podłoża wykorzystuje się proces polegający na fotoselektywnej metalizacji. Fotoselektywna metalizacja polega na osadzaniu się metalu tylko na odcinkach powierzchni diaelektryka, na których w rezultacie odziaływania światła zachodzi reakcja powstawania metali. Zasada fotoselektywnej metalizacji polega na tym, że przy naświetlaniu diaelektrycznego materiału sensibilizirowanego na działanie światła na odcinkach gdzie zachodzi absorpcja, powstają centra katalityczne, zarodki procesu nukleacji, na których w dalszej chemicznej metalizacji osadza się metal. Rezultatem takiego procesu jest powstanie na powierzchni płytki rysunku schematu składającego się z cząstek metalu. Proces tworzenia płytki obwodu drukowanego jest realizowany przy spełnieniu dwóch warunków przez zastosowane diaelektryczne podłoże, polegających na odpowiednim przygotowaniu bazowego laminatu stanowiącego podstawowy komponent do wytwarzanych płytek obwodu drukowanego. Laminat przeznaczony dla wytwarzania płytek obwodów drukowanych należy poddać dwutorowej dodatkowej obróbce w trakcie jego wytwarzania. Do znanych i stosowanych w stanie techniki diaelektrycznych laminatów lub innych materiałów w trakcie ich wytwarzania wprowadza się komponent o znacznej aktywności katalitycznej lub fotokataklitycznej, z późniejszym odpowiednim rozwinięciem powierzchni laminatu.The subject of the invention allows the use of laminates used for the subtractive method for the industrial production of printed circuits in semi-additive and additive technology. The modification of laminates used to produce printed circuits involves the use of two processes: 1. Addition to the resins of the laminate of a catalytic substance, which is photoactive titanium dioxide or complex oxides of the TiO2-MenOm type in an amount of not less than 10% by weight based on the weight of the resin , preferably 10% to 40% by weight. 2. Developing the surface of the laminate produced in the first process by at least 150%. To obtain the required copper adhesion to the diaelectric substrate, a process based on photoselective metallization is used. Photo-selective metallization involves the deposition of metal only on sections of the diaelectric surface where the metal forming reaction occurs as a result of exposure to light. The principle of photoselective metallization is that when irradiating the diaelectric material sensitized to light on the sections where absorption takes place, catalytic centers and nucleations of the nucleation process are formed, on which metal is deposited in further chemical metallisation. The result of such a process is a diagram on the surface of the drawing consisting of metal particles. The process of creating a printed circuit board is carried out under two conditions by the diaelectric substrate used, consisting in the appropriate preparation of the base laminate as the basic component for the printed circuit boards produced. Laminate intended for the production of printed circuit boards should be subjected to two-way additional processing during its manufacture. A component with significant catalytic or photocataclitic activity is introduced into the diaelectric laminates or other materials known in the art, with subsequent appropriate surface development of the laminate.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL414778A PL414778A1 (en) | 2015-11-13 | 2015-11-13 | Method for modification of laminates used in manufacturing of printed circuits |
| PCT/PL2016/000122 WO2017082744A1 (en) | 2015-11-13 | 2016-11-08 | A method for forming a laminate for a printed circuit board |
| TW105136579A TW201729656A (en) | 2015-11-13 | 2016-11-10 | A method for modification of laminates used to manufacture printed circuit boards |
| ARP160103453A AR106668A1 (en) | 2015-11-13 | 2016-11-11 | METHOD FOR MODIFICATION OF LAMINATES USED IN THE MANUFACTURE OF PRINTED CIRCUIT PLATES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL414778A PL414778A1 (en) | 2015-11-13 | 2015-11-13 | Method for modification of laminates used in manufacturing of printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL414778A1 true PL414778A1 (en) | 2017-05-22 |
Family
ID=57681709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL414778A PL414778A1 (en) | 2015-11-13 | 2015-11-13 | Method for modification of laminates used in manufacturing of printed circuits |
Country Status (4)
| Country | Link |
|---|---|
| AR (1) | AR106668A1 (en) |
| PL (1) | PL414778A1 (en) |
| TW (1) | TW201729656A (en) |
| WO (1) | WO2017082744A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116017883A (en) * | 2023-02-10 | 2023-04-25 | 上海交通大学 | A kind of aluminum nitride based copper clad laminate and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4666735A (en) * | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
| ES2168835T3 (en) | 1998-07-17 | 2002-06-16 | Procter & Gamble | METHOD TO PREPARE DETERGENT TABLETS. |
| JP2007027312A (en) * | 2005-07-14 | 2007-02-01 | Fujifilm Holdings Corp | Wiring board and its manufacturing method |
| US7468175B2 (en) | 2006-12-13 | 2008-12-23 | Worthington Technologies, Llc | Highly photosensitive titanium dioxide and process for forming the same |
| JP2010530646A (en) * | 2007-06-18 | 2010-09-09 | スティーブン リー ダットン， | Automated direct emulsion process for making printed and multilayer printed circuits. |
| US10148006B2 (en) * | 2012-09-14 | 2018-12-04 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer |
-
2015
- 2015-11-13 PL PL414778A patent/PL414778A1/en unknown
-
2016
- 2016-11-08 WO PCT/PL2016/000122 patent/WO2017082744A1/en not_active Ceased
- 2016-11-10 TW TW105136579A patent/TW201729656A/en unknown
- 2016-11-11 AR ARP160103453A patent/AR106668A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017082744A4 (en) | 2017-06-29 |
| WO2017082744A1 (en) | 2017-05-18 |
| TW201729656A (en) | 2017-08-16 |
| AR106668A1 (en) | 2018-02-07 |
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