PL414778A1 - Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych - Google Patents

Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych

Info

Publication number
PL414778A1
PL414778A1 PL414778A PL41477815A PL414778A1 PL 414778 A1 PL414778 A1 PL 414778A1 PL 414778 A PL414778 A PL 414778A PL 41477815 A PL41477815 A PL 41477815A PL 414778 A1 PL414778 A1 PL 414778A1
Authority
PL
Poland
Prior art keywords
diaelectric
laminate
metal
printed circuit
metallization
Prior art date
Application number
PL414778A
Other languages
English (en)
Inventor
Wojciech Struś
Artur Skorut
Original Assignee
Skorut Systemy Solarne Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skorut Systemy Solarne Spółka Z Ograniczoną Odpowiedzialnością filed Critical Skorut Systemy Solarne Spółka Z Ograniczoną Odpowiedzialnością
Priority to PL414778A priority Critical patent/PL414778A1/pl
Priority to PCT/PL2016/000122 priority patent/WO2017082744A1/en
Priority to TW105136579A priority patent/TW201729656A/zh
Priority to ARP160103453A priority patent/AR106668A1/es
Publication of PL414778A1 publication Critical patent/PL414778A1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)

Abstract

Przedmiot wynalazku pozwala na wykorzystanie laminatów stosowanych do metody subtraktywnej do przemysłowego wytwarzania obwodów drukowanych w technologii semiaddytywnej i addytywnej. Modyfikacja laminatów stosowanych do wytwarzania obwodów drukowanych polega na wykorzystaniu dwóch procesów: 1. Dodanie do żywic wchodzących w skład laminatu substancji katalitycznej, którą stanowi fotoaktywny dwutlenek tytanu lub złożone tlenki typu TiO2-MenOm w ilości nie mniej niż 10% wagowych w stosunku do wagi żywicy, korzystnie 10% do 40% wagowych. 2. Rozwinięcie powierzchni wytworzonego w procesie pierwszym laminatu o co najmniej 150%. Dla uzyskania wymaganej adhezji miedzi do diaelektrycznego podłoża wykorzystuje się proces polegający na fotoselektywnej metalizacji. Fotoselektywna metalizacja polega na osadzaniu się metalu tylko na odcinkach powierzchni diaelektryka, na których w rezultacie odziaływania światła zachodzi reakcja powstawania metali. Zasada fotoselektywnej metalizacji polega na tym, że przy naświetlaniu diaelektrycznego materiału sensibilizirowanego na działanie światła na odcinkach gdzie zachodzi absorpcja, powstają centra katalityczne, zarodki procesu nukleacji, na których w dalszej chemicznej metalizacji osadza się metal. Rezultatem takiego procesu jest powstanie na powierzchni płytki rysunku schematu składającego się z cząstek metalu. Proces tworzenia płytki obwodu drukowanego jest realizowany przy spełnieniu dwóch warunków przez zastosowane diaelektryczne podłoże, polegających na odpowiednim przygotowaniu bazowego laminatu stanowiącego podstawowy komponent do wytwarzanych płytek obwodu drukowanego. Laminat przeznaczony dla wytwarzania płytek obwodów drukowanych należy poddać dwutorowej dodatkowej obróbce w trakcie jego wytwarzania. Do znanych i stosowanych w stanie techniki diaelektrycznych laminatów lub innych materiałów w trakcie ich wytwarzania wprowadza się komponent o znacznej aktywności katalitycznej lub fotokataklitycznej, z późniejszym odpowiednim rozwinięciem powierzchni laminatu.
PL414778A 2015-11-13 2015-11-13 Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych PL414778A1 (pl)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PL414778A PL414778A1 (pl) 2015-11-13 2015-11-13 Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych
PCT/PL2016/000122 WO2017082744A1 (en) 2015-11-13 2016-11-08 A method for forming a laminate for a printed circuit board
TW105136579A TW201729656A (zh) 2015-11-13 2016-11-10 製造印刷電路板所使用積層板之修改方法
ARP160103453A AR106668A1 (es) 2015-11-13 2016-11-11 Método para modificación de laminados utilizados en la fabricación de placas de circuito impreso

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL414778A PL414778A1 (pl) 2015-11-13 2015-11-13 Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych

Publications (1)

Publication Number Publication Date
PL414778A1 true PL414778A1 (pl) 2017-05-22

Family

ID=57681709

Family Applications (1)

Application Number Title Priority Date Filing Date
PL414778A PL414778A1 (pl) 2015-11-13 2015-11-13 Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych

Country Status (4)

Country Link
AR (1) AR106668A1 (pl)
PL (1) PL414778A1 (pl)
TW (1) TW201729656A (pl)
WO (1) WO2017082744A1 (pl)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
DE69900736T2 (de) 1998-07-17 2002-08-29 THE PROCTER & GAMBLE COMPANY, CINCINNATI Verfahren zur Herstellung von Waschmitteltabletten
JP2007027312A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp 配線基板の製造方法および配線基板
US7468175B2 (en) 2006-12-13 2008-12-23 Worthington Technologies, Llc Highly photosensitive titanium dioxide and process for forming the same
WO2008157642A1 (en) * 2007-06-18 2008-12-24 Steven Lee Dutton Automated direct emulsion process for making printed circuits and multilayer printed circuits
WO2014042070A1 (ja) * 2012-09-14 2014-03-20 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法

Also Published As

Publication number Publication date
TW201729656A (zh) 2017-08-16
WO2017082744A4 (en) 2017-06-29
AR106668A1 (es) 2018-02-07
WO2017082744A1 (en) 2017-05-18

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