PL4286087T3 - Urządzenie do lutowania strumieniowego - Google Patents

Urządzenie do lutowania strumieniowego

Info

Publication number
PL4286087T3
PL4286087T3 PL22807415.9T PL22807415T PL4286087T3 PL 4286087 T3 PL4286087 T3 PL 4286087T3 PL 22807415 T PL22807415 T PL 22807415T PL 4286087 T3 PL4286087 T3 PL 4286087T3
Authority
PL
Poland
Prior art keywords
soldering device
stream
stream soldering
soldering
Prior art date
Application number
PL22807415.9T
Other languages
English (en)
Inventor
Hirokazu Ichikawa
Kenichi Tomitsuka
Original Assignee
Senju Metal Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd. filed Critical Senju Metal Industry Co., Ltd.
Publication of PL4286087T3 publication Critical patent/PL4286087T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL22807415.9T 2021-05-14 2022-05-09 Urządzenie do lutowania strumieniowego PL4286087T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021082656A JP7141001B1 (ja) 2021-05-14 2021-05-14 噴流はんだ付け装置
PCT/JP2022/019615 WO2022239713A1 (ja) 2021-05-14 2022-05-09 噴流はんだ付け装置

Publications (1)

Publication Number Publication Date
PL4286087T3 true PL4286087T3 (pl) 2026-03-23

Family

ID=83360852

Family Applications (1)

Application Number Title Priority Date Filing Date
PL22807415.9T PL4286087T3 (pl) 2021-05-14 2022-05-09 Urządzenie do lutowania strumieniowego

Country Status (8)

Country Link
US (2) US20230390846A1 (pl)
EP (1) EP4286087B1 (pl)
JP (1) JP7141001B1 (pl)
KR (1) KR102707866B1 (pl)
CN (1) CN116636317B (pl)
PL (1) PL4286087T3 (pl)
TW (1) TW202306454A (pl)
WO (1) WO2022239713A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7332971B1 (ja) * 2023-01-10 2023-08-24 千住金属工業株式会社 はんだ処理装置
JP7667487B1 (ja) * 2023-12-26 2025-04-23 千住金属工業株式会社 噴流はんだ付け装置
US20260001154A1 (en) * 2024-06-27 2026-01-01 Schweitzer Engineering Laboratories, Inc. Wave height control for wave soldering

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
JPS5268050A (en) * 1975-12-04 1977-06-06 Matsushita Electric Industrial Co Ltd Flow type soldering device
US4101066A (en) * 1977-08-31 1978-07-18 Western Electric Co., Inc. Soldering method and apparatus utilizing dual solder waves of different variable velocities
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
US4529116A (en) * 1983-04-28 1985-07-16 At&T Technologies, Inc. Methods of and devices for determining the soldering capability of a solder wave
US4530458A (en) * 1983-12-16 1985-07-23 Nihon Den-Netsu Keiki Co., Ltd Soldering apparatus
USRE33197E (en) * 1985-05-03 1990-04-10 Electrover Limited Vibrator wave soldering
JPH022540Y2 (pl) * 1986-06-26 1990-01-22
JPS63281768A (ja) * 1987-05-13 1988-11-18 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
FR2638051B1 (fr) * 1988-10-13 1990-12-28 Sagem Procede de soudage a la vague et machine pour la mise en oeuvre du procede
DE4132582A1 (de) * 1991-09-30 1993-04-01 Wls Karl Heinz Grasmann Weichl Vorrichtung zum loeten von flachbaugruppen
GB9121003D0 (en) * 1991-10-03 1991-11-13 Boc Group Plc Soldering
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
NL9200060A (nl) * 1992-01-14 1993-08-02 Soltec Bv Soldeermachine met verbeterde configuratie van soldeerstromen.
US5156324A (en) * 1992-03-17 1992-10-20 Electrovert Lgd Solder apparatus with dual hollow wave nozzles
JPH07202409A (ja) * 1993-12-29 1995-08-04 Sony Corp フロー半田付け装置
JPH08309519A (ja) * 1995-05-23 1996-11-26 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH08335773A (ja) * 1995-06-05 1996-12-17 Erekutorobaato Seitetsuku Kk ウェーブはんだ付装置
JP2000340941A (ja) * 1999-05-27 2000-12-08 Matsushita Electric Ind Co Ltd はんだ付け装置
JP3547377B2 (ja) * 1999-11-01 2004-07-28 松下電器産業株式会社 半田噴流装置および半田付け方法
DE60140769D1 (de) * 2000-09-26 2010-01-21 Panasonic Corp Schwallötvorrichtung und -methode
JP3939109B2 (ja) * 2001-04-12 2007-07-04 日本電熱計器株式会社 はんだ付け装置
KR20060060344A (ko) * 2004-11-30 2006-06-05 삼성전자주식회사 노즐 일체형 자동납땜기
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
JP5434763B2 (ja) 2010-04-09 2014-03-05 千住金属工業株式会社 噴流はんだ付け装置
JP6593400B2 (ja) * 2017-08-04 2019-10-23 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
JP2019141862A (ja) * 2018-02-16 2019-08-29 三菱電機株式会社 状態計測装置および噴流式はんだ付け装置の調整方法
US11389888B2 (en) * 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Also Published As

Publication number Publication date
US20230390846A1 (en) 2023-12-07
EP4286087A4 (en) 2024-09-04
KR102707866B1 (ko) 2024-09-23
KR20230088504A (ko) 2023-06-19
EP4286087B1 (en) 2025-12-03
EP4286087A1 (en) 2023-12-06
JP7141001B1 (ja) 2022-09-22
JP2022175889A (ja) 2022-11-25
WO2022239713A1 (ja) 2022-11-17
TW202306454A (zh) 2023-02-01
CN116636317B (zh) 2024-10-01
CN116636317A (zh) 2023-08-22
US20250256342A1 (en) 2025-08-14

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