PL4332144T3 - Jednoskładnikowa (1K) utwardzalna kompozycja klejowa - Google Patents

Jednoskładnikowa (1K) utwardzalna kompozycja klejowa

Info

Publication number
PL4332144T3
PL4332144T3 PL22193895.4T PL22193895T PL4332144T3 PL 4332144 T3 PL4332144 T3 PL 4332144T3 PL 22193895 T PL22193895 T PL 22193895T PL 4332144 T3 PL4332144 T3 PL 4332144T3
Authority
PL
Poland
Prior art keywords
component
adhesive composition
curable adhesive
curable
composition
Prior art date
Application number
PL22193895.4T
Other languages
English (en)
Inventor
Stefanie Stapf
Uta Sundermeier
Fanny Provot
Original Assignee
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa filed Critical Henkel Ag & Co. Kgaa
Publication of PL4332144T3 publication Critical patent/PL4332144T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/372—Sulfides, e.g. R-(S)x-R'
    • C08K5/3725—Sulfides, e.g. R-(S)x-R' containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PL22193895.4T 2022-09-05 2022-09-05 Jednoskładnikowa (1K) utwardzalna kompozycja klejowa PL4332144T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP22193895.4A EP4332144B1 (en) 2022-09-05 2022-09-05 One component (1k) curable adhesive composition

Publications (1)

Publication Number Publication Date
PL4332144T3 true PL4332144T3 (pl) 2025-10-13

Family

ID=87696164

Family Applications (1)

Application Number Title Priority Date Filing Date
PL22193895.4T PL4332144T3 (pl) 2022-09-05 2022-09-05 Jednoskładnikowa (1K) utwardzalna kompozycja klejowa

Country Status (10)

Country Link
US (1) US20250197700A1 (pl)
EP (1) EP4332144B1 (pl)
JP (1) JP2025529293A (pl)
KR (1) KR20250065599A (pl)
CN (1) CN119790090A (pl)
ES (1) ES3034838T3 (pl)
PL (1) PL4332144T3 (pl)
PT (1) PT4332144T (pl)
TW (1) TW202421751A (pl)
WO (1) WO2024052060A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024079548A1 (en) 2022-10-10 2024-04-18 3M Innovative Properties Company Electrically debondable uv activated adhesives
EP4644500A1 (en) 2024-04-30 2025-11-05 Henkel AG & Co. KGaA Two-component (2k) curable adhesive composition

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3113708A (en) 1961-08-09 1963-12-10 Jr William E Moulic Magnetic tape drive mechanism and control therefor
DE1593791A1 (de) 1966-05-04 1970-10-01 Ciba Geigy Latente Haerter und stabile hitzegehaertete Epoxydmassen
US3535342A (en) 1968-02-07 1970-10-20 Dow Chemical Co Process for making alkylene carbonates
US3855040A (en) 1972-07-03 1974-12-17 Loctite Corp Anaerobic compositions
US4250311A (en) 1974-05-02 1981-02-10 General Electric Company P, As, and Sb hexafluoride onium salts as photoinitiators
GB1512982A (en) 1974-05-02 1978-06-01 Gen Electric Salts
IT1034323B (it) 1975-03-17 1979-09-10 Anic Spa Procedimento per la preparazione di alchilencarbonati
US4171240A (en) 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4216288A (en) 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
GB8307613D0 (en) 1983-03-18 1983-04-27 Bp Chem Int Ltd Carbonates
JPS6072917A (ja) 1983-09-30 1985-04-25 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
DE3529263A1 (de) 1985-08-16 1987-02-19 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
US4990281A (en) 1985-08-30 1991-02-05 Loctite Corporation Adhesion promoting primer activator for an anaerobic compositions
US4731146A (en) 1985-08-30 1988-03-15 Loctite Corporation Adhesion promoting primer activator for anaerobic compositions
DE3600602A1 (de) 1986-01-11 1987-07-16 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
US4729797A (en) 1986-12-31 1988-03-08 International Business Machines Corporation Process for removal of cured epoxy
DE3750166T2 (de) 1987-08-26 1995-02-23 Asahi Chemical Ind Härtemittel für ein härtbares Eintopfepoxidharzsystem.
IE891601L (en) 1989-05-18 1990-11-18 Loctite Ireland Ltd Latent hardeners for epoxy resin compositions
US5650261A (en) 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US5124417A (en) 1990-02-12 1992-06-23 Minnesota Mining And Manufacturing Company Initiators for cationic polymerization
US5084586A (en) 1990-02-12 1992-01-28 Minnesota Mining And Manufacturing Company Novel initiators for cationic polymerization
JPH051225A (ja) 1991-06-25 1993-01-08 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
US5554664A (en) 1995-03-06 1996-09-10 Minnesota Mining And Manufacturing Company Energy-activatable salts with fluorocarbon anions
US5811473A (en) 1996-04-02 1998-09-22 Loctite Corporation Primer activator composition for anaerobic adhesives
US7332218B1 (en) 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20080196828A1 (en) 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
IE20000440A1 (en) 2000-05-31 2003-04-02 Loctite R & D Ltd Semi-Solid one- or two-part compositions
JP4752131B2 (ja) 2001-05-16 2011-08-17 味の素株式会社 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
US20040204551A1 (en) 2003-03-04 2004-10-14 L&L Products, Inc. Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
US20070269659A1 (en) 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
JP5248791B2 (ja) 2007-03-07 2013-07-31 株式会社Ａｄｅｋａ エポキシ樹脂用硬化剤組成物及びそれを用いた硬化性エポキシ樹脂組成物
GB2502554B (en) 2012-05-30 2016-02-03 Henkel Ireland Ltd Primers
US20140287299A1 (en) 2013-03-25 2014-09-25 Apple Inc. Heat-Debonding Adhesives
EP3199564A1 (en) 2013-04-05 2017-08-02 Air Products And Chemicals, Inc. One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes
EP3199344B1 (en) 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
ES2948014T3 (es) 2019-12-13 2023-08-25 Henkel Ag & Co Kgaa Composición adhesiva curable de un componente (1K)
ES2973449T3 (es) * 2019-12-13 2024-06-20 Henkel Ag & Co Kgaa Composición adhesiva curable de dos componentes (2K)

Also Published As

Publication number Publication date
KR20250065599A (ko) 2025-05-13
TW202421751A (zh) 2024-06-01
CN119790090A (zh) 2025-04-08
US20250197700A1 (en) 2025-06-19
WO2024052060A1 (en) 2024-03-14
JP2025529293A (ja) 2025-09-04
ES3034838T3 (en) 2025-08-25
EP4332144A1 (en) 2024-03-06
PT4332144T (pt) 2025-07-09
EP4332144B1 (en) 2025-06-04

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