PT100444A - Processo para a fabricacao de componentes magneticos compositod monoliticos contendo varias camadas - Google Patents

Processo para a fabricacao de componentes magneticos compositod monoliticos contendo varias camadas Download PDF

Info

Publication number
PT100444A
PT100444A PT100444A PT10044492A PT100444A PT 100444 A PT100444 A PT 100444A PT 100444 A PT100444 A PT 100444A PT 10044492 A PT10044492 A PT 10044492A PT 100444 A PT100444 A PT 100444A
Authority
PT
Portugal
Prior art keywords
ferrite
ferrite powder
manufacture
magnetic
preparing
Prior art date
Application number
PT100444A
Other languages
English (en)
Inventor
Gideon S Grader
David Wikfred Johnson Jr
Apurba Roy
John Thomson Jr
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Publication of PT100444A publication Critical patent/PT100444A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Hard Magnetic Materials (AREA)

Claims (1)

  1. la. Processo para a fabricação de componentes magnéticos compósitos monolíticos contendo várias camadas, que compreendem pelo menos dois materiais diferentes, cada um constituído por uma matriz de ferrite, em que os materiais de ferrite têm a fórmula M-, , Fe~ 0. , caracterizado pelo facto de compreender as operações que consistem em preparar um material magnético mediante a preparação de um primeiro pó de ferrite duma composição de ferrite que é substancialmente de MnZn, adequada para proporcionar uma permeabilidade relativamente elevada numa primeira matriz de ferrite resultante, compreendendo as operações que consistem em preparar um material isolador não magnético mediante a obtenção de um segundo pó, de ferrite duma composição que é substancialmente ferrite de Ni adequada para proporcionar uma elevada resistibilidade e uma pequena permeabilidade numa segunda matriz de ferrite resultante, adicionando um óxido de cobre ao segundo pó de ferrite numa quantidade que pode variar entre 1% em ' moles e 10% em moles em 3
    relação à quantidade total do segundo pó de ferrite, de forma que o segundo pó de ferrite possui uma velocidade de sinterização e uma temperatura de sinterização substancialmente idênticas às do primeiro pó de ferrite; adicionar e misturar o primeiro pó de ferrite a um material de ligação orgânico e transformar a mistura resultante numa primeira fita cerâmica; adicionar e misturar o segundo pó de ferrite a um material de ligação orgânico e transformar a mistura resultante numa segunda fita cerâmica; formar uma estrutura em camadas com as diferentes camadas da primeira e da segunda fita cerâmicas; laminar a estrutura em camadas por aplicação duma pressão à citada estrutura; cozer a referida estrutura laminada ; sinterizar a estrutura resultante numa temperatura superior a 80Ò°C para produzir um produto sinterizado tendo dois materiais de matriz de ferrite numa única estrutura compósita; e arrefecer a .estrutura compósita monolítica para formar o componente magnético compósito sólito. 2a. Processo para a fabricação de um componente magnético compósito sólido, de acordo com a reivindicação 1, caracterizado pelo facto de compreender as. operações adicionais que consistem em
    ο
    definir diferentes camadas de fita com camadas especificadas tendo determinadas aberturas definidas; e formar aberturas dentro das diferentes camadas de fitas, de tal maneira que as aberturas formam uma estrutura geométrica adequada para um núcleo magnético e ejn que aS coberturas são cheias com um material que compreende o primeiro pó de ferrite. 3a. Processo para a fabricação de um componente magnético compósito sólido de acordo com a reivindicação 1, caracterizado pelo facto de compreender as seguintes operações adicionais que consistem em definir diferentes camadas de fitas, tendo as camadas especificas da primeira fita determinadas aberturas nelas definidas: e formar, dentro das camadas da primeira fita, uma estrutura geométrica apropriada para um núcleo magnético e encher as citadas aberturas com um material não -magnético isolador que compreende o segundo pó de ferrite. 4a. Processo para. a fabricação de um componente magnético compósito sólido de acordo com as reivindicações 2 ou 3, caracterizado pelo facto de compreender as operações adicionais que consistem em imprimir desenhos de condutores nas diferentes camadas de fitas que compreendem o segundo pó de ferrite, dé maneira
    que, quando se forma a estrutura em camadas, os desenhos de 'condutores formam um enrolamento que envolve pelo menos um troço da estrutura geométrica do núcleo magnético. 5a. Processo para a fabricação de um componente ipagnético compósito sólido de acordo com as reivindicações 2 ou 3, caracterizado pelo facto de compreender ainda a operação que consiste em preparar um material não magnético isolador e compreende a adição de um óxido de Mn ao segundo pó de ferrite, para aumentar a sua resistibilidade e ainda reduzir a sua permeabilidade. 6a. Processo para a fabricação de componentes magnéticos compósitos sólidos de acordo com as reivindicações 2 ou 3, caracterizado pelo facto de compreender ainda a operação que consiste em preparar um material não magnético isolador e compreende a adição de um óxido de Zr ao segundo pó de ferrite, para aumentar a sua resistibilidade e ainda reduzir a sua permeabilidade. 7a. Processo para a fabricação de componentes magnéticos compósitos sólidos de acordo com a reivindicação 2, caracterizado pelo facto de compreender ainda a operação que consiste em preparar um material magnético que compreende a adição e a mistura do pçimeiro pó de ferrite * > * >
    com um agente de ligação orgânico e a transformação da mistura resultante numa segunda fita cerâmica. 8a. Processo para·a fabricação de componentes magnéticos compósitos sólidos de acordo com a reivindiçação 3, caracterizado pelo facto de compreender ainda a operação que consiste em preparar um material não magnético isolador que compreende a adição e a mistura do segundo pó de ferrite com um agente de ligação orgânico, e a transformação da mistura resultante numa pasta cerâmica. Lisboa, 30 de Abril de 1992 O Agente Oficial da Propriedade Industrial
    AMÉRICO DA SILVA CARVALHO Agente Oficial de Propriedade Industrial Rua Marquês de Fronteira, N.° )27-2,° ÍOOO LISBOA
PT100444A 1991-05-02 1992-04-30 Processo para a fabricacao de componentes magneticos compositod monoliticos contendo varias camadas PT100444A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,653 US5349743A (en) 1991-05-02 1991-05-02 Method of making a multilayer monolithic magnet component

Publications (1)

Publication Number Publication Date
PT100444A true PT100444A (pt) 1994-04-29

Family

ID=24793921

Family Applications (1)

Application Number Title Priority Date Filing Date
PT100444A PT100444A (pt) 1991-05-02 1992-04-30 Processo para a fabricacao de componentes magneticos compositod monoliticos contendo varias camadas

Country Status (14)

Country Link
US (2) US5349743A (pt)
EP (1) EP0512718B1 (pt)
JP (1) JP2637332B2 (pt)
KR (1) KR920022325A (pt)
AU (1) AU654348B2 (pt)
CA (1) CA2067008C (pt)
DE (1) DE69202097T2 (pt)
ES (1) ES2071433T3 (pt)
FI (1) FI921968L (pt)
HK (1) HK81296A (pt)
IL (1) IL101736A (pt)
MX (1) MX9201989A (pt)
PT (1) PT100444A (pt)
TW (1) TW198120B (pt)

Families Citing this family (170)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239744A (en) 1992-01-09 1993-08-31 At&T Bell Laboratories Method for making multilayer magnetic components
JPH06164222A (ja) * 1992-11-25 1994-06-10 Murata Mfg Co Ltd マイクロ波用磁性体及びその製造方法
US5389428A (en) * 1992-12-08 1995-02-14 At&T Corp. Sintered ceramic components and method for making same
JP3158757B2 (ja) * 1993-01-13 2001-04-23 株式会社村田製作所 チップ型コモンモードチョークコイル及びその製造方法
US5525941A (en) * 1993-04-01 1996-06-11 General Electric Company Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure
US5430613A (en) * 1993-06-01 1995-07-04 Eaton Corporation Current transformer using a laminated toroidal core structure and a lead frame
JP2656000B2 (ja) * 1993-08-31 1997-09-24 日立金属株式会社 ストリップライン型高周波部品
JP3116713B2 (ja) * 1994-03-31 2000-12-11 株式会社村田製作所 インダクタ内蔵電子部品
US5575932A (en) * 1994-05-13 1996-11-19 Performance Controls, Inc. Method of making densely-packed electrical conductors
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
TW265450B (en) * 1994-06-30 1995-12-11 At & T Corp Devices using metallized magnetic substrates
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
US6362713B1 (en) * 1994-10-19 2002-03-26 Taiyo Yuden Kabushiki Kaisha Chip inductor, chip inductor array and method of manufacturing same
JP3152088B2 (ja) * 1994-11-28 2001-04-03 株式会社村田製作所 コイル部品の製造方法
DE4442994A1 (de) * 1994-12-02 1996-06-05 Philips Patentverwaltung Planare Induktivität
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5661882A (en) * 1995-06-30 1997-09-02 Ferro Corporation Method of integrating electronic components into electronic circuit structures made using LTCC tape
JP3127792B2 (ja) 1995-07-19 2001-01-29 株式会社村田製作所 Lc共振器およびlcフィルタ
US5610569A (en) * 1996-01-31 1997-03-11 Hughes Electronics Staggered horizontal inductor for use with multilayer substrate
US5852866A (en) * 1996-04-04 1998-12-29 Robert Bosch Gmbh Process for producing microcoils and microtransformers
FR2749989B1 (fr) * 1996-06-17 1998-07-24 Commissariat Energie Atomique Dispositif d'alimentation impulsionnelle a reseau de bobinages
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
JP3097569B2 (ja) * 1996-09-17 2000-10-10 株式会社村田製作所 積層チップインダクタの製造方法
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
JPH1140915A (ja) * 1997-05-22 1999-02-12 Nec Corp プリント配線板
US5880662A (en) * 1997-08-21 1999-03-09 Dale Electronics, Inc. High self resonant frequency multilayer inductor and method for making same
US6246311B1 (en) * 1997-11-26 2001-06-12 Vlt Corporation Inductive devices having conductive areas on their surfaces
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
US6169801B1 (en) 1998-03-16 2001-01-02 Midcom, Inc. Digital isolation apparatus and method
US6008102A (en) * 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
US6696746B1 (en) 1998-04-29 2004-02-24 Micron Technology, Inc. Buried conductors
US6025261A (en) 1998-04-29 2000-02-15 Micron Technology, Inc. Method for making high-Q inductive elements
US6054914A (en) * 1998-07-06 2000-04-25 Midcom, Inc. Multi-layer transformer having electrical connection in a magnetic core
US6162311A (en) * 1998-10-29 2000-12-19 Mmg Of North America, Inc. Composite magnetic ceramic toroids
US6566731B2 (en) * 1999-02-26 2003-05-20 Micron Technology, Inc. Open pattern inductor
US6278269B1 (en) 1999-03-08 2001-08-21 Allegro Microsystems, Inc. Magnet structure
GB2348321A (en) * 1999-03-23 2000-09-27 Mitel Semiconductor Ltd A laminated transformer and a method of its manufacture
US6198374B1 (en) 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
KR100349419B1 (ko) * 1999-07-27 2002-08-19 학교법인 한국정보통신학원 이중 나선형 인덕터 구조
US6470545B1 (en) * 1999-09-15 2002-10-29 National Semiconductor Corporation Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
JP2001160636A (ja) * 1999-09-20 2001-06-12 Denso Corp 圧電素子
JP2001102217A (ja) * 1999-09-30 2001-04-13 Tdk Corp コイル装置
US6413339B1 (en) * 1999-12-22 2002-07-02 International Business Machines Corporation Low temperature sintering of ferrite materials
US6704277B1 (en) 1999-12-29 2004-03-09 Intel Corporation Testing for digital signaling
DE10002377A1 (de) 2000-01-20 2001-08-02 Infineon Technologies Ag Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung
US6674355B2 (en) 2000-05-19 2004-01-06 M-Flex Multi-Fineline Electronix, Inc. Slot core transformers
US6374481B1 (en) * 2000-06-28 2002-04-23 Texas Instruments Incorporated Method for making microactuator for use in mass data storage devices
US6655002B1 (en) * 2000-06-28 2003-12-02 Texas Instruments Incorporated Microactuator for use in mass data storage devices, or the like, and method for making same
AU2001294646A1 (en) * 2000-09-22 2002-04-02 M-Flex Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
JP3449350B2 (ja) * 2000-11-09 2003-09-22 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
JP3449351B2 (ja) * 2000-11-09 2003-09-22 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
US6587025B2 (en) * 2001-01-31 2003-07-01 Vishay Dale Electronics, Inc. Side-by-side coil inductor
JP2002373810A (ja) * 2001-06-14 2002-12-26 Tdk Corp チップ型コモンモードチョークコイル
US6667536B2 (en) * 2001-06-28 2003-12-23 Agere Systems Inc. Thin film multi-layer high Q transformer formed in a semiconductor substrate
US6911889B2 (en) * 2001-08-20 2005-06-28 Steward, Inc. High frequency filter device and related methods
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US6914513B1 (en) 2001-11-08 2005-07-05 Electro-Science Laboratories, Inc. Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components
US6624515B1 (en) 2002-03-11 2003-09-23 Micron Technology, Inc. Microelectronic die including low RC under-layer interconnects
US9919472B1 (en) * 2002-05-07 2018-03-20 Microfabrica Inc. Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
KR100479625B1 (ko) * 2002-11-30 2005-03-31 주식회사 쎄라텍 칩타입 파워인덕터 및 그 제조방법
JP3827314B2 (ja) * 2003-03-17 2006-09-27 Tdk株式会社 インダクティブデバイスの製造方法
JP4514031B2 (ja) * 2003-06-12 2010-07-28 株式会社デンソー コイル部品及びコイル部品製造方法
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
JP2005150168A (ja) * 2003-11-11 2005-06-09 Murata Mfg Co Ltd 積層コイル部品
JP4479353B2 (ja) * 2004-05-28 2010-06-09 株式会社村田製作所 積層型電子部品
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
KR101165116B1 (ko) 2004-12-07 2012-07-12 멀티-파인라인 일렉트로닉스, 인크. 소형 회로와 유도 소자 및 그 생산 방법
US7158005B2 (en) * 2005-02-10 2007-01-02 Harris Corporation Embedded toroidal inductor
JP4873522B2 (ja) * 2005-05-10 2012-02-08 Fdk株式会社 積層インダクタ
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Tdk株式会社 電子部品及びその製造方法
JP4530044B2 (ja) * 2005-12-29 2010-08-25 株式会社村田製作所 積層コイル部品
US7875955B1 (en) 2006-03-09 2011-01-25 National Semiconductor Corporation On-chip power inductor
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
DE102006022785A1 (de) * 2006-05-16 2007-11-22 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bau-elements
US7340825B2 (en) * 2006-07-06 2008-03-11 Harris Corporation Method of making a transformer
US7449987B2 (en) 2006-07-06 2008-11-11 Harris Corporation Transformer and associated method of making
CN101568978B (zh) * 2007-02-02 2012-05-23 株式会社村田制作所 层叠线圈器件
JP4867698B2 (ja) * 2007-02-20 2012-02-01 Tdk株式会社 薄膜磁気デバイス及びこれを有する電子部品モジュール
US7733207B2 (en) * 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
DE102007028239A1 (de) 2007-06-20 2009-01-02 Siemens Ag Monolithisches induktives Bauelement, Verfahren zum Herstellen des Bauelements und Verwendung des Bauelements
DE102007028240B3 (de) * 2007-06-20 2008-12-04 Siemens Ag Verfahren zum Herstellen eines keramischen Mehrschichtkörpers mit lateral strukturierter Keramiklage
JP2009027033A (ja) * 2007-07-20 2009-02-05 Tdk Corp 積層型複合電子部品
JP4877152B2 (ja) * 2007-08-22 2012-02-15 株式会社村田製作所 巻線型電子部品
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
JP2009239159A (ja) * 2008-03-28 2009-10-15 Toko Inc 積層型電子部品及びその製造方法
DE102008034691A1 (de) 2008-07-01 2010-03-04 Siemens Aktiengesellschaft Keramischer Mehrschichtkörper, Induktives Bauelement mit dem Mehrschichtkörper und Verfahren zum Herstellen des Mehrschichtkörpers
US8525294B2 (en) * 2008-09-18 2013-09-03 Renesas Electronics Corporation Semiconductor device
US8446243B2 (en) * 2008-10-31 2013-05-21 Infineon Technologies Austria Ag Method of constructing inductors and transformers
JP5190331B2 (ja) * 2008-11-14 2013-04-24 東光株式会社 電子部品及びその製造方法
SE534510C2 (sv) * 2008-11-19 2011-09-13 Silex Microsystems Ab Funktionell inkapsling
CN102232233A (zh) * 2008-12-03 2011-11-02 株式会社村田制作所 电子部件
KR20110048717A (ko) * 2009-11-03 2011-05-12 주식회사 이엠따블유 자성체 복합물 및 그 제조방법
US9999129B2 (en) * 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
CN102741956B (zh) * 2010-02-01 2014-08-20 株式会社村田制作所 电子部件的制造方法
US8068004B1 (en) * 2010-02-03 2011-11-29 Xilinx, Inc. Embedded inductor
CN101777413A (zh) * 2010-02-11 2010-07-14 深圳顺络电子股份有限公司 一种ltcc低温共烧陶瓷功率电感器
EP2544200B1 (en) * 2010-03-05 2020-08-26 Murata Manufacturing Co., Ltd. Ceramic electronic component and method for producing ceramic electronic component
US20110291788A1 (en) * 2010-05-26 2011-12-01 Tyco Electronics Corporation Planar inductor devices
US8513771B2 (en) 2010-06-07 2013-08-20 Infineon Technologies Ag Semiconductor package with integrated inductor
ES2711352T3 (es) 2010-06-11 2019-05-03 Ricoh Co Ltd Dispositivo de almacenamiento de información, dispositivo extraíble, contenedor de revelador y aparato de formación de imágenes
WO2012111203A1 (ja) * 2011-02-15 2012-08-23 株式会社村田製作所 積層型インダクタ素子
US8823133B2 (en) 2011-03-29 2014-09-02 Xilinx, Inc. Interposer having an inductor
DE102011112826B4 (de) * 2011-05-23 2020-06-18 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor und Verfahren zur Herstellung des Sensors
US9406738B2 (en) 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
KR101504798B1 (ko) * 2011-09-05 2015-03-23 삼성전기주식회사 자성체 기판, 커먼모드필터, 자성체 기판 제조방법 및 커먼모드필터 제조방법
DE102012213263A1 (de) * 2011-09-20 2013-03-21 Robert Bosch Gmbh Handwerkzeugvorrichtung mit zumindest einer Ladespule
US9330823B1 (en) 2011-12-19 2016-05-03 Xilinx, Inc. Integrated circuit structure with inductor in silicon interposer
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement
DE102012003364A1 (de) 2012-02-22 2013-08-22 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager
US9337138B1 (en) 2012-03-09 2016-05-10 Xilinx, Inc. Capacitors within an interposer coupled to supply and ground planes of a substrate
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
JP5598492B2 (ja) 2012-03-30 2014-10-01 Tdk株式会社 積層コイル部品
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
KR101367952B1 (ko) * 2012-05-30 2014-02-28 삼성전기주식회사 적층형 전자부품용 비자성체 조성물, 이를 이용한 적층형 전자부품 및 이의 제조방법
US8754500B2 (en) * 2012-08-29 2014-06-17 International Business Machines Corporation Plated lamination structures for integrated magnetic devices
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
GB2529235B (en) 2014-08-14 2019-05-08 Murata Manufacturing Co An embedded magnetic component device
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
KR20160126751A (ko) * 2015-04-24 2016-11-02 삼성전기주식회사 코일 전자부품 및 그 제조방법
FR3045921B1 (fr) * 2015-12-17 2019-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit a inductance integrant une fonction de gestion thermique passive
DE102016203613A1 (de) * 2016-03-04 2017-09-07 Würth Elektronik GmbH & Co. KG Elektronisches Bauelement und Verfahren zu dessen Herstellung
US10636560B2 (en) 2016-03-11 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Induction based current sensing
US10566409B2 (en) * 2016-05-10 2020-02-18 Dumitru Nicolae LESENCO Integrated quantized inductor and fabrication method thereof
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
JP6562158B2 (ja) * 2016-09-09 2019-08-21 株式会社村田製作所 積層トロイダルコイルおよびその製造方法
JP6830347B2 (ja) * 2016-12-09 2021-02-17 太陽誘電株式会社 コイル部品
US10984939B2 (en) * 2017-01-30 2021-04-20 Tdk Corporation Multilayer coil component
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10483343B2 (en) * 2017-06-16 2019-11-19 Huawei Technologies Co., Ltd. Inductors for chip to chip near field communication
JP6984212B2 (ja) 2017-07-28 2021-12-17 Tdk株式会社 コイル部品
CN108155888A (zh) * 2018-01-05 2018-06-12 北京航天微电科技有限公司 一种用于抑制电源电磁干扰的ltcc大功率emi滤波器
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US20190272936A1 (en) * 2018-03-05 2019-09-05 Intel Corporation Fully embedded magnetic-core in core layer for custom inductor in ic substrate
US11891340B2 (en) 2018-07-23 2024-02-06 Skyworks Solutions, Inc. Spinel-based oxides containing magnesium, aluminum and titanium and methods of forming articles having same
US11398334B2 (en) * 2018-07-30 2022-07-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded inductor with an inlay
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
EP3736839A1 (en) * 2019-05-06 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded magnet stack
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
JP7471846B2 (ja) * 2020-02-17 2024-04-22 Tdk株式会社 コイル部品及びその製造方法
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
IT202000028775A1 (it) * 2020-11-27 2022-05-27 St Microelectronics Srl Trasformatore integrato atto ad operare ad elevate tensioni e relativo procedimento di fabbricazione
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
DE102022101327A1 (de) 2022-01-20 2023-07-20 SUMIDA Components & Modules GmbH Ferritrohrkern, Entstördrossel mit einem solchen Ferritrohrkern und Verfahren zum Bilden eines Ferritrohrkerns
US12523717B2 (en) 2024-02-15 2026-01-13 Allegro Microsystems, Llc Closed loop magnetic field sensor with current control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001363A (en) * 1970-03-19 1977-01-04 U.S. Philips Corporation Method of manufacturing a ceramic ferromagnetic object
US3965552A (en) * 1972-07-24 1976-06-29 N L Industries, Inc. Process for forming internal conductors and electrodes
US4301580A (en) * 1977-04-16 1981-11-24 Wallace Clarence L Manufacture of multi-layered electrical assemblies
US4388131A (en) * 1977-05-02 1983-06-14 Burroughs Corporation Method of fabricating magnets
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
US4583068A (en) * 1984-08-13 1986-04-15 At&T Bell Laboratories Low profile magnetic structure in which one winding acts as support for second winding
US4731297A (en) * 1985-08-20 1988-03-15 Tdk Corporation Laminated components of open magnetic circuit type
US4620916A (en) * 1985-09-19 1986-11-04 Zwemer Dirk A Degradation retardants for electrophoretic display devices
US4959631A (en) * 1987-09-29 1990-09-25 Kabushiki Kaisha Toshiba Planar inductor
US4837659A (en) * 1988-03-21 1989-06-06 Itt Corporation Transformer/inductor with integrated capacitor using soft ferrites
US4880599A (en) * 1988-03-25 1989-11-14 General Electric Company Method of making a ferrite composite containing silver metallization
US4922156A (en) * 1988-04-08 1990-05-01 Itt Corporation Integrated power capacitor and inductors/transformers utilizing insulated amorphous metal ribbon
US4862129A (en) * 1988-04-29 1989-08-29 Itt Corporation Single-turn primary and single-turn secondary flat voltage transformer

Also Published As

Publication number Publication date
DE69202097T2 (de) 1995-08-17
FI921968A0 (fi) 1992-04-30
KR920022325A (ko) 1992-12-19
US5479695A (en) 1996-01-02
ES2071433T3 (es) 1995-06-16
IL101736A (en) 1995-12-31
JP2637332B2 (ja) 1997-08-06
CA2067008A1 (en) 1992-11-03
MX9201989A (es) 1992-11-01
AU654348B2 (en) 1994-11-03
IL101736A0 (en) 1992-12-30
EP0512718A1 (en) 1992-11-11
FI921968A7 (fi) 1992-11-03
DE69202097D1 (de) 1995-05-24
AU1596392A (en) 1992-11-26
EP0512718B1 (en) 1995-04-19
CA2067008C (en) 1996-07-02
JPH0696940A (ja) 1994-04-08
US5349743A (en) 1994-09-27
TW198120B (pt) 1993-01-11
HK81296A (en) 1996-05-17
FI921968L (fi) 1992-11-03

Similar Documents

Publication Publication Date Title
PT100444A (pt) Processo para a fabricacao de componentes magneticos compositod monoliticos contendo varias camadas
DE4228527C2 (de) Aluminiumtitanatkeramik und Verfahren zur Herstellung derselben
EP0499865B1 (en) Glass-aluminum nitride composite material
DE2643131A1 (de) Elektrisch leitende verbundkeramik und verfahren zu deren herstellung
WO2002016063A3 (de) Verfahren zur herstellung von verbundbauteilen durch pulver-spritzgiessen und dazu geeignete verbundpulver
CN106384667A (zh) 叠层型陶瓷电子零件
EP0474354B1 (en) Dielectric ceramic body, method of producing the same and circuit board using the same
WO2019002695A1 (en) Ceramic composite material
KR930001299A (ko) 다층유리-세라믹 회로판의 제조방법
DE4005505A1 (de) Monolithischer keramischer kondensator
DE4022690A1 (de) Thermoelektrisches element und verfahren zur herstellung desselben
DE10035172A1 (de) Keramikmasse und Kondensator mit der Keramikmasse
DE10010082A1 (de) Magnetische Keramikzusammensetzung und dieselbe verwendende Induktorkomponente
US5902758A (en) Low temperature firing glass-ceramic substrate and production process thereof
DE3628572C2 (pt)
EP0326999B1 (en) Sintered ferrite materials and chip parts
DE69800494T2 (de) Bei tiefer Temperatur sinterfähige keramische Zusammensetzung sowie deren Verwendung in monolothischem Substrat
KR920003226B1 (ko) 질화알루미늄소결체와 그것을 사용한 회로기판 및 반도체패키지
KR101884104B1 (ko) 적층체, 적층 디바이스 및 이들의 제조 방법
JP2727509B2 (ja) チップインダクタおよびlc複合部品
DE69108172T2 (de) Geschichtete Kupferoxide.
JP4694860B2 (ja) 積層型ビーズの製造方法
DE3229271A1 (de) Temperaturschockbestaendige keramische auskleidungen
JPH08323925A (ja) アルミナ−ムライト積層構造体およびその製造方法
JPS54119695A (en) Composite material for thick film thermistor

Legal Events

Date Code Title Description
BB1A Laying open of patent application

Effective date: 19930923

FC3A Refusal

Effective date: 19990407