PT1183643E - Processo de fabrico de um cartão de chip sem contacto com um suporte de antena feito de material fibroso - Google Patents

Processo de fabrico de um cartão de chip sem contacto com um suporte de antena feito de material fibroso Download PDF

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Publication number
PT1183643E
PT1183643E PT00985344T PT00985344T PT1183643E PT 1183643 E PT1183643 E PT 1183643E PT 00985344 T PT00985344 T PT 00985344T PT 00985344 T PT00985344 T PT 00985344T PT 1183643 E PT1183643 E PT 1183643E
Authority
PT
Portugal
Prior art keywords
antenna
antenna support
card
manufacturing
fibrous material
Prior art date
Application number
PT00985344T
Other languages
English (en)
Inventor
Georges Kayanakis
Christophe Mathieu
Sebastien Delenne
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of PT1183643E publication Critical patent/PT1183643E/pt

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07251Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/941Dispositions of bond pads
    • H10W72/9415Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
PT00985344T 1999-11-29 2000-11-28 Processo de fabrico de um cartão de chip sem contacto com um suporte de antena feito de material fibroso PT1183643E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9915019A FR2801708B1 (fr) 1999-11-29 1999-11-29 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux

Publications (1)

Publication Number Publication Date
PT1183643E true PT1183643E (pt) 2008-06-17

Family

ID=9552672

Family Applications (1)

Application Number Title Priority Date Filing Date
PT00985344T PT1183643E (pt) 1999-11-29 2000-11-28 Processo de fabrico de um cartão de chip sem contacto com um suporte de antena feito de material fibroso

Country Status (22)

Country Link
US (1) US6536674B2 (pt)
EP (1) EP1183643B1 (pt)
JP (1) JP4731779B2 (pt)
KR (1) KR100817961B1 (pt)
CN (1) CN1211759C (pt)
AT (1) ATE388453T1 (pt)
AU (1) AU776169B2 (pt)
BR (1) BR0007790A (pt)
CA (1) CA2360351C (pt)
DE (1) DE60038230T2 (pt)
FR (1) FR2801708B1 (pt)
HK (1) HK1044398B (pt)
ID (1) ID29989A (pt)
IL (1) IL144301A (pt)
MX (1) MXPA01007466A (pt)
NO (1) NO20013405L (pt)
PT (1) PT1183643E (pt)
RU (1) RU2251744C2 (pt)
TR (1) TR200102182T1 (pt)
TW (1) TW513672B (pt)
WO (1) WO2001041060A1 (pt)
ZA (1) ZA200105716B (pt)

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US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
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WO2005093645A1 (fr) * 2004-03-25 2005-10-06 Bauer, Eric Procede de fabrication d'une etiquette electronique et etiquette electronique obtenue par ledit procede
USD507298S1 (en) * 2004-06-03 2005-07-12 American Express Travel Related Services Company, Inc. Card with an antenna and a rectangle
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US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7688206B2 (en) * 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7347381B2 (en) * 2004-12-16 2008-03-25 Pitney Bowes Inc. Secure radio frequency identification documents
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US7193161B1 (en) * 2006-02-15 2007-03-20 Sandisk Corporation SiP module with a single sided lid
FR2899000B1 (fr) * 2006-03-24 2008-10-17 Arjowiggins Security Soc Par A Dispositif radiofrequence comportant un composant electronique pourvu d'une antenne integree et couplee electromagnetiquement a une antenne d'amplification
US8096479B2 (en) 2007-02-23 2012-01-17 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
FR2917871B1 (fr) * 2007-06-21 2010-10-22 Smart Packaging Solutions Sps Insert securise notamment pour carte a puce
EP2014463B1 (en) 2007-06-22 2015-07-29 Agfa-Gevaert N.V. Smart information carrier and production process therefor.
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
TWI401838B (zh) * 2009-09-22 2013-07-11 Kuo Ching Chiang 薄膜天線之製造方法
DE102009058435A1 (de) * 2009-12-16 2011-06-22 Giesecke & Devrient GmbH, 81677 Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte
AU2012225663B2 (en) 2011-03-04 2017-03-02 Visa International Service Association Payment card system and method
TWI478069B (zh) * 2012-04-20 2015-03-21 Smartdisplayer Technology Co Ltd A display card with a security check

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Also Published As

Publication number Publication date
EP1183643B1 (fr) 2008-03-05
AU776169B2 (en) 2004-09-02
US20010006194A1 (en) 2001-07-05
NO20013405D0 (no) 2001-07-09
CN1211759C (zh) 2005-07-20
ID29989A (id) 2001-10-25
ATE388453T1 (de) 2008-03-15
KR20010110419A (ko) 2001-12-13
WO2001041060A1 (fr) 2001-06-07
CA2360351A1 (fr) 2001-06-07
IL144301A (en) 2005-12-18
FR2801708A1 (fr) 2001-06-01
ZA200105716B (en) 2002-02-21
CA2360351C (fr) 2010-01-05
RU2251744C2 (ru) 2005-05-10
BR0007790A (pt) 2002-02-05
JP2003515848A (ja) 2003-05-07
EP1183643A1 (fr) 2002-03-06
KR100817961B1 (ko) 2008-03-31
DE60038230D1 (de) 2008-04-17
HK1044398A1 (en) 2002-10-18
AU2179301A (en) 2001-06-12
TW513672B (en) 2002-12-11
TR200102182T1 (tr) 2002-03-21
JP4731779B2 (ja) 2011-07-27
US6536674B2 (en) 2003-03-25
NO20013405L (no) 2001-09-12
MXPA01007466A (es) 2003-03-12
DE60038230T2 (de) 2008-11-13
CN1338085A (zh) 2002-02-27
HK1044398B (zh) 2006-02-17
FR2801708B1 (fr) 2003-12-26
IL144301A0 (en) 2002-05-23

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