ATE388453T1 - Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial - Google Patents

Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial

Info

Publication number
ATE388453T1
ATE388453T1 AT00985344T AT00985344T ATE388453T1 AT E388453 T1 ATE388453 T1 AT E388453T1 AT 00985344 T AT00985344 T AT 00985344T AT 00985344 T AT00985344 T AT 00985344T AT E388453 T1 ATE388453 T1 AT E388453T1
Authority
AT
Austria
Prior art keywords
antenna
card
producing
onto
fiber material
Prior art date
Application number
AT00985344T
Other languages
English (en)
Inventor
Georges Kayanakis
Christophe Mathieu
Sebastien Delenne
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Application granted granted Critical
Publication of ATE388453T1 publication Critical patent/ATE388453T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT00985344T 1999-11-29 2000-11-28 Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial ATE388453T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9915019A FR2801708B1 (fr) 1999-11-29 1999-11-29 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux

Publications (1)

Publication Number Publication Date
ATE388453T1 true ATE388453T1 (de) 2008-03-15

Family

ID=9552672

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00985344T ATE388453T1 (de) 1999-11-29 2000-11-28 Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial

Country Status (22)

Country Link
US (1) US6536674B2 (de)
EP (1) EP1183643B1 (de)
JP (1) JP4731779B2 (de)
KR (1) KR100817961B1 (de)
CN (1) CN1211759C (de)
AT (1) ATE388453T1 (de)
AU (1) AU776169B2 (de)
BR (1) BR0007790A (de)
CA (1) CA2360351C (de)
DE (1) DE60038230T2 (de)
FR (1) FR2801708B1 (de)
HK (1) HK1044398B (de)
ID (1) ID29989A (de)
IL (1) IL144301A (de)
MX (1) MXPA01007466A (de)
NO (1) NO20013405L (de)
PT (1) PT1183643E (de)
RU (1) RU2251744C2 (de)
TR (1) TR200102182T1 (de)
TW (1) TW513672B (de)
WO (1) WO2001041060A1 (de)
ZA (1) ZA200105716B (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
JP2003006594A (ja) * 2001-06-22 2003-01-10 Toppan Forms Co Ltd 両面テープを用いたｒｆ−ｉｄメディアの形成方法
FR2829857B1 (fr) 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6869021B2 (en) 2002-10-18 2005-03-22 Pitney Bowes Inc. Method for field programming radio frequency identification labels
US6805291B2 (en) 2002-10-18 2004-10-19 Pitney Bowes Inc. Method for field programmable radio frequency document identification devices
US20040075348A1 (en) * 2002-10-18 2004-04-22 Pitney Bowes Incorporated Method for field programmable radio frequency identification devices to perform switching functions
US7176900B2 (en) * 2002-10-18 2007-02-13 Pitney Bowes Inc. Method and apparatus for field programming radio frequency identification devices
US7042336B2 (en) * 2002-10-18 2006-05-09 Pitney Bowes Inc. Methods for field programming radio frequency identification devices that control remote control devices
US6840444B2 (en) 2002-10-18 2005-01-11 Pitney Bowes Inc. Method for field programming radio frequency identification return forms
US6869020B2 (en) * 2002-10-18 2005-03-22 Pitney Bowes Inc. Method for field programmable radio frequency identification testing devices for transmitting user selected data
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
EP1738303B1 (de) * 2004-03-25 2008-09-17 Bauer, Eric Verfahren zur herstellung eines elektronischen labels
USD512095S1 (en) * 2004-06-03 2005-11-29 American Express Travel Related Services Company, Inc. Card with an antenna and a blue rectangle
USD507298S1 (en) * 2004-06-03 2005-07-12 American Express Travel Related Services Company, Inc. Card with an antenna and a rectangle
USD507598S1 (en) * 2004-06-03 2005-07-19 American Express Travel Related Services Company, Inc. Transparent card with an antenna and a blue rectangle
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna
USD508261S1 (en) * 2004-06-03 2005-08-09 American Express Travel Related Services Company, Inc. Transparent card with an antenna and a rectangle
US7216808B2 (en) * 2004-10-28 2007-05-15 Pitney Bowes Inc. Method for a user to answer questions or queries using electrical contacts
FR2877463B1 (fr) * 2004-11-03 2007-01-26 Gemplus Sa Dispositif a module electronique indemontable
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7452748B1 (en) * 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7353598B2 (en) 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7347381B2 (en) * 2004-12-16 2008-03-25 Pitney Bowes Inc. Secure radio frequency identification documents
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US7193161B1 (en) * 2006-02-15 2007-03-20 Sandisk Corporation SiP module with a single sided lid
FR2899000B1 (fr) * 2006-03-24 2008-10-17 Arjowiggins Security Soc Par A Dispositif radiofrequence comportant un composant electronique pourvu d'une antenne integree et couplee electromagnetiquement a une antenne d'amplification
US8096479B2 (en) 2007-02-23 2012-01-17 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
FR2917871B1 (fr) 2007-06-21 2010-10-22 Smart Packaging Solutions Sps Insert securise notamment pour carte a puce
EP2014463B1 (de) 2007-06-22 2015-07-29 Agfa-Gevaert N.V. Intelligenter Informationsträger und dessen Herstellungsverfahren
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
TWI401838B (zh) * 2009-09-22 2013-07-11 Kuo Ching Chiang 薄膜天線之製造方法
DE102009058435A1 (de) * 2009-12-16 2011-06-22 Giesecke & Devrient GmbH, 81677 Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte
JP6081379B2 (ja) 2011-03-04 2017-02-15 ビザ・インターナショナル・サービス・アソシエイションＶｉｓａ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｓｅｒｖｉｃｅ Ａｓｓｏｃｉａｔｉｏｎ ペイメントカードシステムおよび方法
TWI478069B (zh) * 2012-04-20 2015-03-21 Smartdisplayer Technology Co Ltd A display card with a security check

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR615285A (de) * 1927-01-04
FR2581480A1 (fr) 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
DE3689094T2 (de) 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
FI94562C (fi) 1992-11-09 1995-09-25 Tapio Robertsson Rullan tunnistuslaite ja menetelmä sen valmistamiseksi
ZA941671B (en) 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
RU2087039C1 (ru) * 1993-04-02 1997-08-10 Николай Валентинович Щербаков Модуль экрана информационного табло
US5495250A (en) * 1993-11-01 1996-02-27 Motorola, Inc. Battery-powered RF tags and apparatus for manufacturing the same
DE4403513A1 (de) 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5495259A (en) * 1994-03-31 1996-02-27 Lyasko; Gennady Compact parametric antenna
DE19601358C2 (de) 1995-01-20 2000-01-27 Fraunhofer Ges Forschung Papier mit integrierter Schaltung
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
IT240061Y1 (it) 1996-03-01 2001-03-26 Cruciani Andrea Adattatore
JP2001505329A (ja) 1996-08-05 2001-04-17 ジェムプリュス エス．セー．アー． メモリカード実現方法の改良とそれによって得られるカード
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
JPH1178324A (ja) * 1997-07-18 1999-03-23 Tokyo Jiki Insatsu Kk プラスチックカードおよびその製造方法
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
JPH1178317A (ja) * 1997-09-10 1999-03-23 Hitachi Chem Co Ltd Ｉｃカード
FR2769440B1 (fr) * 1997-10-03 1999-12-03 Gemplus Card Int Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
FR2775533B1 (fr) * 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
FR2778475B1 (fr) 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
US6161761A (en) 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
JP2000094874A (ja) * 1998-09-22 2000-04-04 Canon Inc 電子部品内蔵カードとその製造方法
JP2000113155A (ja) 1998-09-30 2000-04-21 Oji Paper Co Ltd Ｉｃカード
JP2000113151A (ja) 1998-10-01 2000-04-21 Tomoegawa Paper Co Ltd ラベル状ｉｃカード
JP2000155821A (ja) 1998-11-19 2000-06-06 Dainippon Printing Co Ltd 非接触ｉｃカードおよびその製造方法
RU2158204C1 (ru) * 2000-03-17 2000-10-27 Закрытое акционерное общество "Розан-Файненс" Способ изготовления ламинированных бесконтактных чиповых карт

Also Published As

Publication number Publication date
AU2179301A (en) 2001-06-12
CN1338085A (zh) 2002-02-27
DE60038230T2 (de) 2008-11-13
TW513672B (en) 2002-12-11
JP4731779B2 (ja) 2011-07-27
IL144301A (en) 2005-12-18
IL144301A0 (en) 2002-05-23
KR20010110419A (ko) 2001-12-13
AU776169B2 (en) 2004-09-02
TR200102182T1 (tr) 2002-03-21
DE60038230D1 (de) 2008-04-17
HK1044398A1 (en) 2002-10-18
EP1183643A1 (de) 2002-03-06
US20010006194A1 (en) 2001-07-05
KR100817961B1 (ko) 2008-03-31
ZA200105716B (en) 2002-02-21
NO20013405L (no) 2001-09-12
PT1183643E (pt) 2008-06-17
EP1183643B1 (de) 2008-03-05
WO2001041060A1 (fr) 2001-06-07
MXPA01007466A (es) 2003-03-12
BR0007790A (pt) 2002-02-05
US6536674B2 (en) 2003-03-25
FR2801708B1 (fr) 2003-12-26
RU2251744C2 (ru) 2005-05-10
JP2003515848A (ja) 2003-05-07
HK1044398B (zh) 2006-02-17
FR2801708A1 (fr) 2001-06-01
CA2360351A1 (fr) 2001-06-07
CN1211759C (zh) 2005-07-20
CA2360351C (fr) 2010-01-05
ID29989A (id) 2001-10-25
NO20013405D0 (no) 2001-07-09

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