PT2647043T - Processo para o tratamento de wafers e microchapas - Google Patents
Processo para o tratamento de wafers e microchapasInfo
- Publication number
- PT2647043T PT2647043T PT117885384T PT11788538T PT2647043T PT 2647043 T PT2647043 T PT 2647043T PT 117885384 T PT117885384 T PT 117885384T PT 11788538 T PT11788538 T PT 11788538T PT 2647043 T PT2647043 T PT 2647043T
- Authority
- PT
- Portugal
- Prior art keywords
- microplates
- wafers
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010062166.8A DE102010062166B4 (de) | 2010-11-30 | 2010-11-30 | Verfahren zum Behandeln von Wafern und Mikroplättchen, Vorrichtung zur Durchführung des Verfahrens sowie Ring für das Verfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT2647043T true PT2647043T (pt) | 2021-05-12 |
Family
ID=45047843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT117885384T PT2647043T (pt) | 2010-11-30 | 2011-11-30 | Processo para o tratamento de wafers e microchapas |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2647043B1 (pt) |
| JP (1) | JP5959529B2 (pt) |
| KR (1) | KR101801337B1 (pt) |
| CN (1) | CN103238211B (pt) |
| DE (1) | DE102010062166B4 (pt) |
| PT (1) | PT2647043T (pt) |
| WO (1) | WO2012072706A1 (pt) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6093638B2 (ja) * | 2013-04-26 | 2017-03-08 | 株式会社ディスコ | 洗浄装置 |
| CN105219963B (zh) * | 2014-06-10 | 2017-06-30 | 沈阳芯源微电子设备有限公司 | 一种废液废固分离回收系统 |
| JP6573531B2 (ja) * | 2015-11-02 | 2019-09-11 | 東京エレクトロン株式会社 | 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体 |
| JP6611565B2 (ja) * | 2015-11-02 | 2019-11-27 | 東京エレクトロン株式会社 | 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体 |
| CN108857862B (zh) * | 2018-06-12 | 2020-05-12 | 山东科芯电子有限公司 | 一种半导体硅晶圆研磨处理系统 |
| JP7656458B2 (ja) | 2021-03-25 | 2025-04-03 | 株式会社ディスコ | 洗浄装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4086870A (en) * | 1977-06-30 | 1978-05-02 | International Business Machines Corporation | Novel resist spinning head |
| JPS63152123A (ja) * | 1986-12-17 | 1988-06-24 | Tokyo Electron Ltd | 浸漬式の液処理装置 |
| JP2724870B2 (ja) * | 1988-04-08 | 1998-03-09 | 東京エレクトロン株式会社 | 処理装置 |
| JP2719618B2 (ja) * | 1989-03-25 | 1998-02-25 | 東京エレクトロン株式会社 | 基板の洗浄装置 |
| JP2833519B2 (ja) * | 1994-09-27 | 1998-12-09 | 日本電気株式会社 | 絶縁膜上の半導体膜の薄膜化方法および薄膜化装置 |
| JP3415373B2 (ja) * | 1995-11-29 | 2003-06-09 | 東芝マイクロエレクトロニクス株式会社 | 半導体基板等の表層の溶解方法及び装置 |
| JPH10172938A (ja) * | 1996-12-06 | 1998-06-26 | Sony Corp | ウェーハスクラブ処理装置 |
| JP3910830B2 (ja) * | 2001-11-14 | 2007-04-25 | 信越半導体株式会社 | シリコンウェーハの酸化膜の除去方法及びその装置 |
| JP4621038B2 (ja) * | 2005-02-18 | 2011-01-26 | Ｏｋｉセミコンダクタ株式会社 | 半導体ウエハの洗浄方法及び半導体ウエハの洗浄装置 |
| JP2008021929A (ja) * | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
| JP4971078B2 (ja) * | 2007-08-30 | 2012-07-11 | 東京応化工業株式会社 | 表面処理装置 |
| US20090173358A1 (en) * | 2008-01-09 | 2009-07-09 | Micron Technology, Inc. | Megasonic cleaning with controlled boundary layer thickness and associated systems and methods |
| JP5300464B2 (ja) * | 2008-12-26 | 2013-09-25 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
-
2010
- 2010-11-30 DE DE102010062166.8A patent/DE102010062166B4/de active Active
-
2011
- 2011-11-30 JP JP2013541337A patent/JP5959529B2/ja active Active
- 2011-11-30 EP EP11788538.4A patent/EP2647043B1/de active Active
- 2011-11-30 KR KR1020137016060A patent/KR101801337B1/ko active Active
- 2011-11-30 WO PCT/EP2011/071434 patent/WO2012072706A1/de not_active Ceased
- 2011-11-30 PT PT117885384T patent/PT2647043T/pt unknown
- 2011-11-30 CN CN201180057666.5A patent/CN103238211B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012072706A1 (de) | 2012-06-07 |
| KR20130132867A (ko) | 2013-12-05 |
| CN103238211A (zh) | 2013-08-07 |
| DE102010062166A1 (de) | 2012-05-31 |
| EP2647043B1 (de) | 2021-04-14 |
| CN103238211B (zh) | 2016-01-20 |
| KR101801337B1 (ko) | 2017-11-24 |
| JP2014501043A (ja) | 2014-01-16 |
| JP5959529B2 (ja) | 2016-08-02 |
| DE102010062166B4 (de) | 2025-12-31 |
| EP2647043A1 (de) | 2013-10-09 |
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