RU2304323C2 - Способ получения фторполимерного слоя на тонкопленочном приборе - Google Patents
Способ получения фторполимерного слоя на тонкопленочном приборе Download PDFInfo
- Publication number
- RU2304323C2 RU2304323C2 RU2005101341/28A RU2005101341A RU2304323C2 RU 2304323 C2 RU2304323 C2 RU 2304323C2 RU 2005101341/28 A RU2005101341/28 A RU 2005101341/28A RU 2005101341 A RU2005101341 A RU 2005101341A RU 2304323 C2 RU2304323 C2 RU 2304323C2
- Authority
- RU
- Russia
- Prior art keywords
- fluoromonomer
- thin
- free radical
- radical polymerization
- film device
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
- B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
- H10P14/687—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2002/019702 WO2004001832A1 (en) | 2002-06-21 | 2002-06-21 | Fluoropolymer interlayer dielectric by chemical vapor deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2005101341A RU2005101341A (ru) | 2005-06-27 |
| RU2304323C2 true RU2304323C2 (ru) | 2007-08-10 |
Family
ID=29998721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2005101341/28A RU2304323C2 (ru) | 2002-06-21 | 2002-06-21 | Способ получения фторполимерного слоя на тонкопленочном приборе |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1516360A1 (de) |
| CN (1) | CN100336184C (de) |
| AU (1) | AU2002310491A1 (de) |
| CA (1) | CA2487486A1 (de) |
| RU (1) | RU2304323C2 (de) |
| WO (1) | WO2004001832A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013102011A2 (en) * | 2011-12-30 | 2013-07-04 | Gvd Corporation | Coatings for electrowetting and electrofluidic devices |
| JP6356702B2 (ja) | 2013-02-15 | 2018-07-11 | マサチューセッツ インスティテュート オブ テクノロジー | 滴状凝縮のためのグラフトポリマー表面、ならびに関連使用および製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2046678C1 (ru) * | 1992-11-17 | 1995-10-27 | Институт микроэлектроники РАН | Способ плазменной полимеризации |
| US6156435A (en) * | 1996-05-06 | 2000-12-05 | Massachusetts Institute Of Technology | Chemical vapor deposition of fluorocarbon polymer thin films |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3400688A1 (de) * | 1984-01-11 | 1985-07-18 | Chemische Werke Hüls AG, 4370 Marl | Ausschleusung von schwermetallasche durch zentrifugalbehandlung oder druckfiltration |
| US4834022A (en) * | 1985-11-08 | 1989-05-30 | Focus Semiconductor Systems, Inc. | CVD reactor and gas injection system |
| CA2072384A1 (en) * | 1991-08-29 | 1993-03-01 | Clifford L. Spiro | Carbon fluoride compositions |
| US6022414A (en) * | 1994-07-18 | 2000-02-08 | Semiconductor Equipment Group, Llc | Single body injector and method for delivering gases to a surface |
| TW359943B (en) * | 1994-07-18 | 1999-06-01 | Silicon Valley Group Thermal | Single body injector and method for delivering gases to a surface |
| TW356554B (en) * | 1995-10-23 | 1999-04-21 | Watkins Johnson Co | Gas injection system for semiconductor processing |
| JPH10209148A (ja) * | 1997-01-27 | 1998-08-07 | Sony Corp | 低誘電率絶縁体膜の形成方法およびこれを用いた半導体装置 |
| EP1119034A4 (de) * | 1998-09-28 | 2002-12-04 | Tokyo Electron Ltd | Verfahren zur plasmaunterstützten schichtabscheidung |
| US6458718B1 (en) * | 2000-04-28 | 2002-10-01 | Asm Japan K.K. | Fluorine-containing materials and processes |
-
2002
- 2002-06-21 EP EP02737569A patent/EP1516360A1/de not_active Ceased
- 2002-06-21 CN CNB028291905A patent/CN100336184C/zh not_active Expired - Fee Related
- 2002-06-21 AU AU2002310491A patent/AU2002310491A1/en not_active Abandoned
- 2002-06-21 WO PCT/US2002/019702 patent/WO2004001832A1/en not_active Ceased
- 2002-06-21 RU RU2005101341/28A patent/RU2304323C2/ru not_active IP Right Cessation
- 2002-06-21 CA CA002487486A patent/CA2487486A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2046678C1 (ru) * | 1992-11-17 | 1995-10-27 | Институт микроэлектроники РАН | Способ плазменной полимеризации |
| US6156435A (en) * | 1996-05-06 | 2000-12-05 | Massachusetts Institute Of Technology | Chemical vapor deposition of fluorocarbon polymer thin films |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002310491A1 (en) | 2004-01-06 |
| WO2004001832A1 (en) | 2003-12-31 |
| CN1628376A (zh) | 2005-06-15 |
| CN100336184C (zh) | 2007-09-05 |
| RU2005101341A (ru) | 2005-06-27 |
| CA2487486A1 (en) | 2003-12-31 |
| HK1076921A1 (zh) | 2006-01-27 |
| EP1516360A1 (de) | 2005-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20160622 |