SE335759B - - Google Patents

Info

Publication number: SE335759B
Authority: SE; Sweden

Application number

SE07259/66A

Inventor

K Clark

T Rajac

G Santillo

J Godat

A Larsen

Turris F De

J Drop

G Beck

E Creighton

W Schuelke

Original Assignee

Ibm

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1965-05-27

Filing date

1966-05-27

Publication date

1971-06-07

1966-05-27 Application filed by Ibm filed Critical Ibm

1971-06-07 Publication of SE335759B publication Critical patent/SE335759B/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Treatment Of Fiber Materials (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

SE07259/66A 1965-05-27 1966-05-27 SE335759B (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US45917965A	1965-05-27	1965-05-27

Publications (1)

Publication Number	Publication Date
SE335759B true SE335759B (de)	1971-06-07

Family

ID=23823726

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE07259/66A SE335759B (de)	1965-05-27	1966-05-27

Country Status (6)

Country	Link
US (1)	US3499203A (de)
CH (1)	CH475691A (de)
DE (1)	DE1266839B (de)
FR (1)	FR1480578A (de)
NL (1)	NL6607264A (de)
SE (1)	SE335759B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3709378A (en) *	1971-03-04	1973-01-09	Ibm	Aligning and orienting apparatus
US4151945A (en) *	1977-12-08	1979-05-01	Universal Instruments Corporation	Automated hybrid circuit board assembly apparatus
US4372802A (en) *	1980-06-02	1983-02-08	Tokyo Denki Kagaku Kogyo Kabushiki Kaisha	Apparatus for mounting chip type circuit elements on printed circuit boards
US4458412A (en) *	1981-05-06	1984-07-10	Universal Instruments Corporation	Leadless chip placement machine for printed circuit boards
US4501064A (en) *	1981-09-08	1985-02-26	Usm Corporation	Micro component assembly machine
US4593462A (en) *	1984-09-24	1986-06-10	Tdk Corporation	Apparatus for automatically mounting chip-type circuit elements on substrate
US5788143A (en) *	1992-04-08	1998-08-04	International Business Machines Corporation	Solder particle deposition
US6016949A (en) *	1997-07-01	2000-01-25	International Business Machines Corporation	Integrated placement and soldering pickup head and method of using
US7686521B2 (en) *	2003-11-10	2010-03-30	Finisar Corporation	Zero force socket for laser / photodiode alignment
JP4734857B2 (ja) *	2004-06-25	2011-07-27	シンフォニアテクノロジー株式会社	Ｉｃチップ実装体の製造装置
US7555832B2 (en) *	2007-03-19	2009-07-07	Infineon Technologies Ag	Semiconductor chip attachment
TW201432319A (zh) *	2013-02-05	2014-08-16	Hon Hai Prec Ind Co Ltd	光纖連接器組裝裝置
CN104330549B (zh) *	2013-04-03	2017-01-25	艾博生物医药(杭州)有限公司	一种识别检测板的正反两面的装置及方法
JP6146266B2 (ja) *	2013-11-07	2017-06-14	富士通株式会社	電力供給機構及びラック型装置
SE538792C2 (en) *	2015-02-06	2016-11-29	Stora Enso Oyj	Apparatus and method for component assembly
CN118833902B (zh) *	2024-08-09	2026-08-11	江苏新纪元环保有限公司	一种可自动排污的循环净水设备及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2494474A (en) *	1949-01-12	1950-01-10	Western Electric Co	Apparatus for soldering lead wires to electrical units
FR1173478A (fr) *	1956-04-05	1959-02-25	Gen Electric Co Ltd	Machine automatique notamment pour monter des éléments électriques sur des bases imprimées
NL98523C (de) *	1956-05-01
US2970370A (en) *	1957-11-19	1961-02-07	Philco Corp	Fabrication of electrical devices
US2915201A (en) *	1958-02-12	1959-12-01	Sylvania Electric Prod	Suction transfer mechanism
GB865924A (en) *	1958-06-19	1961-04-26	Gen Electric Co Ltd	Improvements in or relating to automatic machines for mounting electrical componentson base members
US3056317A (en) *	1959-09-02	1962-10-02	Western Electric Co	Article manipulating and processing apparatus
US3190523A (en) *	1960-09-27	1965-06-22	Philips Corp	Component inserting machine
US3083291A (en) *	1960-10-18	1963-03-26	Kulicke & Soffa Mfg Co	Device for mounting and bonding semiconductor wafers
US3165818A (en) *	1960-10-18	1965-01-19	Kulicke & Soffa Mfg Co	Method for mounting and bonding semiconductor wafers
US3134167A (en) *	1962-06-08	1964-05-26	Warwick Mfg Corp	Component inserting equipment
GB1114393A (en) *	1964-12-23	1968-05-22	Ibm	Improvements in or relating to apparatus for sensing the orientation of an object
US3337941A (en) *	1965-05-27	1967-08-29	Ibm	Recycle control circuit for a chip positioning machine
US3344900A (en) *	1965-05-27	1967-10-03	Ibm	Chip orienting control circuit for a chip positioning machine
US3314296A (en) *	1965-05-27	1967-04-18	Ibm	Indexing drive mechanism

1965
- 1965-05-27 US US459179A patent/US3499203A/en not_active Expired - Lifetime
1966
- 1966-05-10 FR FR7819A patent/FR1480578A/fr not_active Expired
- 1966-05-17 DE DEJ30856A patent/DE1266839B/de not_active Withdrawn
- 1966-05-26 NL NL6607264A patent/NL6607264A/xx unknown
- 1966-05-27 CH CH777266A patent/CH475691A/de not_active IP Right Cessation
- 1966-05-27 SE SE07259/66A patent/SE335759B/xx unknown

Also Published As

Publication number	Publication date
NL6607264A (de)	1966-11-28
FR1480578A (fr)	1967-05-12
CH475691A (de)	1969-07-15
US3499203A (en)	1970-03-10
DE1266839B (de)	1968-04-25

Publication	Publication Date	Title
SE218414C1 (de)	1968-01-23
JPS4421287Y1 (de)	1969-09-10
JPS4221094Y1 (de)	1967-12-06
JPS4417011Y1 (de)	1969-07-23
JPS4325671Y1 (de)	1968-10-26
JPS4420294Y1 (de)	1969-08-30
JPS447372Y1 (de)	1969-03-20
JPS4325733Y1 (de)	1968-10-28
JPS4324785Y1 (de)	1968-10-18
AU6340065A (de)	1967-03-02
BE676062A (de)	1966-06-16
BE675477A (de)	1966-07-25
BE663749A (de)	1965-09-01
BE675028A (de)	1966-07-12
BE669168A (de)	1965-12-31
BE675599A (de)	1966-05-16
BE676079A (de)	1966-08-04
BE674937A (de)	1966-06-16
BE675122A (de)	1966-07-14
BE675228A (de)	1966-07-18
BE691723A (de)	1967-05-29
SE354009B (de)	1973-02-26
BE675406A (de)	1966-07-20
NL6607264A (de)	1966-11-28
BE675426A (de)	1966-05-16