CH475691A - Verfahren zum automatischen Anbringen von Teilen auf Grundplatten - Google Patents

Verfahren zum automatischen Anbringen von Teilen auf Grundplatten

Info

Publication number
CH475691A
CH475691A CH777266A CH777266A CH475691A CH 475691 A CH475691 A CH 475691A CH 777266 A CH777266 A CH 777266A CH 777266 A CH777266 A CH 777266A CH 475691 A CH475691 A CH 475691A
Authority
CH
Switzerland
Prior art keywords
parts
base plates
automatic mounting
automatic
mounting
Prior art date
Application number
CH777266A
Other languages
English (en)
Inventor
Clark Kendall
Clayton Beck George
Joseph Creighton Eugene
Louis De Turris Frank
George Drop Joseph
Joseph-Louis Godat Jean
Hienrich Larsen Arne
John Rajac Thomas
Richard Jr Santillo George
Joseph Schuelke Walter
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH475691A publication Critical patent/CH475691A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CH777266A 1965-05-27 1966-05-27 Verfahren zum automatischen Anbringen von Teilen auf Grundplatten CH475691A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45917965A 1965-05-27 1965-05-27

Publications (1)

Publication Number Publication Date
CH475691A true CH475691A (de) 1969-07-15

Family

ID=23823726

Family Applications (1)

Application Number Title Priority Date Filing Date
CH777266A CH475691A (de) 1965-05-27 1966-05-27 Verfahren zum automatischen Anbringen von Teilen auf Grundplatten

Country Status (6)

Country Link
US (1) US3499203A (de)
CH (1) CH475691A (de)
DE (1) DE1266839B (de)
FR (1) FR1480578A (de)
NL (1) NL6607264A (de)
SE (1) SE335759B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2483701A1 (fr) * 1980-06-02 1981-12-04 Tdk Electronics Co Ltd Appareil de montage d'elements de circuits du type en pastille sur des cartes de circuits imprimes

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3709378A (en) * 1971-03-04 1973-01-09 Ibm Aligning and orienting apparatus
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US4593462A (en) * 1984-09-24 1986-06-10 Tdk Corporation Apparatus for automatically mounting chip-type circuit elements on substrate
US5788143A (en) * 1992-04-08 1998-08-04 International Business Machines Corporation Solder particle deposition
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US7686521B2 (en) * 2003-11-10 2010-03-30 Finisar Corporation Zero force socket for laser / photodiode alignment
JP4734857B2 (ja) * 2004-06-25 2011-07-27 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造装置
US7555832B2 (en) * 2007-03-19 2009-07-07 Infineon Technologies Ag Semiconductor chip attachment
TW201432319A (zh) * 2013-02-05 2014-08-16 Hon Hai Prec Ind Co Ltd 光纖連接器組裝裝置
CN104330549B (zh) * 2013-04-03 2017-01-25 艾博生物医药(杭州)有限公司 一种识别检测板的正反两面的装置及方法
JP6146266B2 (ja) * 2013-11-07 2017-06-14 富士通株式会社 電力供給機構及びラック型装置
SE538792C2 (en) * 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
CN118833902B (zh) * 2024-08-09 2026-08-11 江苏新纪元环保有限公司 一种可自动排污的循环净水设备及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494474A (en) * 1949-01-12 1950-01-10 Western Electric Co Apparatus for soldering lead wires to electrical units
FR1173478A (fr) * 1956-04-05 1959-02-25 Gen Electric Co Ltd Machine automatique notamment pour monter des éléments électriques sur des bases imprimées
NL98523C (de) * 1956-05-01
US2970370A (en) * 1957-11-19 1961-02-07 Philco Corp Fabrication of electrical devices
US2915201A (en) * 1958-02-12 1959-12-01 Sylvania Electric Prod Suction transfer mechanism
GB865924A (en) * 1958-06-19 1961-04-26 Gen Electric Co Ltd Improvements in or relating to automatic machines for mounting electrical componentson base members
US3056317A (en) * 1959-09-02 1962-10-02 Western Electric Co Article manipulating and processing apparatus
US3190523A (en) * 1960-09-27 1965-06-22 Philips Corp Component inserting machine
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
US3134167A (en) * 1962-06-08 1964-05-26 Warwick Mfg Corp Component inserting equipment
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine
US3314296A (en) * 1965-05-27 1967-04-18 Ibm Indexing drive mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2483701A1 (fr) * 1980-06-02 1981-12-04 Tdk Electronics Co Ltd Appareil de montage d'elements de circuits du type en pastille sur des cartes de circuits imprimes

Also Published As

Publication number Publication date
NL6607264A (de) 1966-11-28
FR1480578A (fr) 1967-05-12
US3499203A (en) 1970-03-10
DE1266839B (de) 1968-04-25
SE335759B (de) 1971-06-07

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Legal Events

Date Code Title Description
PL Patent ceased