SE453708B - Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta - Google Patents

Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta

Info

Publication number
SE453708B
SE453708B SE8501064A SE8501064A SE453708B SE 453708 B SE453708 B SE 453708B SE 8501064 A SE8501064 A SE 8501064A SE 8501064 A SE8501064 A SE 8501064A SE 453708 B SE453708 B SE 453708B
Authority
SE
Sweden
Prior art keywords
stencil
plate
negative pressure
hole
printing machine
Prior art date
Application number
SE8501064A
Other languages
English (en)
Swedish (sv)
Other versions
SE8501064L (sv
SE8501064D0 (sv
Inventor
S J D Ericsson
Original Assignee
Svecia Silkscreen Maskiner Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Svecia Silkscreen Maskiner Ab filed Critical Svecia Silkscreen Maskiner Ab
Priority to SE8501064A priority Critical patent/SE453708B/sv
Publication of SE8501064D0 publication Critical patent/SE8501064D0/xx
Priority to EP86850076A priority patent/EP0194247A3/de
Priority to JP4948786A priority patent/JPS61273963A/ja
Publication of SE8501064L publication Critical patent/SE8501064L/xx
Publication of SE453708B publication Critical patent/SE453708B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SE8501064A 1985-03-05 1985-03-05 Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta SE453708B (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE8501064A SE453708B (sv) 1985-03-05 1985-03-05 Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta
EP86850076A EP0194247A3 (de) 1985-03-05 1986-03-03 Siebdrucker zur Ausbildung einer Schicht leitenden Materials auf der inneren Oberfläche eines durch eine Leiterplatte führenden Loches
JP4948786A JPS61273963A (ja) 1985-03-05 1986-03-05 プレ−トを貫通する孔の内面に材料の層を設けるためのシルクスクリ−ンプリンタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8501064A SE453708B (sv) 1985-03-05 1985-03-05 Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta

Publications (3)

Publication Number Publication Date
SE8501064D0 SE8501064D0 (sv) 1985-03-05
SE8501064L SE8501064L (sv) 1986-09-06
SE453708B true SE453708B (sv) 1988-02-22

Family

ID=20359365

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8501064A SE453708B (sv) 1985-03-05 1985-03-05 Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta

Country Status (3)

Country Link
EP (1) EP0194247A3 (de)
JP (1) JPS61273963A (de)
SE (1) SE453708B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211992A (ja) * 1986-03-13 1987-09-17 北陸電気工業株式会社 回路基板のスル−ホ−ル接続部形成方法
US4919970A (en) * 1986-09-15 1990-04-24 International Business Machines Corporation Solder deposition control
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
JPS63163941U (de) * 1987-04-15 1988-10-26
EP0327298A3 (de) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparat zum selektiven Beschichten eines Teilstücks
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
JPH0494591A (ja) * 1990-08-10 1992-03-26 Cmk Corp スルーホールを有するプリント配線板の製造方法
IT1252381B (it) * 1991-11-12 1995-06-12 Occleppo Di Francesco Occleppo Dispositivo per la formazione d'una pellicola sulle pareti dei forellini nelle piastre per circuiti stampati
DE4318604A1 (de) * 1993-06-04 1994-12-08 Blaupunkt Werke Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
DE4439108C1 (de) * 1994-11-02 1996-04-11 Lpkf Cad Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten
DE19547124C2 (de) * 1995-12-16 2001-04-19 Lpkf D O O Drehschieberventil zur wahlweisen Druck- oder Saugluftbeaufschlagung
IT1289327B1 (it) * 1996-03-13 1998-10-02 So Ma Ci S Spa Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia
US6276055B1 (en) * 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
JP2004501513A (ja) 2000-05-31 2004-01-15 ハネウエル・インターナシヨナル・インコーポレーテツド 充填方法
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
WO2001093648A2 (en) 2000-05-31 2001-12-06 Honeywell International Inc. Filling device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
IT1137331B (it) * 1981-04-10 1986-09-10 Italtel Spa Metodo per rendere conduttivi fori passanti in supporti per circuiti elettrici
DE3372054D1 (en) * 1982-11-15 1987-07-16 Storno As A method of making a double-sided thick-film integrated circuit
BE896966A (nl) * 1983-06-06 1983-12-06 Bell Telephone Mfg Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Also Published As

Publication number Publication date
SE8501064L (sv) 1986-09-06
JPS61273963A (ja) 1986-12-04
EP0194247A3 (de) 1989-03-22
EP0194247A2 (de) 1986-09-10
SE8501064D0 (sv) 1985-03-05

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