SE505448C2 - Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring - Google Patents

Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring

Info

Publication number
SE505448C2
SE505448C2 SE9301825A SE9301825A SE505448C2 SE 505448 C2 SE505448 C2 SE 505448C2 SE 9301825 A SE9301825 A SE 9301825A SE 9301825 A SE9301825 A SE 9301825A SE 505448 C2 SE505448 C2 SE 505448C2
Authority
SE
Sweden
Prior art keywords
fuse
circuit board
metal layer
printed circuit
well
Prior art date
Application number
SE9301825A
Other languages
English (en)
Swedish (sv)
Other versions
SE9301825D0 (sv
SE9301825L (sv
Inventor
Stefan Carl Lennart Loef
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9301825A priority Critical patent/SE505448C2/sv
Publication of SE9301825D0 publication Critical patent/SE9301825D0/xx
Priority to AU63357/94A priority patent/AU672296B2/en
Priority to NO941963A priority patent/NO306036B1/no
Priority to EP94850094A priority patent/EP0626714B1/de
Priority to DE69402247T priority patent/DE69402247T2/de
Priority to AT94850094T priority patent/ATE150901T1/de
Priority to FI942492A priority patent/FI942492A7/fi
Priority to DK94850094.7T priority patent/DK0626714T3/da
Priority to ES94850094T priority patent/ES2102798T3/es
Priority to US08/249,987 priority patent/US5543774A/en
Publication of SE9301825L publication Critical patent/SE9301825L/xx
Publication of SE505448C2 publication Critical patent/SE505448C2/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02Manufacture of fuses
    • H01H69/022Manufacture of fuses of printed circuit fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046Fuses formed as printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10181Fuse
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49107Fuse making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Selective Calling Equipment (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SE9301825A 1993-05-28 1993-05-28 Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring SE505448C2 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9301825A SE505448C2 (sv) 1993-05-28 1993-05-28 Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring
AU63357/94A AU672296B2 (en) 1993-05-28 1994-05-26 A method and a device for protecting a printed board against overcurrents
NO941963A NO306036B1 (no) 1993-05-28 1994-05-26 Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström
US08/249,987 US5543774A (en) 1993-05-28 1994-05-27 Method and a device for protecting a printed circuit board against overcurrents
DE69402247T DE69402247T2 (de) 1993-05-28 1994-05-27 Verfahren zur Herstellung einer Sicherung für eine Leiterplatte und danach hergestellter Sicherung
EP94850094A EP0626714B1 (de) 1993-05-28 1994-05-27 Verfahren zur Herstellung einer Sicherung für eine Leiterplatte und danach hergestellter Sicherung
AT94850094T ATE150901T1 (de) 1993-05-28 1994-05-27 Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung
FI942492A FI942492A7 (fi) 1993-05-28 1994-05-27 Mentelmä ja laite maalikortin suojaamiseksi ylivirroilta
DK94850094.7T DK0626714T3 (da) 1993-05-28 1994-05-27 Fremgangsmåde ved fremstilling af en sikring til et trykt kredsløb og således fremstillet sikring.
ES94850094T ES2102798T3 (es) 1993-05-28 1994-05-27 Metodo de fabricar un fusible para una placa de circuito impreso y fusible producido por el metodo.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9301825A SE505448C2 (sv) 1993-05-28 1993-05-28 Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring

Publications (3)

Publication Number Publication Date
SE9301825D0 SE9301825D0 (sv) 1993-05-28
SE9301825L SE9301825L (sv) 1994-11-29
SE505448C2 true SE505448C2 (sv) 1997-09-01

Family

ID=20390084

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9301825A SE505448C2 (sv) 1993-05-28 1993-05-28 Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring

Country Status (10)

Country Link
US (1) US5543774A (de)
EP (1) EP0626714B1 (de)
AT (1) ATE150901T1 (de)
AU (1) AU672296B2 (de)
DE (1) DE69402247T2 (de)
DK (1) DK0626714T3 (de)
ES (1) ES2102798T3 (de)
FI (1) FI942492A7 (de)
NO (1) NO306036B1 (de)
SE (1) SE505448C2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914648A (en) * 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
US5760674A (en) * 1995-11-28 1998-06-02 International Business Machines Corporation Fusible links with improved interconnect structure
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
JP3812865B2 (ja) * 1998-09-21 2006-08-23 矢崎総業株式会社 電気回路の安全装置
US6456186B1 (en) * 1999-10-27 2002-09-24 Motorola, Inc. Multi-terminal fuse device
GB0001573D0 (en) * 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
US20030048620A1 (en) * 2000-03-14 2003-03-13 Kohshi Nishimura Printed-circuit board with fuse
DE10143277A1 (de) * 2001-09-04 2003-06-26 Siemens Ag Schutzschaltung für Kommunikationseinrichtungen
US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
JP3952271B2 (ja) * 2002-01-31 2007-08-01 富士通株式会社 半導体装置及びその製造方法
GB0307306D0 (en) * 2003-03-29 2003-05-07 Goodrich Control Sys Ltd Fuse arrangement
PL360332A1 (en) * 2003-05-26 2004-11-29 Abb Sp.Z O.O. High voltage high breaking capacity thin-layer fusible cut-out
JP2007508706A (ja) * 2003-10-17 2007-04-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ヒューズを含むプリント回路基板
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
TW200929310A (en) * 2007-12-21 2009-07-01 Chun-Chang Yen Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
DE102010063832B4 (de) * 2010-12-22 2020-08-13 Tridonic Gmbh & Co Kg Leiterbahnsicherung, Leiterplatte und Betriebsschaltung für Leuchtmittel mit der Leiterbahnsicherung
US10064266B2 (en) * 2011-07-19 2018-08-28 Whirlpool Corporation Circuit board having arc tracking protection
US9673012B2 (en) * 2012-05-16 2017-06-06 Littelfuse, Inc. Low-current fuse stamping method
JP2017204525A (ja) * 2016-05-10 2017-11-16 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及び電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2053881A5 (de) * 1969-07-22 1971-04-16 Avril Jean
IT1092128B (it) * 1977-01-27 1985-07-06 Bosch Gmbh Robert Dispositivo elettrico di sicurezza per tronchi di piste conduttrici in una disposizione di utilizzatore
US4140988A (en) * 1977-08-04 1979-02-20 Gould Inc. Electric fuse for small current intensities
US4394639A (en) * 1978-12-18 1983-07-19 Mcgalliard James D Printed circuit fuse assembly
US4296398A (en) * 1978-12-18 1981-10-20 Mcgalliard James D Printed circuit fuse assembly
US4376927A (en) * 1978-12-18 1983-03-15 Mcgalliard James D Printed circuit fuse assembly
JPS5649178U (de) * 1979-09-21 1981-05-01
US4356627A (en) * 1980-02-04 1982-11-02 Amp Incorporated Method of making circuit path conductors in plural planes
US5476970A (en) * 1984-02-16 1995-12-19 Velsicol Chemical Corporation Method for preparing aryl ketones
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
US5027101A (en) * 1987-01-22 1991-06-25 Morrill Jr Vaughan Sub-miniature fuse
US5254969A (en) * 1991-04-02 1993-10-19 Caddock Electronics, Inc. Resistor combination and method
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses

Also Published As

Publication number Publication date
EP0626714B1 (de) 1997-03-26
US5543774A (en) 1996-08-06
FI942492L (fi) 1994-11-29
FI942492A7 (fi) 1994-11-29
DE69402247T2 (de) 1997-07-10
AU6335794A (en) 1994-12-01
DK0626714T3 (da) 1997-10-13
FI942492A0 (fi) 1994-05-27
AU672296B2 (en) 1996-09-26
SE9301825D0 (sv) 1993-05-28
DE69402247D1 (de) 1997-04-30
NO306036B1 (no) 1999-09-06
NO941963L (no) 1994-11-29
NO941963D0 (no) 1994-05-26
ATE150901T1 (de) 1997-04-15
ES2102798T3 (es) 1997-08-01
SE9301825L (sv) 1994-11-29
EP0626714A1 (de) 1994-11-30

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