SE505448C2 - Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring - Google Patents
Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkringInfo
- Publication number
- SE505448C2 SE505448C2 SE9301825A SE9301825A SE505448C2 SE 505448 C2 SE505448 C2 SE 505448C2 SE 9301825 A SE9301825 A SE 9301825A SE 9301825 A SE9301825 A SE 9301825A SE 505448 C2 SE505448 C2 SE 505448C2
- Authority
- SE
- Sweden
- Prior art keywords
- fuse
- circuit board
- metal layer
- printed circuit
- well
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49107—Fuse making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
- Emergency Protection Circuit Devices (AREA)
- Selective Calling Equipment (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9301825A SE505448C2 (sv) | 1993-05-28 | 1993-05-28 | Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring |
| AU63357/94A AU672296B2 (en) | 1993-05-28 | 1994-05-26 | A method and a device for protecting a printed board against overcurrents |
| NO941963A NO306036B1 (no) | 1993-05-28 | 1994-05-26 | Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström |
| US08/249,987 US5543774A (en) | 1993-05-28 | 1994-05-27 | Method and a device for protecting a printed circuit board against overcurrents |
| DE69402247T DE69402247T2 (de) | 1993-05-28 | 1994-05-27 | Verfahren zur Herstellung einer Sicherung für eine Leiterplatte und danach hergestellter Sicherung |
| EP94850094A EP0626714B1 (de) | 1993-05-28 | 1994-05-27 | Verfahren zur Herstellung einer Sicherung für eine Leiterplatte und danach hergestellter Sicherung |
| AT94850094T ATE150901T1 (de) | 1993-05-28 | 1994-05-27 | Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung |
| FI942492A FI942492A7 (fi) | 1993-05-28 | 1994-05-27 | Mentelmä ja laite maalikortin suojaamiseksi ylivirroilta |
| DK94850094.7T DK0626714T3 (da) | 1993-05-28 | 1994-05-27 | Fremgangsmåde ved fremstilling af en sikring til et trykt kredsløb og således fremstillet sikring. |
| ES94850094T ES2102798T3 (es) | 1993-05-28 | 1994-05-27 | Metodo de fabricar un fusible para una placa de circuito impreso y fusible producido por el metodo. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9301825A SE505448C2 (sv) | 1993-05-28 | 1993-05-28 | Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9301825D0 SE9301825D0 (sv) | 1993-05-28 |
| SE9301825L SE9301825L (sv) | 1994-11-29 |
| SE505448C2 true SE505448C2 (sv) | 1997-09-01 |
Family
ID=20390084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9301825A SE505448C2 (sv) | 1993-05-28 | 1993-05-28 | Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US5543774A (de) |
| EP (1) | EP0626714B1 (de) |
| AT (1) | ATE150901T1 (de) |
| AU (1) | AU672296B2 (de) |
| DE (1) | DE69402247T2 (de) |
| DK (1) | DK0626714T3 (de) |
| ES (1) | ES2102798T3 (de) |
| FI (1) | FI942492A7 (de) |
| NO (1) | NO306036B1 (de) |
| SE (1) | SE505448C2 (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5914648A (en) * | 1995-03-07 | 1999-06-22 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
| US5760674A (en) * | 1995-11-28 | 1998-06-02 | International Business Machines Corporation | Fusible links with improved interconnect structure |
| US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
| US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
| US5923239A (en) * | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| JP3812865B2 (ja) * | 1998-09-21 | 2006-08-23 | 矢崎総業株式会社 | 電気回路の安全装置 |
| US6456186B1 (en) * | 1999-10-27 | 2002-09-24 | Motorola, Inc. | Multi-terminal fuse device |
| GB0001573D0 (en) * | 2000-01-24 | 2000-03-15 | Welwyn Components Ltd | Printed circuit board with fuse |
| US20030048620A1 (en) * | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
| DE10143277A1 (de) * | 2001-09-04 | 2003-06-26 | Siemens Ag | Schutzschaltung für Kommunikationseinrichtungen |
| US7385475B2 (en) * | 2002-01-10 | 2008-06-10 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| JP3952271B2 (ja) * | 2002-01-31 | 2007-08-01 | 富士通株式会社 | 半導体装置及びその製造方法 |
| GB0307306D0 (en) * | 2003-03-29 | 2003-05-07 | Goodrich Control Sys Ltd | Fuse arrangement |
| PL360332A1 (en) * | 2003-05-26 | 2004-11-29 | Abb Sp.Z O.O. | High voltage high breaking capacity thin-layer fusible cut-out |
| JP2007508706A (ja) * | 2003-10-17 | 2007-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ヒューズを含むプリント回路基板 |
| US7477130B2 (en) * | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| TW200929310A (en) * | 2007-12-21 | 2009-07-01 | Chun-Chang Yen | Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof |
| US8525633B2 (en) * | 2008-04-21 | 2013-09-03 | Littelfuse, Inc. | Fusible substrate |
| EP2408277B1 (de) * | 2010-07-16 | 2016-02-17 | Schurter AG | Sicherungselement |
| DE102010063832B4 (de) * | 2010-12-22 | 2020-08-13 | Tridonic Gmbh & Co Kg | Leiterbahnsicherung, Leiterplatte und Betriebsschaltung für Leuchtmittel mit der Leiterbahnsicherung |
| US10064266B2 (en) * | 2011-07-19 | 2018-08-28 | Whirlpool Corporation | Circuit board having arc tracking protection |
| US9673012B2 (en) * | 2012-05-16 | 2017-06-06 | Littelfuse, Inc. | Low-current fuse stamping method |
| JP2017204525A (ja) * | 2016-05-10 | 2017-11-16 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板及び電子部品 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2053881A5 (de) * | 1969-07-22 | 1971-04-16 | Avril Jean | |
| IT1092128B (it) * | 1977-01-27 | 1985-07-06 | Bosch Gmbh Robert | Dispositivo elettrico di sicurezza per tronchi di piste conduttrici in una disposizione di utilizzatore |
| US4140988A (en) * | 1977-08-04 | 1979-02-20 | Gould Inc. | Electric fuse for small current intensities |
| US4394639A (en) * | 1978-12-18 | 1983-07-19 | Mcgalliard James D | Printed circuit fuse assembly |
| US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
| US4376927A (en) * | 1978-12-18 | 1983-03-15 | Mcgalliard James D | Printed circuit fuse assembly |
| JPS5649178U (de) * | 1979-09-21 | 1981-05-01 | ||
| US4356627A (en) * | 1980-02-04 | 1982-11-02 | Amp Incorporated | Method of making circuit path conductors in plural planes |
| US5476970A (en) * | 1984-02-16 | 1995-12-19 | Velsicol Chemical Corporation | Method for preparing aryl ketones |
| DE3604882A1 (de) * | 1986-02-15 | 1987-08-20 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
| JPH0831303B2 (ja) * | 1986-12-01 | 1996-03-27 | オムロン株式会社 | チツプ型ヒユ−ズ |
| US5027101A (en) * | 1987-01-22 | 1991-06-25 | Morrill Jr Vaughan | Sub-miniature fuse |
| US5254969A (en) * | 1991-04-02 | 1993-10-19 | Caddock Electronics, Inc. | Resistor combination and method |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
-
1993
- 1993-05-28 SE SE9301825A patent/SE505448C2/sv not_active IP Right Cessation
-
1994
- 1994-05-26 NO NO941963A patent/NO306036B1/no not_active IP Right Cessation
- 1994-05-26 AU AU63357/94A patent/AU672296B2/en not_active Ceased
- 1994-05-27 DE DE69402247T patent/DE69402247T2/de not_active Expired - Fee Related
- 1994-05-27 EP EP94850094A patent/EP0626714B1/de not_active Expired - Lifetime
- 1994-05-27 US US08/249,987 patent/US5543774A/en not_active Expired - Lifetime
- 1994-05-27 FI FI942492A patent/FI942492A7/fi unknown
- 1994-05-27 AT AT94850094T patent/ATE150901T1/de not_active IP Right Cessation
- 1994-05-27 ES ES94850094T patent/ES2102798T3/es not_active Expired - Lifetime
- 1994-05-27 DK DK94850094.7T patent/DK0626714T3/da active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0626714B1 (de) | 1997-03-26 |
| US5543774A (en) | 1996-08-06 |
| FI942492L (fi) | 1994-11-29 |
| FI942492A7 (fi) | 1994-11-29 |
| DE69402247T2 (de) | 1997-07-10 |
| AU6335794A (en) | 1994-12-01 |
| DK0626714T3 (da) | 1997-10-13 |
| FI942492A0 (fi) | 1994-05-27 |
| AU672296B2 (en) | 1996-09-26 |
| SE9301825D0 (sv) | 1993-05-28 |
| DE69402247D1 (de) | 1997-04-30 |
| NO306036B1 (no) | 1999-09-06 |
| NO941963L (no) | 1994-11-29 |
| NO941963D0 (no) | 1994-05-26 |
| ATE150901T1 (de) | 1997-04-15 |
| ES2102798T3 (es) | 1997-08-01 |
| SE9301825L (sv) | 1994-11-29 |
| EP0626714A1 (de) | 1994-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |