SE515607C2 - Anordning och metod vid tillverkning av strukturer - Google Patents
Anordning och metod vid tillverkning av strukturerInfo
- Publication number
- SE515607C2 SE515607C2 SE9904517A SE9904517A SE515607C2 SE 515607 C2 SE515607 C2 SE 515607C2 SE 9904517 A SE9904517 A SE 9904517A SE 9904517 A SE9904517 A SE 9904517A SE 515607 C2 SE515607 C2 SE 515607C2
- Authority
- SE
- Sweden
- Prior art keywords
- substrate
- template
- support plate
- membrane
- main part
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title description 11
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000012528 membrane Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 238000001127 nanoimprint lithography Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 4
- 239000010720 hydraulic oil Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000001459 lithography Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 239000006091 Macor Substances 0.000 description 1
- 101100202333 Mus musculus Slc6a12 gene Proteins 0.000 description 1
- 101100202340 Rattus norvegicus Slc6a13 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- UJXZVRRCKFUQKG-UHFFFAOYSA-K indium(3+);phosphate Chemical compound [In+3].[O-]P([O-])([O-])=O UJXZVRRCKFUQKG-UHFFFAOYSA-K 0.000 description 1
- -1 lu fi Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/06—Lithographic printing
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Glass Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9904517A SE515607C2 (sv) | 1999-12-10 | 1999-12-10 | Anordning och metod vid tillverkning av strukturer |
| JP2001544087A JP3862216B2 (ja) | 1999-12-10 | 2000-12-04 | 構造物の製造に関する装置および方法 |
| PCT/SE2000/002417 WO2001042858A1 (en) | 1999-12-10 | 2000-12-04 | Device and method in connection with the production of structures |
| AU20362/01A AU2036201A (en) | 1999-12-10 | 2000-12-04 | Device and method in connection with the production of structures |
| DE60029827T DE60029827T2 (de) | 1999-12-10 | 2000-12-04 | Vorrichtung und verfahren in zusammenhang mit der herstellung von strukturen |
| AT00983631T ATE335223T1 (de) | 1999-12-10 | 2000-12-04 | Vorrichtung und verfahren in zusammenhang mit der herstellung von strukturen |
| EP00983631A EP1244939B1 (de) | 1999-12-10 | 2000-12-04 | Vorrichtung und verfahren in zusammenhang mit der herstellung von strukturen |
| US10/149,072 US7195734B2 (en) | 1999-12-10 | 2000-12-04 | Device and method in connection with the production of structures |
| HK03104958.9A HK1052750B (zh) | 1999-12-10 | 2000-12-04 | 用於纹理制作的装置与方法 |
| CNB008169896A CN1260615C (zh) | 1999-12-10 | 2000-12-04 | 用于纹理制作的装置与方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9904517A SE515607C2 (sv) | 1999-12-10 | 1999-12-10 | Anordning och metod vid tillverkning av strukturer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9904517D0 SE9904517D0 (sv) | 1999-12-10 |
| SE9904517L SE9904517L (sv) | 2001-06-11 |
| SE515607C2 true SE515607C2 (sv) | 2001-09-10 |
Family
ID=20418070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9904517A SE515607C2 (sv) | 1999-12-10 | 1999-12-10 | Anordning och metod vid tillverkning av strukturer |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7195734B2 (de) |
| EP (1) | EP1244939B1 (de) |
| JP (1) | JP3862216B2 (de) |
| CN (1) | CN1260615C (de) |
| AT (1) | ATE335223T1 (de) |
| AU (1) | AU2036201A (de) |
| DE (1) | DE60029827T2 (de) |
| HK (1) | HK1052750B (de) |
| SE (1) | SE515607C2 (de) |
| WO (1) | WO2001042858A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7041228B2 (en) | 2000-04-18 | 2006-05-09 | Obducat Aktiebolag | Substrate for and a process in connection with the product of structures |
Families Citing this family (157)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
| US7322287B2 (en) * | 2000-07-18 | 2008-01-29 | Nanonex Corporation | Apparatus for fluid pressure imprint lithography |
| US7635262B2 (en) | 2000-07-18 | 2009-12-22 | Princeton University | Lithographic apparatus for fluid pressure imprint lithography |
| US20080213418A1 (en) * | 2000-07-18 | 2008-09-04 | Hua Tan | Align-transfer-imprint system for imprint lithogrphy |
| CN100365507C (zh) * | 2000-10-12 | 2008-01-30 | 德克萨斯州大学系统董事会 | 用于室温下低压微刻痕和毫微刻痕光刻的模板 |
| SE523309E (sv) | 2001-06-15 | 2010-03-02 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
| US7144539B2 (en) | 2002-04-04 | 2006-12-05 | Obducat Ab | Imprint method and device |
| ATE439969T1 (de) * | 2002-04-24 | 2009-09-15 | Obducat Ab | Vorrichtung und verfahren zum übertragen eines musters auf ein substrat |
| AU2003241245A1 (en) * | 2002-06-07 | 2003-12-22 | Obducat Ab | Method for transferring a pattern |
| US7252492B2 (en) | 2002-06-20 | 2007-08-07 | Obducat Ab | Devices and methods for aligning a stamp and a substrate |
| US20080160129A1 (en) * | 2006-05-11 | 2008-07-03 | Molecular Imprints, Inc. | Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template |
| WO2004006019A1 (en) * | 2002-07-08 | 2004-01-15 | Obducat Ab | A method and a stamp for transferring a pattern to a substrate |
| JP2005537656A (ja) * | 2002-08-27 | 2005-12-08 | オブデュキャット、アクチボラグ | 対象物にパターンを転写するための装置 |
| US6939120B1 (en) | 2002-09-12 | 2005-09-06 | Komag, Inc. | Disk alignment apparatus and method for patterned media production |
| EP1550109B1 (de) * | 2002-10-03 | 2007-02-14 | Koninklijke Philips Electronics N.V. | Speichersystem mit einem elektromagnetischen array |
| KR100568581B1 (ko) * | 2003-04-14 | 2006-04-07 | 주식회사 미뉴타텍 | 미세패턴 형성 몰드용 조성물 및 이로부터 제작된 몰드 |
| TW568349U (en) | 2003-05-02 | 2003-12-21 | Ind Tech Res Inst | Parallelism adjusting device for nano-transferring |
| TW570290U (en) | 2003-05-02 | 2004-01-01 | Ind Tech Res Inst | Uniform pressing device for nanometer transfer-print |
| ATE501464T1 (de) * | 2003-11-21 | 2011-03-15 | Obducat Ab | Nanoimprint lithographie in mehrschichtsystemem |
| JP2005153091A (ja) * | 2003-11-27 | 2005-06-16 | Hitachi Ltd | 転写方法及び転写装置 |
| JP2005153113A (ja) * | 2003-11-28 | 2005-06-16 | Ricoh Opt Ind Co Ltd | ナノプリントを用いた微細３次元構造体の製造方法及び微細３次元構造体 |
| KR100974144B1 (ko) * | 2003-12-05 | 2010-08-04 | 오브듀캇 아베 | 대면적 리소그래피용 장치 및 방법 |
| EP1538482B1 (de) * | 2003-12-05 | 2016-02-17 | Obducat AB | Gerät und Methode für grossflÀ¤chige Lithographie |
| KR20060128886A (ko) * | 2003-12-11 | 2006-12-14 | 노우코우다이 티엘오 가부시키가이샤 | 나노임프린트를 이용하는 패턴 형성 방법 및 상기 방법을실행하는 장치 |
| US7686606B2 (en) | 2004-01-20 | 2010-03-30 | Wd Media, Inc. | Imprint embossing alignment system |
| KR100558754B1 (ko) * | 2004-02-24 | 2006-03-10 | 한국기계연구원 | Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치 |
| US7730834B2 (en) * | 2004-03-04 | 2010-06-08 | Asml Netherlands B.V. | Printing apparatus and device manufacturing method |
| WO2005093737A1 (ja) * | 2004-03-29 | 2005-10-06 | Pioneer Corporation | パターン転写装置及びパターン転写方法 |
| US7195733B2 (en) * | 2004-04-27 | 2007-03-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
| EP1594001B1 (de) * | 2004-05-07 | 2015-12-30 | Obducat AB | Gerät und Verfahren für die Imprint-Lithographie |
| TWI243796B (en) * | 2004-06-08 | 2005-11-21 | Ind Tech Res Inst | Device of nano-structure imprint for pattern transfer and method of the same |
| JP4574240B2 (ja) * | 2004-06-11 | 2010-11-04 | キヤノン株式会社 | 加工装置、加工方法、デバイス製造方法 |
| CN1716091B (zh) * | 2004-07-02 | 2010-04-28 | 财团法人工业技术研究院 | 一种微纳米结构图案的转印装置及方法 |
| US20060027036A1 (en) * | 2004-08-05 | 2006-02-09 | Biggs Todd L | Methods and apparatuses for imprinting substrates |
| US20060177634A1 (en) | 2004-09-01 | 2006-08-10 | John Lazar | Activator means for pre-applied adhesives |
| US7641468B2 (en) | 2004-09-01 | 2010-01-05 | Hewlett-Packard Development Company, L.P. | Imprint lithography apparatus and method employing an effective pressure |
| CN100395121C (zh) * | 2004-11-19 | 2008-06-18 | 鸿富锦精密工业（深圳）有限公司 | 热压印方法 |
| JP2006165371A (ja) * | 2004-12-09 | 2006-06-22 | Canon Inc | 転写装置およびデバイス製造方法 |
| US7676088B2 (en) * | 2004-12-23 | 2010-03-09 | Asml Netherlands B.V. | Imprint lithography |
| US7490547B2 (en) * | 2004-12-30 | 2009-02-17 | Asml Netherlands B.V. | Imprint lithography |
| US7686970B2 (en) * | 2004-12-30 | 2010-03-30 | Asml Netherlands B.V. | Imprint lithography |
| US20060144814A1 (en) * | 2004-12-30 | 2006-07-06 | Asml Netherlands B.V. | Imprint lithography |
| US20060144274A1 (en) * | 2004-12-30 | 2006-07-06 | Asml Netherlands B.V. | Imprint lithography |
| US7354698B2 (en) * | 2005-01-07 | 2008-04-08 | Asml Netherlands B.V. | Imprint lithography |
| US7922474B2 (en) * | 2005-02-17 | 2011-04-12 | Asml Netherlands B.V. | Imprint lithography |
| US7713052B2 (en) * | 2005-02-25 | 2010-05-11 | Sumitomo Electric Industries, Ltd. | Processing method of fine structure and processing equipment for fine structure |
| US7523701B2 (en) | 2005-03-07 | 2009-04-28 | Asml Netherlands B.V. | Imprint lithography method and apparatus |
| KR100729427B1 (ko) | 2005-03-07 | 2007-06-15 | 주식회사 디엠에스 | 미세패턴 형성장치 |
| CN1831644B (zh) * | 2005-03-07 | 2010-12-22 | 财团法人工业技术研究院 | 微纳米转印装置 |
| US7762186B2 (en) | 2005-04-19 | 2010-07-27 | Asml Netherlands B.V. | Imprint lithography |
| US7611348B2 (en) * | 2005-04-19 | 2009-11-03 | Asml Netherlands B.V. | Imprint lithography |
| TWI271777B (en) * | 2005-04-27 | 2007-01-21 | Ind Tech Res Inst | Uniform pressing micro-nano transfer printing apparatus |
| KR100717971B1 (ko) | 2005-04-29 | 2007-05-14 | 주식회사 에이디피엔지니어링 | 패턴 임프린트 장치 |
| CN100505147C (zh) * | 2005-04-30 | 2009-06-24 | 财团法人工业技术研究院 | 用于微纳米转印的均压装置 |
| US7442029B2 (en) | 2005-05-16 | 2008-10-28 | Asml Netherlands B.V. | Imprint lithography |
| JP4596981B2 (ja) * | 2005-05-24 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | インプリント装置、及び微細構造転写方法 |
| US7708924B2 (en) * | 2005-07-21 | 2010-05-04 | Asml Netherlands B.V. | Imprint lithography |
| US7692771B2 (en) * | 2005-05-27 | 2010-04-06 | Asml Netherlands B.V. | Imprint lithography |
| GB2426486A (en) * | 2005-05-27 | 2006-11-29 | Microsaic Systems Ltd | Self-aligning micro-contact print engine |
| US20060267231A1 (en) * | 2005-05-27 | 2006-11-30 | Asml Netherlands B.V. | Imprint lithography |
| US7418902B2 (en) * | 2005-05-31 | 2008-09-02 | Asml Netherlands B.V. | Imprint lithography including alignment |
| JP3958344B2 (ja) | 2005-06-07 | 2007-08-15 | キヤノン株式会社 | インプリント装置、インプリント方法及びチップの製造方法 |
| US7927089B2 (en) * | 2005-06-08 | 2011-04-19 | Canon Kabushiki Kaisha | Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method |
| WO2006131153A1 (en) * | 2005-06-10 | 2006-12-14 | Obducat Ab | Pattern replication with intermediate stamp |
| US7854873B2 (en) | 2005-06-10 | 2010-12-21 | Obducat Ab | Imprint stamp comprising cyclic olefin copolymer |
| US20080202360A1 (en) * | 2005-06-13 | 2008-08-28 | Korea Institute Of Machinery & Materials | Imprinting Apparatus For Forming Pattern at Uniform Contact by Additional Constant Pressure |
| US7377764B2 (en) * | 2005-06-13 | 2008-05-27 | Asml Netherlands B.V. | Imprint lithography |
| US20070023976A1 (en) * | 2005-07-26 | 2007-02-01 | Asml Netherlands B.V. | Imprint lithography |
| US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
| EP1764648B1 (de) * | 2005-09-14 | 2012-05-23 | Thallner, Erich, Dipl.-Ing. | Stempel mit einer Nanostempelstruktur sowie Vorrichtung und Verfahren zu dessen Herstellung |
| US7878791B2 (en) * | 2005-11-04 | 2011-02-01 | Asml Netherlands B.V. | Imprint lithography |
| US8011915B2 (en) | 2005-11-04 | 2011-09-06 | Asml Netherlands B.V. | Imprint lithography |
| US7906058B2 (en) * | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
| MY144847A (en) | 2005-12-08 | 2011-11-30 | Molecular Imprints Inc | Method and system for double-sided patterning of substrates |
| ATE549294T1 (de) * | 2005-12-09 | 2012-03-15 | Obducat Ab | Vorrichtung und verfahren zum transfer von mustern mit zwischenstempel |
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| IT1294944B1 (it) * | 1997-08-01 | 1999-04-23 | Sacmi | Metodo per formare piastrelle ceramiche di grandi dimensioni mediante stampi parzialmente isostatici, e dispositivo per attuare il metodo. |
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- 1999-12-10 SE SE9904517A patent/SE515607C2/sv not_active IP Right Cessation
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2000
- 2000-12-04 CN CNB008169896A patent/CN1260615C/zh not_active Expired - Lifetime
- 2000-12-04 JP JP2001544087A patent/JP3862216B2/ja not_active Expired - Fee Related
- 2000-12-04 DE DE60029827T patent/DE60029827T2/de not_active Expired - Lifetime
- 2000-12-04 WO PCT/SE2000/002417 patent/WO2001042858A1/en not_active Ceased
- 2000-12-04 AT AT00983631T patent/ATE335223T1/de active
- 2000-12-04 HK HK03104958.9A patent/HK1052750B/zh not_active IP Right Cessation
- 2000-12-04 AU AU20362/01A patent/AU2036201A/en not_active Abandoned
- 2000-12-04 EP EP00983631A patent/EP1244939B1/de not_active Expired - Lifetime
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7041228B2 (en) | 2000-04-18 | 2006-05-09 | Obducat Aktiebolag | Substrate for and a process in connection with the product of structures |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1052750A1 (en) | 2003-09-26 |
| JP2003516644A (ja) | 2003-05-13 |
| SE9904517L (sv) | 2001-06-11 |
| CN1260615C (zh) | 2006-06-21 |
| AU2036201A (en) | 2001-06-18 |
| DE60029827T2 (de) | 2007-02-22 |
| JP3862216B2 (ja) | 2006-12-27 |
| US7195734B2 (en) | 2007-03-27 |
| WO2001042858A1 (en) | 2001-06-14 |
| ATE335223T1 (de) | 2006-08-15 |
| HK1052750B (zh) | 2006-09-22 |
| SE9904517D0 (sv) | 1999-12-10 |
| EP1244939A1 (de) | 2002-10-02 |
| EP1244939B1 (de) | 2006-08-02 |
| DE60029827D1 (de) | 2006-09-14 |
| US20030159608A1 (en) | 2003-08-28 |
| CN1409832A (zh) | 2003-04-09 |
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