SE522521C2 - Förfarande, system och arrangemang för hantering av komponenttejper - Google Patents

Förfarande, system och arrangemang för hantering av komponenttejper

Info

Publication number
SE522521C2
SE522521C2 SE0102977A SE0102977A SE522521C2 SE 522521 C2 SE522521 C2 SE 522521C2 SE 0102977 A SE0102977 A SE 0102977A SE 0102977 A SE0102977 A SE 0102977A SE 522521 C2 SE522521 C2 SE 522521C2
Authority
SE
Sweden
Prior art keywords
tape
component
carrier
magazine
rails
Prior art date
Application number
SE0102977A
Other languages
English (en)
Swedish (sv)
Other versions
SE0102977D0 (sv
Inventor
Eric Eskaang
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0102977A priority Critical patent/SE522521C2/sv
Publication of SE0102977D0 publication Critical patent/SE0102977D0/xx
Priority to DE60236747T priority patent/DE60236747D1/de
Priority to US10/235,547 priority patent/US6869040B2/en
Priority to EP02798068A priority patent/EP1438884B1/de
Priority to AT02798068T priority patent/ATE471656T1/de
Priority to CN02817086.5A priority patent/CN1270593C/zh
Priority to PCT/SE2002/001604 priority patent/WO2003024181A1/en
Priority to JP2003528086A priority patent/JP4237621B2/ja
Publication of SE522521C2 publication Critical patent/SE522521C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/52—Plural diverse manufacturing apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Replacement Of Web Rolls (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
SE0102977A 2001-09-07 2001-09-07 Förfarande, system och arrangemang för hantering av komponenttejper SE522521C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0102977A SE522521C2 (sv) 2001-09-07 2001-09-07 Förfarande, system och arrangemang för hantering av komponenttejper
DE60236747T DE60236747D1 (de) 2001-09-07 2002-09-06 Verfahren, system und anordnung zur behandlung von komponentenbändern
US10/235,547 US6869040B2 (en) 2001-09-07 2002-09-06 Method, system and arrangement for handling component tapes
EP02798068A EP1438884B1 (de) 2001-09-07 2002-09-06 Verfahren, system und anordnung zur behandlung von komponentenbändern
AT02798068T ATE471656T1 (de) 2001-09-07 2002-09-06 Verfahren, system und anordnung zur behandlung von komponentenbändern
CN02817086.5A CN1270593C (zh) 2001-09-07 2002-09-06 用于操作元件带的方法、系统和装置
PCT/SE2002/001604 WO2003024181A1 (en) 2001-09-07 2002-09-06 Method, system and arrangement for handling component tapes
JP2003528086A JP4237621B2 (ja) 2001-09-07 2002-09-06 電子部品テープを取り扱うための方法、システム、および配置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102977A SE522521C2 (sv) 2001-09-07 2001-09-07 Förfarande, system och arrangemang för hantering av komponenttejper

Publications (2)

Publication Number Publication Date
SE0102977D0 SE0102977D0 (sv) 2001-09-07
SE522521C2 true SE522521C2 (sv) 2004-02-10

Family

ID=20285259

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102977A SE522521C2 (sv) 2001-09-07 2001-09-07 Förfarande, system och arrangemang för hantering av komponenttejper

Country Status (8)

Country Link
US (1) US6869040B2 (de)
EP (1) EP1438884B1 (de)
JP (1) JP4237621B2 (de)
CN (1) CN1270593C (de)
AT (1) ATE471656T1 (de)
DE (1) DE60236747D1 (de)
SE (1) SE522521C2 (de)
WO (1) WO2003024181A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITFI20050232A1 (it) * 2005-11-14 2007-05-15 Lcm S R L Caricatore multiplo lineare per macchine di posizionamento automatico di componenti elettronici smd
JP4853261B2 (ja) * 2006-12-05 2012-01-11 パナソニック株式会社 テープフィーダおよび電子部品実装装置
EP1976364B1 (de) * 2007-03-30 2011-09-07 Mydata Automation AB Mechanische Schnittstelle
DE102007017120A1 (de) 2007-04-11 2008-10-23 Siemens Ag Zuordnung zwischen Gebinde-Aufnahmefach und Bauelement-Zuführvorrichtung mittels Führungselement
US8544652B2 (en) * 2007-06-19 2013-10-01 Hover-Davis, Inc. Component tape
JP5357743B2 (ja) 2009-12-26 2013-12-04 富士機械製造株式会社 電子回路部品供給装置
JP5445478B2 (ja) * 2011-01-25 2014-03-19 パナソニック株式会社 テープフィーダ
JP5941254B2 (ja) * 2011-08-28 2016-06-29 ヤマハ発動機株式会社 部品供給装置
JP5846629B2 (ja) * 2011-10-28 2016-01-20 富士機械製造株式会社 テープフィーダ
JP5846630B2 (ja) * 2011-11-01 2016-01-20 富士機械製造株式会社 テープフィーダ
CN104206049B (zh) * 2012-02-27 2017-10-13 麦克罗尼克迈达塔有限责任公司 用于处理部件带的承载器设备、系统和方法
CN108200759B (zh) * 2012-03-12 2020-04-28 麦克罗尼克迈达塔有限责任公司 用于部件的自动存储设备
WO2013136440A1 (ja) * 2012-03-13 2013-09-19 富士機械製造株式会社 部品実装機のフィーダ管理システム
WO2015040085A1 (en) 2013-09-18 2015-03-26 Mycronic AB Method, system and device for identifying a bin in an smt system
SG11201610163QA (en) * 2014-08-05 2017-01-27 Semiconductor Tech & Instr Inc Multiple tape reel handling apparatus
CN112004398A (zh) * 2015-02-19 2020-11-27 迈康尼股份公司 用于在表面安装技术系统中提供信息的方法、系统和装置
JP6463990B2 (ja) * 2015-02-26 2019-02-06 ハンファエアロスペース株式会社Ｈａｎｗｈａ Ａｅｒｏｓｐａｃｅ Ｃｏ．，Ｌｔｄ． リールストッカ及び部品供給台車
CN107409484B (zh) * 2015-03-03 2019-12-31 株式会社富士 带盘保持装置
US10902161B2 (en) * 2015-03-06 2021-01-26 Fuji Corporation Method for optimizing component type arrangement and apparatus for optimizing component type arrangement
US10772249B2 (en) 2015-03-18 2020-09-08 Mycronic AB Method, system and device for providing and changing information related to an SMT job
CN107926138B (zh) * 2015-08-25 2020-02-14 株式会社富士 元件安装线
US10660249B2 (en) * 2015-09-09 2020-05-19 Fuji Corporation Separate installation-type reel holding device
WO2017109846A1 (ja) * 2015-12-22 2017-06-29 富士機械製造株式会社 リール保持装置
CN112772012B (zh) * 2018-10-15 2022-08-09 松下知识产权经营株式会社 安装基板制造系统、部件安装系统以及收纳体移送方法
WO2020084663A1 (ja) * 2018-10-22 2020-04-30 株式会社Ｆｕｊｉ 電気部品供給装置、および電気部品供給方法
EP3644701A1 (de) * 2018-10-23 2020-04-29 Mycronic AB Halterungsanordnung
EP3820264A1 (de) * 2019-11-11 2021-05-12 Mycronic AB Bandführung zum führen eines komponentenbandes
US20230286748A1 (en) * 2022-03-11 2023-09-14 Accu-Assembly Incorporated Vertical component storage system
US12089339B2 (en) * 2022-09-20 2024-09-10 Inovaxe Corporation Intelligent surface mount technology reel storage system
TWI909646B (zh) * 2024-08-23 2025-12-21 技高工業股份有限公司 供料器裝卸設備及其供料器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662948B2 (ja) 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
US4819699A (en) 1987-02-24 1989-04-11 Alliance Automation Systems, Inc. Cartridge feed system for automatic PCB loading machine
GB2237563B (en) * 1989-10-30 1994-06-01 Mitel Telecom Ltd Method and apparatus for use in handling magazines
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP3809251B2 (ja) * 1997-07-09 2006-08-16 富士機械製造株式会社 回路部品供給方法および供給システム
JP4117859B2 (ja) 1998-06-24 2008-07-16 富士機械製造株式会社 部品供給ユニット
AU2137000A (en) 1998-12-22 2000-07-12 Mydata Automation Ab Method for transferring component tape information to a component mounting machine and means therefore
DE69912002T2 (de) 1998-12-22 2004-06-24 Mydata Automation Ab Bandführungsvorrichtung und magazin für eine bauteil-maschine
US6402452B1 (en) 1999-04-26 2002-06-11 Hover-Davis, Inc. Carrier tape feeder with cover tape parting
US6619526B1 (en) 2000-01-26 2003-09-16 Tyco Electronics Logistics Ag High-speed tape feeder for pick and place machines

Also Published As

Publication number Publication date
EP1438884B1 (de) 2010-06-16
DE60236747D1 (de) 2010-07-29
SE0102977D0 (sv) 2001-09-07
JP2005503032A (ja) 2005-01-27
US20030046808A1 (en) 2003-03-13
CN1270593C (zh) 2006-08-16
WO2003024181A1 (en) 2003-03-20
ATE471656T1 (de) 2010-07-15
JP4237621B2 (ja) 2009-03-11
EP1438884A1 (de) 2004-07-21
US6869040B2 (en) 2005-03-22
CN1550127A (zh) 2004-11-24

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