SE7906343L - Sett vid diffusionsbindning genom termokompression - Google Patents

Sett vid diffusionsbindning genom termokompression

Info

Publication number
SE7906343L
SE7906343L SE7906343A SE7906343A SE7906343L SE 7906343 L SE7906343 L SE 7906343L SE 7906343 A SE7906343 A SE 7906343A SE 7906343 A SE7906343 A SE 7906343A SE 7906343 L SE7906343 L SE 7906343L
Authority
SE
Sweden
Prior art keywords
metallic member
compliant
metallic
thermocompression
irregularities
Prior art date
Application number
SE7906343A
Other languages
Unknown language ( )
English (en)
Other versions
SE439894B (sv
Inventor
D E Houston
J A Loughran
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7906343L publication Critical patent/SE7906343L/sv
Publication of SE439894B publication Critical patent/SE439894B/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
SE7906343A 1978-07-24 1979-07-24 Sett vid diffusionsbindning genom termokompression SE439894B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/927,346 US4204628A (en) 1978-07-24 1978-07-24 Method for thermo-compression diffusion bonding

Publications (2)

Publication Number Publication Date
SE7906343L true SE7906343L (sv) 1980-01-25
SE439894B SE439894B (sv) 1985-07-08

Family

ID=25454614

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7906343A SE439894B (sv) 1978-07-24 1979-07-24 Sett vid diffusionsbindning genom termokompression

Country Status (5)

Country Link
US (1) US4204628A (sv)
JP (1) JPS5533890A (sv)
DE (1) DE2928943C2 (sv)
FR (1) FR2433387B1 (sv)
SE (1) SE439894B (sv)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315591A (en) * 1979-03-08 1982-02-16 General Electric Company Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer
US4257156A (en) * 1979-03-09 1981-03-24 General Electric Company Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
US4444352A (en) * 1981-09-17 1984-04-24 General Electric Company Method of thermo-compression diffusion bonding together metal surfaces
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
JPH0231014Y2 (sv) * 1984-12-12 1990-08-21
US4952999A (en) * 1988-04-26 1990-08-28 National Semiconductor Corporation Method and apparatus for reducing die stress
US5139887A (en) * 1988-12-27 1992-08-18 Barnes Group, Inc. Superplastically formed cellular article
US4934580A (en) * 1988-12-27 1990-06-19 Barnes Group, Inc. Method of making superplastically formed and diffusion bonded articles and the articles so made
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5848746A (en) * 1996-01-16 1998-12-15 The Regents Of The University Of California Load regulating expansion fixture
US6129261A (en) † 1996-09-26 2000-10-10 The Boeing Company Diffusion bonding of metals
US7955504B1 (en) 2004-10-06 2011-06-07 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Microfluidic devices, particularly filtration devices comprising polymeric membranes, and method for their manufacture and use
US20090250442A1 (en) * 2007-12-03 2009-10-08 Eerc Foundation Joining of difficult-to-weld materials
US8801922B2 (en) 2009-06-24 2014-08-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Dialysis system
US20100326914A1 (en) * 2009-06-24 2010-12-30 State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon Microfluidic devices
WO2011069110A1 (en) * 2009-12-05 2011-06-09 Home Dialysis Plus, Ltd. Modular dialysis system
US8753515B2 (en) 2009-12-05 2014-06-17 Home Dialysis Plus, Ltd. Dialysis system with ultrafiltration control
US8580161B2 (en) 2010-05-04 2013-11-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluidic devices comprising photocontrollable units
US8501009B2 (en) 2010-06-07 2013-08-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluid purification system
ES2640953T3 (es) 2011-10-07 2017-11-07 Outset Medical, Inc. Purificación de líquido de intercambio de calor para un sistema de diálisis
CA3110802C (en) 2013-03-15 2023-05-23 All-Clad Metalcrafters Llc Cookware with selectively bonded layers
US10081163B2 (en) 2013-03-15 2018-09-25 All-Clad Metalcrafters Llc Cooking utensil having a graphite core
US9585514B2 (en) 2013-03-15 2017-03-07 All-Clad Metalsrafters, LLC Heat zone pan
EP3838308A1 (en) 2014-04-29 2021-06-23 Outset Medical, Inc. Dialysis system and methods
JP7025408B2 (ja) 2016-08-19 2022-02-24 アウトセット・メディカル・インコーポレイテッド 腹膜透析システム及び方法
BR112021003168A2 (pt) 2018-08-23 2021-05-11 Outset Medical, Inc. métodos para preparar um conjunto de tubos e um dialisador, para testar vazamentos, para preparar um conjunto de tubos, para melhorar a durabilidade e operação de uma ou mais bombas de deslocamento e para prover terapia de diálise, sistema de diálise, e, acessório de queima de bomba
US11364706B2 (en) 2018-12-19 2022-06-21 All-Clad Metalcrafters, L.L.C. Cookware having a graphite core
EP3962549B1 (en) 2019-04-30 2025-11-05 Outset Medical, Inc. Dialysis system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH182135A (de) * 1935-04-11 1936-01-31 Ostendorf Peter Verfahren zum Plattieren von Blechen, Platten usw. aus Metall.
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device
US3650454A (en) * 1967-07-06 1972-03-21 Western Electric Co Device for bonding with a compliant medium
US3633267A (en) * 1968-12-27 1972-01-11 Boeing Co Method of diffusion bonding honeycomb composite structures
GB1365289A (en) * 1970-12-22 1974-08-29 Plessey Co Ltd Infrared soldering apparatus
US3886647A (en) * 1971-07-07 1975-06-03 Trw Inc Method of making erosion resistant articles
DE2418106A1 (de) * 1974-04-13 1975-11-06 Siemens Ag Trockenloetverfahren zum hochfesten verbinden von metallfolien mit keramiken, glaesern und anderen oxidischen werkstoffen

Also Published As

Publication number Publication date
FR2433387B1 (fr) 1986-07-11
US4204628A (en) 1980-05-27
JPS5533890A (en) 1980-03-10
SE439894B (sv) 1985-07-08
FR2433387A1 (fr) 1980-03-14
DE2928943C2 (de) 1986-08-14
DE2928943A1 (de) 1980-02-07
JPS6224189B2 (sv) 1987-05-27

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