SE8100202L - PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY - Google Patents
PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOYInfo
- Publication number
- SE8100202L SE8100202L SE8100202A SE8100202A SE8100202L SE 8100202 L SE8100202 L SE 8100202L SE 8100202 A SE8100202 A SE 8100202A SE 8100202 A SE8100202 A SE 8100202A SE 8100202 L SE8100202 L SE 8100202L
- Authority
- SE
- Sweden
- Prior art keywords
- copper
- bath
- copper alloy
- procedure kit
- anodic degradation
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 230000015556 catabolic process Effects 0.000 title 1
- 238000006731 degradation reaction Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000003513 alkali Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/22—Polishing of heavy metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Articles of copper or copper alloy are anodically deburred in an acid solution (pH not above 6.5) containing: water 100 to 300 g/l; alkali sulphamate 50 to 150 g/l; polyhydric alcohol 400 to 800; alkali nitrate 50 to 150 g/l. The bath voltage is to be within the range of 5 to 30 volts, and the current density (at the anode) is to be within the range of 2 to 50 amperes per square decimeter.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8100202A SE425103B (en) | 1981-01-15 | 1981-01-15 | PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY |
| EP19820900319 EP0070288A1 (en) | 1981-01-15 | 1982-01-15 | A method of anodically deburring articles of copper or copper alloy |
| CH554982A CH652421A5 (en) | 1981-01-15 | 1982-01-15 | PROCEDURE FOR ANODICALLY DEBURRING COPPER ITEMS OR COPPER ALLOYS. |
| PCT/SE1982/000010 WO1982002408A1 (en) | 1981-01-15 | 1982-01-15 | A method of anodically deburring articles of copper or copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8100202A SE425103B (en) | 1981-01-15 | 1981-01-15 | PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE8100202L true SE8100202L (en) | 1982-07-16 |
| SE425103B SE425103B (en) | 1982-08-30 |
Family
ID=20342884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE8100202A SE425103B (en) | 1981-01-15 | 1981-01-15 | PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0070288A1 (en) |
| CH (1) | CH652421A5 (en) |
| SE (1) | SE425103B (en) |
| WO (1) | WO1982002408A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0511557A1 (en) * | 1991-04-29 | 1992-11-04 | Siemens Aktiengesellschaft | Procedure and equipment for deburring of contact pins |
| US6294071B1 (en) * | 2000-01-07 | 2001-09-25 | Huntsman Petrochemical Corporation | Methods of forming copper solutions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3556957A (en) * | 1966-01-03 | 1971-01-19 | Honeywell Inc | Metal treatment |
| SE413681B (en) * | 1977-11-22 | 1980-06-16 | Blomsterberg Karl Ingemar | SET AND BATH FOR CATODIC CLEANING OF METAL SURFACES IN A NEUTRAL WATER SOLUTION OF AN ALKALISAL |
| SE415891B (en) * | 1979-02-19 | 1980-11-10 | Blomsterberg Karl Ingemar | SET TO ANODICALLY DEGREE AND / OR POLISH A STALL FORM IN AN ELECTROLYTICAL BATH AND BATH FOR EXECUTION OF THE SET |
-
1981
- 1981-01-15 SE SE8100202A patent/SE425103B/en not_active IP Right Cessation
-
1982
- 1982-01-15 WO PCT/SE1982/000010 patent/WO1982002408A1/en not_active Ceased
- 1982-01-15 CH CH554982A patent/CH652421A5/en not_active IP Right Cessation
- 1982-01-15 EP EP19820900319 patent/EP0070288A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0070288A1 (en) | 1983-01-26 |
| WO1982002408A1 (en) | 1982-07-22 |
| CH652421A5 (en) | 1985-11-15 |
| SE425103B (en) | 1982-08-30 |
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