SE8100202L - PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY - Google Patents

PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY

Info

Publication number
SE8100202L
SE8100202L SE8100202A SE8100202A SE8100202L SE 8100202 L SE8100202 L SE 8100202L SE 8100202 A SE8100202 A SE 8100202A SE 8100202 A SE8100202 A SE 8100202A SE 8100202 L SE8100202 L SE 8100202L
Authority
SE
Sweden
Prior art keywords
copper
bath
copper alloy
procedure kit
anodic degradation
Prior art date
Application number
SE8100202A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE425103B (en
Inventor
Karl-Ingemar Blomsterberg
Original Assignee
Blomsterberg Karl Ingemar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blomsterberg Karl Ingemar filed Critical Blomsterberg Karl Ingemar
Priority to SE8100202A priority Critical patent/SE425103B/en
Priority to EP19820900319 priority patent/EP0070288A1/en
Priority to CH554982A priority patent/CH652421A5/en
Priority to PCT/SE1982/000010 priority patent/WO1982002408A1/en
Publication of SE8100202L publication Critical patent/SE8100202L/en
Publication of SE425103B publication Critical patent/SE425103B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/14Etching locally
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/16Polishing
    • C25F3/22Polishing of heavy metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Articles of copper or copper alloy are anodically deburred in an acid solution (pH not above 6.5) containing: water 100 to 300 g/l; alkali sulphamate 50 to 150 g/l; polyhydric alcohol 400 to 800; alkali nitrate 50 to 150 g/l. The bath voltage is to be within the range of 5 to 30 volts, and the current density (at the anode) is to be within the range of 2 to 50 amperes per square decimeter.
SE8100202A 1981-01-15 1981-01-15 PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY SE425103B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE8100202A SE425103B (en) 1981-01-15 1981-01-15 PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY
EP19820900319 EP0070288A1 (en) 1981-01-15 1982-01-15 A method of anodically deburring articles of copper or copper alloy
CH554982A CH652421A5 (en) 1981-01-15 1982-01-15 PROCEDURE FOR ANODICALLY DEBURRING COPPER ITEMS OR COPPER ALLOYS.
PCT/SE1982/000010 WO1982002408A1 (en) 1981-01-15 1982-01-15 A method of anodically deburring articles of copper or copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8100202A SE425103B (en) 1981-01-15 1981-01-15 PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY

Publications (2)

Publication Number Publication Date
SE8100202L true SE8100202L (en) 1982-07-16
SE425103B SE425103B (en) 1982-08-30

Family

ID=20342884

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8100202A SE425103B (en) 1981-01-15 1981-01-15 PROCEDURE KIT AND BATH FOR ANODIC DEGRADATION OF COPPER OR COPPER ALLOY

Country Status (4)

Country Link
EP (1) EP0070288A1 (en)
CH (1) CH652421A5 (en)
SE (1) SE425103B (en)
WO (1) WO1982002408A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511557A1 (en) * 1991-04-29 1992-11-04 Siemens Aktiengesellschaft Procedure and equipment for deburring of contact pins
US6294071B1 (en) * 2000-01-07 2001-09-25 Huntsman Petrochemical Corporation Methods of forming copper solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556957A (en) * 1966-01-03 1971-01-19 Honeywell Inc Metal treatment
SE413681B (en) * 1977-11-22 1980-06-16 Blomsterberg Karl Ingemar SET AND BATH FOR CATODIC CLEANING OF METAL SURFACES IN A NEUTRAL WATER SOLUTION OF AN ALKALISAL
SE415891B (en) * 1979-02-19 1980-11-10 Blomsterberg Karl Ingemar SET TO ANODICALLY DEGREE AND / OR POLISH A STALL FORM IN AN ELECTROLYTICAL BATH AND BATH FOR EXECUTION OF THE SET

Also Published As

Publication number Publication date
EP0070288A1 (en) 1983-01-26
WO1982002408A1 (en) 1982-07-22
CH652421A5 (en) 1985-11-15
SE425103B (en) 1982-08-30

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