SE8107624L - Semi-conductor electrode - Google Patents

Semi-conductor electrode

Info

Publication number
SE8107624L
SE8107624L SE8107624A SE8107624A SE8107624L SE 8107624 L SE8107624 L SE 8107624L SE 8107624 A SE8107624 A SE 8107624A SE 8107624 A SE8107624 A SE 8107624A SE 8107624 L SE8107624 L SE 8107624L
Authority
SE
Sweden
Prior art keywords
semiconductor wafer
electrodes
grooves
semi
conductor electrode
Prior art date
Application number
SE8107624A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
C Chauvet
Original Assignee
Jeumont Schneider
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeumont Schneider filed Critical Jeumont Schneider
Publication of SE8107624L publication Critical patent/SE8107624L/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20Conductive package substrates serving as an interconnection, e.g. metal plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/22Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Thyristors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

A semiconductor wafer (1) is provided with two electrodes (3, 4) of conductive material which are substantially cylindrical in shape and on the same axis as the semiconductor wafer (1). Grooves (5) are formed on the external faces of these electrodes, i.e. that face remote from the semiconductor wafer, so as to present a large surface area promoting heat exchange with the medium in which the assembly is arranged. In a preferred form the grooves (5) are parallel with one another. Such an electrode structure is used in the manufacture of diodes or thyristors designed for electric traction applications. <IMAGE>
SE8107624A 1980-12-24 1981-12-18 Semi-conductor electrode SE8107624L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8027448A FR2496987A1 (en) 1980-12-24 1980-12-24 ELECTRODES FOR PASTILLE SEMICONDUCTOR POWER

Publications (1)

Publication Number Publication Date
SE8107624L true SE8107624L (en) 1982-06-25

Family

ID=9249477

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8107624A SE8107624L (en) 1980-12-24 1981-12-18 Semi-conductor electrode

Country Status (4)

Country Link
DE (1) DE3151113A1 (en)
FR (1) FR2496987A1 (en)
GB (1) GB2090058B (en)
SE (1) SE8107624L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305338A (en) * 1990-09-25 1994-04-19 Mitsubishi Denki Kabushiki Kaisha Switch device for laser

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO118754B (en) * 1964-04-20 1970-02-09 Asea Ab
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
US3746947A (en) * 1969-03-15 1973-07-17 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
GB2090058B (en) 1985-08-21
DE3151113A1 (en) 1982-08-19
FR2496987A1 (en) 1982-06-25
GB2090058A (en) 1982-06-30
FR2496987B1 (en) 1984-02-03

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Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8107624-2

Effective date: 19880930