SE9602997L - Isolerande hartskomposition för uppbyggande genom kopparfolielaminering och sätt för framställning av flerskiktskretskort användande komposition - Google Patents

Isolerande hartskomposition för uppbyggande genom kopparfolielaminering och sätt för framställning av flerskiktskretskort användande komposition

Info

Publication number
SE9602997L
SE9602997L SE9602997A SE9602997A SE9602997L SE 9602997 L SE9602997 L SE 9602997L SE 9602997 A SE9602997 A SE 9602997A SE 9602997 A SE9602997 A SE 9602997A SE 9602997 L SE9602997 L SE 9602997L
Authority
SE
Sweden
Prior art keywords
resin composition
insulating resin
circuit board
copper foil
printed circuit
Prior art date
Application number
SE9602997A
Other languages
English (en)
Other versions
SE520418C2 (sv
SE9602997D0 (sv
Inventor
Shoji Inagaki
Eiji Takehara
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of SE9602997D0 publication Critical patent/SE9602997D0/sv
Publication of SE9602997L publication Critical patent/SE9602997L/sv
Publication of SE520418C2 publication Critical patent/SE520418C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
SE9602997A 1995-08-28 1996-08-16 Isolerande hartskomposition för uppbyggande genom kopparfolielaminering och sätt för framställning av flerskiktskretskort användande komposition SE520418C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07240495A JP3084352B2 (ja) 1995-08-28 1995-08-28 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法

Publications (3)

Publication Number Publication Date
SE9602997D0 SE9602997D0 (sv) 1996-08-16
SE9602997L true SE9602997L (sv) 1997-03-01
SE520418C2 SE520418C2 (sv) 2003-07-08

Family

ID=17060370

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9602997A SE520418C2 (sv) 1995-08-28 1996-08-16 Isolerande hartskomposition för uppbyggande genom kopparfolielaminering och sätt för framställning av flerskiktskretskort användande komposition

Country Status (4)

Country Link
US (1) US5837155A (sv)
JP (1) JP3084352B2 (sv)
DE (1) DE19634016A1 (sv)
SE (1) SE520418C2 (sv)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981880A (en) * 1996-08-20 1999-11-09 International Business Machines Corporation Electronic device packages having glass free non conductive layers
TW398163B (en) * 1996-10-09 2000-07-11 Matsushita Electric Industrial Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
JP3462057B2 (ja) * 1997-10-31 2003-11-05 京セラ株式会社 積層装置およびそれを用いた配線基板の製造方法
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP3439135B2 (ja) * 1998-10-05 2003-08-25 沖電気工業株式会社 半導体装置の製造方法及び半導体装置
SE513341C2 (sv) 1998-10-06 2000-08-28 Ericsson Telefon Ab L M Arrangemang med tryckta kretskort samt metod för tillverkning därav
WO2000042830A1 (de) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird
JP3570495B2 (ja) * 1999-01-29 2004-09-29 セイコーエプソン株式会社 インクジェット式記録ヘッド
US6458509B1 (en) * 1999-04-30 2002-10-01 Toagosei Co., Ltd. Resist compositions
CN1199536C (zh) 1999-10-26 2005-04-27 伊比登株式会社 多层印刷配线板及多层印刷配线板的制造方法
JP3585793B2 (ja) * 1999-11-09 2004-11-04 富士通株式会社 両面薄膜配線基板の製造方法
WO2001045478A1 (en) * 1999-12-14 2001-06-21 Matsushita Electric Industrial Co. Ltd. Multilayered printed wiring board and production method therefor
JP2001302887A (ja) * 2000-04-25 2001-10-31 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂付き金属箔及び絶縁性フィルム
US6459046B1 (en) * 2000-08-28 2002-10-01 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
JP3760771B2 (ja) * 2001-01-16 2006-03-29 松下電器産業株式会社 回路形成基板および回路形成基板の製造方法
WO2002077058A1 (en) * 2001-03-23 2002-10-03 Taiyo Ink Manufacturing Co., Ltd. Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same, and cured article obtained therefrom
KR100893716B1 (ko) * 2001-05-21 2009-04-17 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 전자장치용 부품의 제조방법
US20050098262A1 (en) * 2001-07-03 2005-05-12 Chia-Pin Lin Method of laminating copper foil onto a printed circuit board
US6762260B2 (en) 2002-03-05 2004-07-13 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) * 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US6716281B2 (en) * 2002-05-10 2004-04-06 Electrochemicals, Inc. Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
US7491897B2 (en) * 2002-09-30 2009-02-17 Fujitsu Ten Limited Electronic equipment provided with wiring board into which press-fit terminals are press-fitted
JP4576794B2 (ja) * 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
US6777512B1 (en) * 2003-02-28 2004-08-17 Dow Global Technologies Inc. Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components
US7247596B2 (en) * 2003-06-09 2007-07-24 Dow Global Technologies Inc. Stabilized organoborane polymerization initiators and polymerizable compositions
DE10335693B3 (de) * 2003-08-05 2005-04-28 Lauffer Maschf Vorrichtung zum schrittweisen Laminieren von Multilayern
US6843815B1 (en) * 2003-09-04 2005-01-18 3M Innovative Properties Company Coated abrasive articles and method of abrading
JP4652235B2 (ja) * 2003-11-26 2011-03-16 三井化学株式会社 １液型の光及び熱併用硬化性樹脂組成物及びその用途
US8501886B2 (en) * 2003-12-22 2013-08-06 Dow Global Technologies Llc Accelerated organoborane amine complex initiated polymerizable compositions
US7534843B2 (en) * 2003-12-22 2009-05-19 Dow Global Technoloigies, Inc. Accelerated organoborane amine complex initiated polymerizable compositions
JP4370926B2 (ja) * 2004-02-16 2009-11-25 日立化成工業株式会社 薄葉配線板材料とその製造方法
JP4507707B2 (ja) * 2004-06-03 2010-07-21 日立化成工業株式会社 印刷配線板用基板、印刷配線板及び印刷配線板の製造方法
US7462317B2 (en) 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US7426780B2 (en) 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
JP2006332094A (ja) * 2005-05-23 2006-12-07 Seiko Epson Corp 電子基板の製造方法及び半導体装置の製造方法並びに電子機器の製造方法
TWI294757B (en) * 2005-07-06 2008-03-11 Delta Electronics Inc Circuit board with a through hole wire, and forming method thereof
US7688172B2 (en) 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8701272B2 (en) 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US8631560B2 (en) 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US8139362B2 (en) 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
KR20080053486A (ko) 2005-10-07 2008-06-13 다우 글로벌 테크놀로지스 인크. 아미도-유기보레이트 개시제 시스템
WO2008026397A1 (en) * 2006-08-31 2008-03-06 Jsr Corporation Radiation-sensitive insulation resin composition, cured article, and electronic device
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
US7524907B2 (en) 2006-10-12 2009-04-28 Dow Global Technologies, Inc. Accelerated organoborane initiated polymerizable compositions
US7955868B2 (en) 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
US8018315B2 (en) 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US8133529B2 (en) 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US9246390B2 (en) 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8686698B2 (en) * 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
DE102008031573B4 (de) * 2008-07-07 2012-06-28 Carl Freudenberg Kg Dehnbares Vlies mit Leiterstrukturen
US8153473B2 (en) 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US9054086B2 (en) 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US8266793B2 (en) * 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8339802B2 (en) 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8698463B2 (en) 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
US9548714B2 (en) 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US8186042B2 (en) * 2009-05-06 2012-05-29 Bae Systems Information And Electronic Systems Integration Inc. Manufacturing method of a printed board assembly
JP5414630B2 (ja) * 2010-03-31 2014-02-12 株式会社タムラ製作所 熱硬化性樹脂組成物、その硬化物及び該硬化物を用いたプリント配線板
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
CN107849224B (zh) * 2015-07-09 2021-06-08 巴斯夫欧洲公司 可固化组合物
GB2549770A (en) * 2016-04-28 2017-11-01 Murata Manufacturing Co Power electronics device with improved isolation performance

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4902556A (en) * 1989-01-27 1990-02-20 The B. F. Goodrich Company Multi-layer polynorbornene and epoxy laminates and process for making the same
JP2775585B2 (ja) * 1994-03-25 1998-07-16 日本メクトロン株式会社 両面配線基板の製造法

Also Published As

Publication number Publication date
SE520418C2 (sv) 2003-07-08
DE19634016A1 (de) 1997-03-06
SE9602997D0 (sv) 1996-08-16
US5837155A (en) 1998-11-17
JPH0964545A (ja) 1997-03-07
JP3084352B2 (ja) 2000-09-04

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