SG103273A1 - Serial wafer handling mechanism - Google Patents

Serial wafer handling mechanism

Info

Publication number
SG103273A1
SG103273A1 SG200007397A SG200007397A SG103273A1 SG 103273 A1 SG103273 A1 SG 103273A1 SG 200007397 A SG200007397 A SG 200007397A SG 200007397 A SG200007397 A SG 200007397A SG 103273 A1 SG103273 A1 SG 103273A1
Authority
SG
Singapore
Prior art keywords
handling mechanism
wafer handling
serial wafer
serial
wafer
Prior art date
Application number
SG200007397A
Other languages
English (en)
Inventor
Thomas Ryan Kevin
Lawrence Kellerman Peter
Sinclair Frank
Everett Allen Ernest Jr
Bradford Fish Roger
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Publication of SG103273A1 publication Critical patent/SG103273A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/913—Diverse treatments performed in unitary chamber
SG200007397A 1999-12-17 2000-12-13 Serial wafer handling mechanism SG103273A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/466,628 US6429139B1 (en) 1999-12-17 1999-12-17 Serial wafer handling mechanism

Publications (1)

Publication Number Publication Date
SG103273A1 true SG103273A1 (en) 2004-04-29

Family

ID=23852508

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007397A SG103273A1 (en) 1999-12-17 2000-12-13 Serial wafer handling mechanism

Country Status (6)

Country Link
US (1) US6429139B1 (fr)
EP (1) EP1109201A3 (fr)
JP (1) JP2001250855A (fr)
KR (1) KR100563227B1 (fr)
SG (1) SG103273A1 (fr)
TW (1) TW495806B (fr)

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JP3676983B2 (ja) * 2000-03-29 2005-07-27 株式会社日立国際電気 半導体製造方法、基板処理方法、及び半導体製造装置
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
US20030202865A1 (en) * 2002-04-25 2003-10-30 Applied Materials, Inc. Substrate transfer apparatus
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
US20050205210A1 (en) * 2004-01-06 2005-09-22 Devine Daniel J Advanced multi-pressure workpiece processing
JP4599405B2 (ja) * 2004-08-17 2010-12-15 マットソン テクノロジイ インコーポレイテッド ウェハ処理システムのための、ウェハ移送装置及びウェハ移送方法
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US7286890B2 (en) * 2005-06-28 2007-10-23 Tokyo Electron Limited Transfer apparatus for target object
WO2007061603A2 (fr) 2005-11-21 2007-05-31 Applied Materials, Inc. Procedes et dispositif permettant de transferer des substrats pendant la fabrication d'un appareil electronique
KR100780040B1 (ko) * 2006-03-06 2007-11-27 (주) 디오브이 유기전계 발광소자 증착장치용 트랜스퍼 실린더 지지장치
KR100780050B1 (ko) * 2006-03-06 2007-11-29 (주) 디오브이 유기전계 발광소자 증착장치용 기판 홀딩장치
US7750818B2 (en) 2006-11-29 2010-07-06 Adp Engineering Co., Ltd. System and method for introducing a substrate into a process chamber
US8504203B2 (en) * 2008-03-06 2013-08-06 Panasonic Corporation Manipulator and method of controlling the same
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
CN102388059B (zh) * 2009-02-11 2015-03-04 陶氏益农公司 杀虫组合物
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) * 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
CN102310999B (zh) * 2010-07-09 2013-07-17 上海凯世通半导体有限公司 真空传输制程设备及方法
US20130101372A1 (en) * 2011-10-19 2013-04-25 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6257455B2 (ja) * 2014-06-17 2018-01-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入装置の制御方法
CN115404470B (zh) * 2022-08-24 2023-06-30 江苏天芯微半导体设备有限公司 一种密封内衬、半导体设备平台及维护方法
CN115910886B (zh) * 2022-12-28 2024-04-16 深圳市纳设智能装备股份有限公司 传输腔、半导体设备及晶圆传输方法

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EP0152555A2 (fr) * 1984-02-21 1985-08-28 Plasma-Therm, Inc. Dispositif pour le transport de plaquettes semi-conductrices
US4813846A (en) * 1987-02-13 1989-03-21 Leybold-Heraeus Gmbh Inserting device for vacuum apparatus
JPH06322541A (ja) * 1993-05-11 1994-11-22 Nissin Electric Co Ltd 成膜装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
JPH1030183A (ja) * 1996-07-19 1998-02-03 Tokyo Ohka Kogyo Co Ltd ロードロック室を備えた基板の処理装置
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
WO2000060414A1 (fr) * 1999-04-02 2000-10-12 Silicon Valley Group, Thermal Systems Llc Systeme de traitement de tranches de semi-conducteur a chambres de traitement empilees verticalement et systeme de transfert monoaxe de tranches par deux
EP1047114A2 (fr) * 1999-04-19 2000-10-25 Applied Materials, Inc. Procédé de détection de la position d'une plaquette

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DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
JPS60249329A (ja) * 1984-05-25 1985-12-10 Anelva Corp スパッタエッチング装置
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
JPH03109727A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体製造装置
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US5664925A (en) 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US5607276A (en) 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US5609459A (en) 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock
US5613821A (en) 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US5810549A (en) * 1996-04-17 1998-09-22 Applied Materials, Inc. Independent linear dual-blade robot and method for transferring wafers
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5765983A (en) 1996-05-30 1998-06-16 Brooks Automation, Inc. Robot handling apparatus
US6048154A (en) * 1996-10-02 2000-04-11 Applied Materials, Inc. High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
JP3437734B2 (ja) * 1997-02-26 2003-08-18 富士通株式会社 製造装置
JPH11135600A (ja) * 1997-08-25 1999-05-21 Shibaura Mechatronics Corp ロボット装置および処理装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0152555A2 (fr) * 1984-02-21 1985-08-28 Plasma-Therm, Inc. Dispositif pour le transport de plaquettes semi-conductrices
US4813846A (en) * 1987-02-13 1989-03-21 Leybold-Heraeus Gmbh Inserting device for vacuum apparatus
JPH06322541A (ja) * 1993-05-11 1994-11-22 Nissin Electric Co Ltd 成膜装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
JPH1030183A (ja) * 1996-07-19 1998-02-03 Tokyo Ohka Kogyo Co Ltd ロードロック室を備えた基板の処理装置
WO2000060414A1 (fr) * 1999-04-02 2000-10-12 Silicon Valley Group, Thermal Systems Llc Systeme de traitement de tranches de semi-conducteur a chambres de traitement empilees verticalement et systeme de transfert monoaxe de tranches par deux
EP1047114A2 (fr) * 1999-04-19 2000-10-25 Applied Materials, Inc. Procédé de détection de la position d'une plaquette

Also Published As

Publication number Publication date
TW495806B (en) 2002-07-21
US20020052094A1 (en) 2002-05-02
EP1109201A3 (fr) 2003-11-05
US6429139B1 (en) 2002-08-06
KR20010062414A (ko) 2001-07-07
EP1109201A2 (fr) 2001-06-20
KR100563227B1 (ko) 2006-03-21
JP2001250855A (ja) 2001-09-14

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