SG130193A1 - Composite metal matrix castings and solder compositions, and methods - Google Patents

Composite metal matrix castings and solder compositions, and methods

Info

Publication number
SG130193A1
SG130193A1 SG200700825-3A SG2007008253A SG130193A1 SG 130193 A1 SG130193 A1 SG 130193A1 SG 2007008253 A SG2007008253 A SG 2007008253A SG 130193 A1 SG130193 A1 SG 130193A1
Authority
SG
Singapore
Prior art keywords
methods
metal matrix
castings
composition
composite metal
Prior art date
Application number
SG200700825-3A
Other languages
English (en)
Inventor
Andre Y Lee
Karatholuvu N Subramaniam
Original Assignee
Univ Michigan State
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Michigan State filed Critical Univ Michigan State
Publication of SG130193A1 publication Critical patent/SG130193A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
SG200700825-3A 2003-08-06 2004-08-03 Composite metal matrix castings and solder compositions, and methods SG130193A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49280603P 2003-08-06 2003-08-06

Publications (1)

Publication Number Publication Date
SG130193A1 true SG130193A1 (en) 2007-03-20

Family

ID=34193152

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200700825-3A SG130193A1 (en) 2003-08-06 2004-08-03 Composite metal matrix castings and solder compositions, and methods

Country Status (7)

Country Link
US (1) US7572343B2 (de)
EP (1) EP1667807A4 (de)
JP (1) JP4481986B2 (de)
CN (1) CN101076446A (de)
RU (1) RU2006106711A (de)
SG (1) SG130193A1 (de)
WO (1) WO2005016580A2 (de)

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* Cited by examiner, † Cited by third party
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DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
US7017795B2 (en) * 2003-11-03 2006-03-28 Indium Corporation Of America Solder pastes for providing high elasticity, low rigidity solder joints
US7422141B2 (en) * 2004-01-22 2008-09-09 Hrl Laboratories, Llc Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
US20070044295A1 (en) * 2005-05-12 2007-03-01 Nanosys, Inc. Use of nanoparticles in film formation and as solder
US9308604B1 (en) * 2008-02-06 2016-04-12 Lockheed Martin Corporation Anti-tin whisker solder and method of manufacture thereof
US8562755B1 (en) * 2008-02-06 2013-10-22 Lockheed Martin Corporation Anti-tin whisker solder
US20100012708A1 (en) 2008-07-16 2010-01-21 Schlumberger Technology Corporation Oilfield tools comprising modified-soldered electronic components and methods of manufacturing same
WO2010011311A1 (en) * 2008-07-22 2010-01-28 Cape Town University Nanolabeling of metals
JP4987823B2 (ja) * 2008-08-29 2012-07-25 株式会社東芝 半導体装置
WO2013122126A1 (ja) * 2012-02-14 2013-08-22 三菱マテリアル株式会社 はんだ接合構造、パワーモジュール、ヒートシンク付パワーモジュール用基板及びそれらの製造方法、並びにはんだ下地層形成用ペースト
JP2014097529A (ja) * 2012-10-18 2014-05-29 Fuji Electric Co Ltd 発泡金属による接合方法、半導体装置の製造方法、半導体装置
MY160570A (en) * 2012-11-21 2017-03-15 Univ Tunku Abdul Rahman A lead free solder alloy containing platinum particles as reinforcement
US10308828B2 (en) 2016-12-14 2019-06-04 The Charles Stark Draper Laboratory, Inc. Reactively assisted ink for printed electronic circuits
CN111630646A (zh) * 2018-12-28 2020-09-04 Ｊｘ金属株式会社 焊料接合部
CN111872600B (zh) * 2020-07-08 2021-06-08 中国矿业大学 一种MOFs碳化产物及制备方法和在无铅钎料改性中的应用
CN114871626B (zh) * 2022-06-27 2024-02-06 浙江亚通新材料股份有限公司 一种锡银铜钎料
CN119733987B (zh) * 2025-01-07 2026-04-21 晶澜光电科技(江苏)有限公司 光伏活性焊料、无栅线异质结电池片和组件及制备方法
CN119733986B (zh) * 2025-01-07 2025-11-25 晶澜光电科技(江苏)有限公司 光伏超细活性焊丝、无栅线TOPCon电池片和组件及制备方法

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US606819A (en) * 1898-07-05 davis
US1926853A (en) * 1932-07-30 1933-09-12 Aluminum Co Of America Solder
US2473887A (en) * 1945-12-29 1949-06-21 Westinghouse Electric Corp Protecting metal surfaces during soldering and brazing processes
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US4541876A (en) * 1983-10-31 1985-09-17 Scm Corporation Nonaqueous powdered metal paste composition
DE3464739D1 (en) * 1983-11-09 1987-08-20 Aerospatiale Method for temporarily joining by the use of peelable strips for mechanical release by peeling
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream
US5127969A (en) * 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
US5234506A (en) * 1991-07-17 1993-08-10 Church & Dwight Co., Inc. Aqueous electronic circuit assembly cleaner and method
US5333668A (en) * 1991-12-09 1994-08-02 Reynolds Metals Company Process for creation of metallurgically bonded inserts cast-in-place in a cast aluminum article
US5346723A (en) * 1993-07-12 1994-09-13 Dow Corning Corporation Method for curing organosiloxane compositions in the presence of cure inhibiting materials
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
EP0854768A1 (de) * 1995-10-06 1998-07-29 Brown University Research Foundation Weichlotzusammensetzungen und - verfahren
US5858544A (en) * 1995-12-15 1999-01-12 Univ Michigan Spherosiloxane coatings
US5738269A (en) * 1996-04-19 1998-04-14 Motorola, Inc. Method for forming a solder bump
DE19781813B8 (de) * 1996-06-07 2006-12-07 Asahi Kasei Kabushiki Kaisha Mesoporen-Molekularsieb und Verfahren zu dessen Herstellung
JP3685901B2 (ja) 1997-03-19 2005-08-24 本田技研工業株式会社 Ａｌ基複合体の製造方法
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
US6770724B1 (en) * 1998-03-03 2004-08-03 The United States Of America As Represented By The Secretary Of The Air Force Altering of poss rings
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US6927270B2 (en) * 2001-06-27 2005-08-09 Hybrid Plastics Llp Process for the functionalization of polyhedral oligomeric silsesquioxanes
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US6443211B1 (en) * 1999-08-31 2002-09-03 Cummins Inc. Mettallurgical bonding of inserts having multi-layered coatings within metal castings
US6569252B1 (en) * 2000-06-30 2003-05-27 International Business Machines Corporation Semi-aqueous solvent cleaning of paste processing residue from substrates
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US6936663B1 (en) * 2003-07-07 2005-08-30 Conano Corporation Powder coating compositions containing POSS compounds

Also Published As

Publication number Publication date
US7572343B2 (en) 2009-08-11
JP4481986B2 (ja) 2010-06-16
EP1667807A4 (de) 2010-03-24
CN101076446A (zh) 2007-11-21
EP1667807A2 (de) 2006-06-14
JP2007512136A (ja) 2007-05-17
WO2005016580A3 (en) 2007-04-12
WO2005016580A2 (en) 2005-02-24
RU2006106711A (ru) 2006-09-10
US20050034791A1 (en) 2005-02-17

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