SG152117A1 - Solderable aluminum-based material - Google Patents
Solderable aluminum-based materialInfo
- Publication number
- SG152117A1 SG152117A1 SG200805618-6A SG2008056186A SG152117A1 SG 152117 A1 SG152117 A1 SG 152117A1 SG 2008056186 A SG2008056186 A SG 2008056186A SG 152117 A1 SG152117 A1 SG 152117A1
- Authority
- SG
- Singapore
- Prior art keywords
- aluminum
- based material
- soldering
- present
- solderable
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052782 aluminium Inorganic materials 0.000 title abstract 5
- 238000005476 soldering Methods 0.000 abstract 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12229—Intermediate article [e.g., blank, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096217510U TWM337574U (en) | 2007-10-19 | 2007-10-19 | Aluminum substrate able to be subject to welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG152117A1 true SG152117A1 (en) | 2009-05-29 |
Family
ID=39736583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200805618-6A SG152117A1 (en) | 2007-10-19 | 2008-07-29 | Solderable aluminum-based material |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090104471A1 (fr) |
| EP (1) | EP2050563A2 (fr) |
| JP (1) | JP3142094U (fr) |
| BR (1) | BRMU8802030U2 (fr) |
| CA (1) | CA2630501A1 (fr) |
| DE (1) | DE202008005039U1 (fr) |
| SG (1) | SG152117A1 (fr) |
| TW (1) | TWM337574U (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015009944B4 (de) * | 2015-06-29 | 2019-03-14 | Diehl Metal Applications Gmbh | Steckverbinder hergestellt aus einem Band aus einer Aluminium-Legierung |
-
2007
- 2007-10-19 TW TW096217510U patent/TWM337574U/zh not_active IP Right Cessation
-
2008
- 2008-03-17 US US12/076,284 patent/US20090104471A1/en not_active Abandoned
- 2008-03-19 JP JP2008001614U patent/JP3142094U/ja not_active Expired - Fee Related
- 2008-04-11 DE DE202008005039U patent/DE202008005039U1/de not_active Expired - Lifetime
- 2008-04-29 CA CA002630501A patent/CA2630501A1/fr not_active Abandoned
- 2008-07-17 EP EP08160577A patent/EP2050563A2/fr not_active Withdrawn
- 2008-07-29 SG SG200805618-6A patent/SG152117A1/en unknown
- 2008-07-31 BR BRMU8802030-4U patent/BRMU8802030U2/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE202008005039U1 (de) | 2008-09-04 |
| CA2630501A1 (fr) | 2009-04-19 |
| TWM337574U (en) | 2008-08-01 |
| EP2050563A2 (fr) | 2009-04-22 |
| BRMU8802030U2 (pt) | 2009-06-23 |
| US20090104471A1 (en) | 2009-04-23 |
| JP3142094U (ja) | 2008-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008053109A3 (fr) | Couche transparente a haute conductivite electrique avec grille metallique a tenue electrochimique optimisee | |
| JP2011243976A5 (ja) | 半導体装置 | |
| CA2864844C (fr) | Revetement presentant des caracteristiques de conduction et de resistance a la corrosion | |
| MX2018005179A (es) | Material de terminal de cobre chapado en estaño, terminal, y estructura de parte de terminal de cable. | |
| IN2015DN03283A (fr) | ||
| GB0908626D0 (en) | A metallization layer stack without a terminal aluminium metal layer | |
| MX354978B (es) | Tubo de transferencia de calor y metodo para producir el mismo. | |
| WO2011065723A3 (fr) | Élément électroluminescent à semi-conducteur à structure verticale et son procédé de production | |
| WO2011056570A3 (fr) | Couches d'oxyde métallique conducteur et dispositifs photovoltaïques | |
| NZ613479A (en) | Abrasive article and method of forming | |
| JP2011040730A5 (ja) | 半導体装置 | |
| WO2009124098A3 (fr) | Face arrière de panneau solaire à dissipation thermique améliorée | |
| WO2010018162A3 (fr) | Dispositif thermoélectrique | |
| WO2015093903A8 (fr) | Matériau d'emballage métallique présentant une bonne résistance à la chaleur, procédé de fabrication de celui-ci et dispositif électronique flexible emballé dans ledit matériau d'emballage métallique | |
| WO2013009150A3 (fr) | Film de dispersion à particules inorganiques présentant une bonne performance d'extraction de lumière | |
| JP2010087494A5 (ja) | 半導体装置 | |
| WO2011081456A3 (fr) | Élément de chauffage et son procédé de fabrication | |
| WO2007096565A3 (fr) | Dispositif electroluminescent organique et utilisation d'une couche electroconductrice transparente dans un dispositif electroluminescent organique | |
| WO2013117438A3 (fr) | Système de connexion d'un composant électrique et/ou électronique | |
| JP2013214576A5 (fr) | ||
| WO2011025631A3 (fr) | Cristal semi-conducteur basé sur un détecteur de radiations et procédé de production dudit cristal | |
| WO2010025325A3 (fr) | Stratifié de fluoropolymère | |
| IN2015DN01730A (fr) | ||
| WO2012015982A3 (fr) | Substrat de circuits électroniques avec métal lié directement amélioré | |
| JP2010287883A5 (ja) | 基板及び基板の作製方法 |