SG16192G - Gold electroplating bath - Google Patents

Gold electroplating bath

Info

Publication number
SG16192G
SG16192G SG161/92A SG16192A SG16192G SG 16192 G SG16192 G SG 16192G SG 161/92 A SG161/92 A SG 161/92A SG 16192 A SG16192 A SG 16192A SG 16192 G SG16192 G SG 16192G
Authority
SG
Singapore
Prior art keywords
electroplating bath
gold
gold electroplating
acrylic acid
metallic additive
Prior art date
Application number
SG161/92A
Other languages
English (en)
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of SG16192G publication Critical patent/SG16192G/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Building Environments (AREA)
  • Residential Or Office Buildings (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
SG161/92A 1986-05-21 1992-02-19 Gold electroplating bath SG16192G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868612361A GB8612361D0 (en) 1986-05-21 1986-05-21 Gold electroplating bath

Publications (1)

Publication Number Publication Date
SG16192G true SG16192G (en) 1992-04-16

Family

ID=10598205

Family Applications (1)

Application Number Title Priority Date Filing Date
SG161/92A SG16192G (en) 1986-05-21 1992-02-19 Gold electroplating bath

Country Status (14)

Country Link
US (1) US4767507A (de)
EP (1) EP0246869B1 (de)
JP (1) JPS62287094A (de)
KR (1) KR870011277A (de)
AT (1) ATE68835T1 (de)
DE (1) DE3773990D1 (de)
DK (1) DK168303B1 (de)
ES (1) ES2026910T3 (de)
FI (1) FI872065L (de)
GB (1) GB8612361D0 (de)
GR (1) GR3002980T3 (de)
HK (1) HK58592A (de)
NO (1) NO872114L (de)
SG (1) SG16192G (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5039381A (en) * 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
JP2779207B2 (ja) * 1989-06-06 1998-07-23 富士通株式会社 半導体装置の製造方法
US6417366B2 (en) 1999-06-24 2002-07-09 Abbott Laboratories Preparation of quinoline-substituted carbonate and carbamate derivatives
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7279086B2 (en) * 2003-05-21 2007-10-09 Technic, Inc. Electroplating solution for alloys of gold with tin
JP5116956B2 (ja) * 2005-07-14 2013-01-09 関東化学株式会社 無電解硬質金めっき液
JP4868116B2 (ja) * 2005-09-30 2012-02-01 学校法人早稲田大学 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP5317433B2 (ja) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液
JP5854727B2 (ja) 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ シアン化物を含まない銀電気めっき液
EP2990507A1 (de) * 2014-08-25 2016-03-02 ATOTECH Deutschland GmbH Zusammensetzung, ihre Verwendung und Verfahren zur galvanischen Abscheidung von Gold enthaltenden Schichten
DE102016211594A1 (de) * 2016-06-28 2017-12-28 Voith Patent Gmbh Elektrokontakt-Kupplung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH455434A (de) * 1963-08-15 1968-07-15 Werner Fluehmann Galvanische A Verfahren zur Herstellung von Weissgoldüberzügen
DE2237807C3 (de) * 1972-08-01 1978-04-27 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys

Also Published As

Publication number Publication date
ES2026910T3 (es) 1992-05-16
EP0246869A1 (de) 1987-11-25
GR3002980T3 (en) 1993-01-25
NO872114L (no) 1987-11-23
FI872065A0 (fi) 1987-05-11
DK168303B1 (da) 1994-03-07
DK252987A (da) 1987-11-22
ATE68835T1 (de) 1991-11-15
DE3773990D1 (de) 1991-11-28
FI872065A7 (fi) 1987-11-22
US4767507A (en) 1988-08-30
GB8612361D0 (en) 1986-06-25
EP0246869B1 (de) 1991-10-23
FI872065L (fi) 1987-11-22
DK252987D0 (da) 1987-05-19
HK58592A (en) 1992-08-14
KR870011277A (ko) 1987-12-22
JPS62287094A (ja) 1987-12-12
NO872114D0 (no) 1987-05-20

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