SG193078A1 - Substrate transport method and substrate transport apparatus - Google Patents

Substrate transport method and substrate transport apparatus Download PDF

Info

Publication number
SG193078A1
SG193078A1 SG2013005970A SG2013005970A SG193078A1 SG 193078 A1 SG193078 A1 SG 193078A1 SG 2013005970 A SG2013005970 A SG 2013005970A SG 2013005970 A SG2013005970 A SG 2013005970A SG 193078 A1 SG193078 A1 SG 193078A1
Authority
SG
Singapore
Prior art keywords
substrate
wafer
suction
suction head
resin
Prior art date
Application number
SG2013005970A
Other languages
English (en)
Inventor
Yamamoto Masayuki
Murayama Takuto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG193078A1 publication Critical patent/SG193078A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG2013005970A 2012-02-14 2013-01-24 Substrate transport method and substrate transport apparatus SG193078A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012029416A JP2013168417A (ja) 2012-02-14 2012-02-14 基板搬送方法および基板搬送装置

Publications (1)

Publication Number Publication Date
SG193078A1 true SG193078A1 (en) 2013-09-30

Family

ID=47721925

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013005970A SG193078A1 (en) 2012-02-14 2013-01-24 Substrate transport method and substrate transport apparatus

Country Status (5)

Country Link
EP (1) EP2629326A3 (2)
JP (1) JP2013168417A (2)
KR (1) KR20130093554A (2)
SG (1) SG193078A1 (2)
TW (1) TW201338076A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4454801A4 (en) * 2021-12-23 2025-04-16 Towa Corporation Processing device and method for manufacturing processed article

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5990969B2 (ja) * 2012-03-26 2016-09-14 Tdk株式会社 ワーク剥離装置および剥離方法
TWI635552B (zh) * 2013-12-13 2018-09-11 Sinfonia Technology Co., Ltd. 設備前端模組（ｅｆｅｍ）
TW201528399A (zh) * 2014-01-02 2015-07-16 萬潤科技股份有限公司 電子元件搬運方法及裝置
US9536814B2 (en) 2014-02-24 2017-01-03 Taiwan Semiconductor Manufacturing Co., Ltd. Die stacking apparatus and method
KR101455205B1 (ko) * 2014-04-29 2014-10-27 주식회사 다이나테크 교정장치
JP6322083B2 (ja) * 2014-08-08 2018-05-09 日東電工株式会社 半導体ウエハの冷却方法および半導体ウエハの冷却装置
CN111432978B (zh) * 2017-09-13 2022-10-28 诚解电子私人有限公司 用于以聚合物树脂铸模化合物为基底的基板的切割方法及其系统
JP7291470B2 (ja) * 2018-11-02 2023-06-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7320940B2 (ja) * 2018-12-17 2023-08-04 株式会社東京精密 ウェハ保持装置及びウェハ搬送保持装置
CN110277327B (zh) * 2019-07-22 2024-03-22 深圳市艾特自动化有限公司 一种在线式石墨舟中硅片的检测系统及检测方法
CN111037767A (zh) * 2020-01-13 2020-04-21 天津市环欧半导体材料技术有限公司 一种硅片料座与料板分离装置及其分离方法
US11302557B2 (en) * 2020-05-01 2022-04-12 Applied Materials, Inc. Electrostatic clamping system and method
CN113644013B (zh) * 2021-08-11 2022-04-01 江苏芯丰集成电路有限公司 一种用于集成电路芯片的固晶系统及其方法
JP7788324B2 (ja) * 2022-03-25 2025-12-18 株式会社ディスコ 搬送装置
CN115101460A (zh) * 2022-06-17 2022-09-23 广西电力职业技术学院 远距离芯片传输装置及传输方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442253B2 (ja) * 1997-03-13 2003-09-02 東京エレクトロン株式会社 基板処理装置
JPH1190874A (ja) * 1997-09-25 1999-04-06 Canon Inc 板状部材のハンドリング装置
JP4403631B2 (ja) 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2003347386A (ja) * 2002-05-24 2003-12-05 Seiko Epson Corp 基材搬送方法、半導体装置の製造方法、集積回路、ディスプレイ装置、及び電子機器
JP4251275B2 (ja) * 2003-05-22 2009-04-08 株式会社東京精密 板状物搬送装置
JP4592270B2 (ja) 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP4973267B2 (ja) * 2007-03-23 2012-07-11 東京エレクトロン株式会社 基板搬送装置、基板搬送モジュール、基板搬送方法及び記憶媒体
DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
JP5471491B2 (ja) 2010-01-20 2014-04-16 富士通セミコンダクター株式会社 半導体装置およびその製造方法、ｐチャネルＭＯＳトランジスタ
JP5576709B2 (ja) * 2010-05-13 2014-08-20 リンテック株式会社 支持装置および支持方法ならびに搬送装置および搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4454801A4 (en) * 2021-12-23 2025-04-16 Towa Corporation Processing device and method for manufacturing processed article

Also Published As

Publication number Publication date
EP2629326A2 (en) 2013-08-21
TW201338076A (zh) 2013-09-16
JP2013168417A (ja) 2013-08-29
EP2629326A3 (en) 2015-08-12
KR20130093554A (ko) 2013-08-22

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