SG49491G - Bonding head - Google Patents

Bonding head

Info

Publication number
SG49491G
SG49491G SG494/91A SG49491A SG49491G SG 49491 G SG49491 G SG 49491G SG 494/91 A SG494/91 A SG 494/91A SG 49491 A SG49491 A SG 49491A SG 49491 G SG49491 G SG 49491G
Authority
SG
Singapore
Prior art keywords
bonding head
bonding
head
Prior art date
Application number
SG494/91A
Other languages
English (en)
Original Assignee
Emhart Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19853519594 external-priority patent/DE3519594A1/de
Priority claimed from GB868612001A external-priority patent/GB8612001D0/en
Application filed by Emhart Inc filed Critical Emhart Inc
Publication of SG49491G publication Critical patent/SG49491G/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
SG494/91A 1985-05-31 1991-06-25 Bonding head SG49491G (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853519594 DE3519594A1 (de) 1985-05-31 1985-05-31 Bondkopf
GB868612001A GB8612001D0 (en) 1986-05-16 1986-05-16 Wire bonding machine

Publications (1)

Publication Number Publication Date
SG49491G true SG49491G (en) 1991-08-23

Family

ID=25832742

Family Applications (1)

Application Number Title Priority Date Filing Date
SG494/91A SG49491G (en) 1985-05-31 1991-06-25 Bonding head

Country Status (4)

Country Link
US (1) US4781319A (de)
EP (1) EP0203597B1 (de)
DE (1) DE3672530D1 (de)
SG (1) SG49491G (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3912580C2 (de) * 1989-04-17 1997-08-21 F&K Delvotec Bondtechnik Gmbh Bondstempel
US5288007A (en) * 1991-10-04 1994-02-22 International Business Machine Corporation Apparatus and methods for making simultaneous electrical connections
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
DE4326478C2 (de) * 1993-07-13 2000-02-17 F&K Delvotec Bondtechnik Gmbh Bondkopf für Ultraschall-Bonden
US5452838A (en) * 1993-07-13 1995-09-26 F & K Delvotec Bondtechnik Gmbh Bonding head for an ultrasonic bonding machine
DE4335468A1 (de) * 1993-10-18 1995-04-20 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zum Drahtbonden
EP0864392B1 (de) * 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Bondkopf
US6206275B1 (en) 1999-10-13 2001-03-27 F & K Delvotec Bondtechnik Gmbh Deep access, close proximity, fine pitch bonding of large wire
EP1375048B1 (de) * 2002-06-18 2008-05-21 F&K Delvotec Bondtechnik GmbH Bondeinrichtung und Drahtbonder
US7407079B2 (en) * 2003-10-23 2008-08-05 Orthodyne Electronics Corporation Automated filament attachment system for vacuum fluorescent display
CN101179183B (zh) * 2006-11-08 2010-05-26 鸿富锦精密工业（深圳）有限公司 线夹
US8091762B1 (en) * 2010-12-08 2012-01-10 Asm Assembly Automation Ltd Wedge bonding method incorporating remote pattern recognition system
US20120241506A1 (en) * 2011-03-24 2012-09-27 Fci Americas Technology Llc Concave Solder Tip
US8540136B1 (en) * 2012-09-06 2013-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for stud bump formation and apparatus for performing the same
US9366879B1 (en) 2014-12-02 2016-06-14 Hutchinson Technology Incorporated Camera lens suspension with polymer bearings
US9454016B1 (en) 2015-03-06 2016-09-27 Hutchinson Technology Incorporated Camera lens suspension with integrated electrical leads
KR102519325B1 (ko) 2015-04-02 2023-04-10 허친슨 테크놀로지 인코포레이티드 카메라 렌즈 서스펜션용 와이어 이송 및 부착 시스템
US10670878B2 (en) 2016-05-19 2020-06-02 Hutchinson Technology Incorporated Camera lens suspensions
KR20190015528A (ko) 2016-06-09 2019-02-13 허친슨 테크놀로지 인코포레이티드 현가 조립체를 위한 접착제를 갖는 형상기억합금 와이어 부착 구조물
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine
KR102622020B1 (ko) * 2021-02-22 2024-01-08 가부시키가이샤 신가와 와이어 본딩 장치
CN114226941B (zh) * 2021-12-08 2023-05-12 中国电子科技集团公司第十三研究所 手持式射频微波组件点焊工装
CN114247975B (zh) * 2021-12-13 2024-01-30 中国电子科技集团公司第十三研究所 自动点焊送线装置及引线点焊方法
DE102022001054A1 (de) * 2022-03-25 2023-09-28 Hesse Gmbh Ultraschallbondvorrichtung und Drahtführungsmodul hierfür

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3342972A (en) * 1964-01-22 1967-09-19 Aerojet General Co Welding electrode assembly
US3593906A (en) * 1969-02-20 1971-07-20 Ibm Conductor handling and bonding system
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3734386A (en) * 1971-06-30 1973-05-22 Ibm Wiring apparatus with wire path forming means
DE2528806C2 (de) * 1975-06-27 1983-09-15 Texas Instruments Deutschland Gmbh, 8050 Freising Schweißvorrichtung
CH592365A5 (de) * 1975-12-23 1977-10-31 Esec Sales Sa
CH619334A5 (de) * 1977-09-07 1980-09-15 Esec Sales Sa
US4202482A (en) * 1978-11-22 1980-05-13 Kulicke & Soffa Industries, Inc. Solenoid actuated wire feed and tearing apparatus
JPS5698900A (en) * 1980-01-07 1981-08-08 Hitachi Ltd Device for automatically wiring printed circuit board
US4422568A (en) * 1981-01-12 1983-12-27 Kulicke And Soffa Industries, Inc. Method of making constant bonding wire tail lengths
US4418858A (en) * 1981-01-23 1983-12-06 Miller C Fredrick Deep bonding methods and apparatus
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
US4576322A (en) * 1984-09-14 1986-03-18 Burroughs Corporation Machine for ultrasonically bonding wires to cavity-down integrated circuit packages

Also Published As

Publication number Publication date
EP0203597A2 (de) 1986-12-03
EP0203597B1 (de) 1990-07-11
US4781319A (en) 1988-11-01
DE3672530D1 (de) 1990-08-16
EP0203597A3 (en) 1988-01-27

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