SG49842A1 - Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor - Google Patents

Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor

Info

Publication number
SG49842A1
SG49842A1 SG1996007397A SG1996007397A SG49842A1 SG 49842 A1 SG49842 A1 SG 49842A1 SG 1996007397 A SG1996007397 A SG 1996007397A SG 1996007397 A SG1996007397 A SG 1996007397A SG 49842 A1 SG49842 A1 SG 49842A1
Authority
SG
Singapore
Prior art keywords
film carrier
semiconductor
mounting structure
wiring substrate
device made
Prior art date
Application number
SG1996007397A
Other languages
English (en)
Inventor
Amane Mochizuki
Atsushi Shinozaki
Kazuo Ouchi
Kazuto Shinozaki
Masakazu Sugimoto
Mikio Aizawa
Munekaza Tanaka
Shoji Morita
Takanori Miyoshi
Tetsuya Miyoshi
Yoshinari Takayama
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28320788A external-priority patent/JPH0760840B2/ja
Priority claimed from JP1050793A external-priority patent/JP2785832B2/ja
Priority claimed from JP1050792A external-priority patent/JP2815113B2/ja
Priority claimed from JP1181272A external-priority patent/JP2634672B2/ja
Priority claimed from JP1197680A external-priority patent/JP2654189B2/ja
Priority claimed from JP19768189A external-priority patent/JP2654190B2/ja
Priority claimed from JP19768289A external-priority patent/JP2654191B2/ja
Priority claimed from JP1200847A external-priority patent/JP2808703B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG49842A1 publication Critical patent/SG49842A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
SG1996007397A 1988-11-09 1989-11-07 Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor SG49842A1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP28320788A JPH0760840B2 (ja) 1988-11-09 1988-11-09 配線基板およびその製法
JP1050793A JP2785832B2 (ja) 1989-03-01 1989-03-01 半導体装置の実装構造
JP1050792A JP2815113B2 (ja) 1989-03-01 1989-03-01 フィルムキャリアおよび半導体装置の製造方法
JP1181272A JP2634672B2 (ja) 1989-07-13 1989-07-13 半導体装置
JP1197680A JP2654189B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP19768189A JP2654190B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP19768289A JP2654191B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP1200847A JP2808703B2 (ja) 1989-08-02 1989-08-02 フィルムキャリアおよび半導体装置

Publications (1)

Publication Number Publication Date
SG49842A1 true SG49842A1 (en) 1998-06-15

Family

ID=27572395

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996007397A SG49842A1 (en) 1988-11-09 1989-11-07 Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor

Country Status (5)

Country Link
US (1) US5072289A (fr)
EP (1) EP0368262B1 (fr)
KR (1) KR960006763B1 (fr)
DE (1) DE68929282T2 (fr)
SG (1) SG49842A1 (fr)

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Also Published As

Publication number Publication date
EP0368262B1 (fr) 2001-02-14
KR960006763B1 (ko) 1996-05-23
DE68929282T2 (de) 2001-06-07
KR900008918A (ko) 1990-06-03
EP0368262A2 (fr) 1990-05-16
US5072289A (en) 1991-12-10
DE68929282D1 (de) 2001-03-22
EP0368262A3 (fr) 1990-11-28

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