SG52267A1 - Method for making a substrate structure with improved heat dissipation - Google Patents

Method for making a substrate structure with improved heat dissipation

Info

Publication number
SG52267A1
SG52267A1 SG1996001659A SG1996001659A SG52267A1 SG 52267 A1 SG52267 A1 SG 52267A1 SG 1996001659 A SG1996001659 A SG 1996001659A SG 1996001659 A SG1996001659 A SG 1996001659A SG 52267 A1 SG52267 A1 SG 52267A1
Authority
SG
Singapore
Prior art keywords
making
heat dissipation
substrate structure
improved heat
improved
Prior art date
Application number
SG1996001659A
Other languages
English (en)
Inventor
Randy L Pollock
George F Anderson Jr
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of SG52267A1 publication Critical patent/SG52267A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/135—Removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/15—Silicon on sapphire SOS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate
SG1996001659A 1993-07-29 1994-06-27 Method for making a substrate structure with improved heat dissipation SG52267A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/099,682 US5354717A (en) 1993-07-29 1993-07-29 Method for making a substrate structure with improved heat dissipation

Publications (1)

Publication Number Publication Date
SG52267A1 true SG52267A1 (en) 1998-09-28

Family

ID=22276130

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001659A SG52267A1 (en) 1993-07-29 1994-06-27 Method for making a substrate structure with improved heat dissipation

Country Status (5)

Country Link
US (1) US5354717A (fr)
EP (2) EP0814509A3 (fr)
JP (1) JPH0778908A (fr)
DE (1) DE69425854T2 (fr)
SG (1) SG52267A1 (fr)

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US5698474A (en) * 1996-02-26 1997-12-16 Hypervision, Inc. High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection
US5786236A (en) * 1996-03-29 1998-07-28 Eastman Kodak Company Backside thinning using ion-beam figuring
US5895972A (en) 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
US6570247B1 (en) 1997-12-30 2003-05-27 Intel Corporation Integrated circuit device having an embedded heat slug
SE9903242D0 (sv) * 1999-09-13 1999-09-13 Acreo Ab A semiconductor device
JP2001244357A (ja) * 2000-03-02 2001-09-07 Sumitomo Electric Ind Ltd パッケージ及びその製造方法
AU2001247378A1 (en) 2000-03-13 2001-09-24 Sun Microsystems, Inc. Method and apparatus for bonding substrates
US6338754B1 (en) 2000-05-31 2002-01-15 Us Synthetic Corporation Synthetic gasket material
GB2371922B (en) 2000-09-21 2004-12-15 Cambridge Semiconductor Ltd Semiconductor device and method of forming a semiconductor device
US6541303B2 (en) * 2001-06-20 2003-04-01 Micron Technology, Inc. Method for conducting heat in a flip-chip assembly
FR2826508B1 (fr) * 2001-06-20 2004-05-28 Alstom Module electronique de puissance et composant de puissance destine a equiper un tel module
US6770966B2 (en) * 2001-07-31 2004-08-03 Intel Corporation Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
US20030152773A1 (en) * 2002-02-14 2003-08-14 Chrysler Gregory M. Diamond integrated heat spreader and method of manufacturing same
US6936497B2 (en) 2002-12-24 2005-08-30 Intel Corporation Method of forming electronic dies wherein each die has a layer of solid diamond
US6924170B2 (en) * 2003-06-30 2005-08-02 Intel Corporation Diamond-silicon hybrid integrated heat spreader
US6987028B2 (en) 2003-07-24 2006-01-17 Intel Corporation Method of fabricating a microelectronic die
US20050236716A1 (en) * 2004-04-22 2005-10-27 Hsuch-Chung Chen Heat dissipation structure and method thereof
US7675079B1 (en) 2004-10-28 2010-03-09 Kley Victor B Diamond coating of silicon-carbide LEDs
US7183641B2 (en) 2005-03-30 2007-02-27 Intel Corporation Integrated heat spreader with intermetallic layer and method for making
WO2007084501A2 (fr) * 2006-01-13 2007-07-26 Group4 Labs, Llc Procede destine a la fabrication de dissipateurs thermiques a base de diamant lisse
CN111933758B (zh) * 2020-07-13 2023-07-18 福建晶安光电有限公司 衬底加工方法、外延用衬底及半导体发光元件及制造方法

Family Cites Families (22)

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FR2542500B1 (fr) * 1983-03-11 1986-08-29 Thomson Csf Procede de fabrication d'un dispositif semiconducteur du type comprenant au moins une couche de silicium deposee sur un substrat isolant
US4689583A (en) * 1984-02-13 1987-08-25 Raytheon Company Dual diode module with heat sink, for use in a cavity power combiner
US4946716A (en) * 1985-05-31 1990-08-07 Tektronix, Inc. Method of thinning a silicon wafer using a reinforcing material
NL8501773A (nl) * 1985-06-20 1987-01-16 Philips Nv Werkwijze voor het vervaardigen van halfgeleiderinrichtingen.
GB2182200B (en) * 1985-08-31 1989-04-26 Plessey Co Plc Mesa semiconductor device
US5196375A (en) * 1987-07-24 1993-03-23 Kabushiki Kaisha Toshiba Method for manufacturing bonded semiconductor body
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JPH067594B2 (ja) * 1987-11-20 1994-01-26 富士通株式会社 半導体基板の製造方法
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US4981818A (en) * 1990-02-13 1991-01-01 General Electric Company Polycrystalline CVD diamond substrate for single crystal epitaxial growth of semiconductors
US5034343A (en) * 1990-03-08 1991-07-23 Harris Corporation Manufacturing ultra-thin wafer using a handle wafer
US5070040A (en) * 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US5126206A (en) * 1990-03-20 1992-06-30 Diamonex, Incorporated Diamond-on-a-substrate for electronic applications
US5045972A (en) * 1990-08-27 1991-09-03 The Standard Oil Company High thermal conductivity metal matrix composite
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JP3028660B2 (ja) * 1991-10-21 2000-04-04 住友電気工業株式会社 ダイヤモンドヒートシンクの製造方法
US5128006A (en) * 1991-01-23 1992-07-07 At&T Bell Laboratories Deposition of diamond films on semicondutor substrates
EP0521405B1 (fr) * 1991-07-01 2001-04-18 Sumitomo Electric Industries, Ltd. Composant évacuant la chaleur et dispositif semi-conducteur qui en est muni
WO1993001617A1 (fr) * 1991-07-08 1993-01-21 Asea Brown Boveri Ab Procede de fabrication d'un composant semi-conducteur
US5334306A (en) * 1991-12-11 1994-08-02 At&T Bell Laboratories Metallized paths on diamond surfaces
EP0552475B1 (fr) * 1992-01-23 1997-09-10 Siemens Aktiengesellschaft Module semiconducteur comprenant des capacités isolantes et thermodissipatrices hautes

Also Published As

Publication number Publication date
EP0637077B1 (fr) 2000-09-13
DE69425854T2 (de) 2001-03-29
US5354717A (en) 1994-10-11
DE69425854D1 (de) 2000-10-19
EP0814509A2 (fr) 1997-12-29
EP0637077A1 (fr) 1995-02-01
JPH0778908A (ja) 1995-03-20
EP0814509A3 (fr) 1998-02-04

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