SG52980A1 - Method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition - Google Patents

Method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition

Info

Publication number
SG52980A1
SG52980A1 SG1997001782A SG1997001782A SG52980A1 SG 52980 A1 SG52980 A1 SG 52980A1 SG 1997001782 A SG1997001782 A SG 1997001782A SG 1997001782 A SG1997001782 A SG 1997001782A SG 52980 A1 SG52980 A1 SG 52980A1
Authority
SG
Singapore
Prior art keywords
injection
epoxy resin
molding
moldable
resin composition
Prior art date
Application number
SG1997001782A
Other languages
English (en)
Inventor
Eiki Togashi
Tsukasa Sakuraba
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13515996A external-priority patent/JP3003101B2/ja
Priority claimed from JP26728896A external-priority patent/JPH10109320A/ja
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of SG52980A1 publication Critical patent/SG52980A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2756—Cold runner channels
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Epoxy Resins (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG1997001782A 1996-05-29 1997-05-29 Method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition SG52980A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13515996A JP3003101B2 (ja) 1996-05-29 1996-05-29 ミニスプル金型を用いたエポキシ樹脂成形品の成形法
JP20031896 1996-07-30
JP26728896A JPH10109320A (ja) 1996-10-08 1996-10-08 射出成形可能なエポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
SG52980A1 true SG52980A1 (en) 2000-04-18

Family

ID=27317028

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001782A SG52980A1 (en) 1996-05-29 1997-05-29 Method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition

Country Status (5)

Country Link
US (1) US6231800B1 (fr)
EP (1) EP0810248A3 (fr)
CN (1) CN1173423A (fr)
CA (1) CA2206384A1 (fr)
SG (1) SG52980A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000047391A1 (fr) * 1999-02-10 2000-08-17 Cookson Semiconductor Packaging Materials Procede et appareil de production de preformes a semiconducteur
WO2002030779A1 (fr) * 2000-10-09 2002-04-18 Calero Armas Jose Reyes Protection sanitaire de produits emballes (prosapen)
US20040234644A1 (en) * 2003-05-19 2004-11-25 Chin-Yung Peng Heat dispensing device for runners of molds
US20040241265A1 (en) * 2003-05-27 2004-12-02 Chin-Yung Peng Material supplying device for rubber injection machine
US20050121829A1 (en) * 2003-12-03 2005-06-09 Honeywell International, Inc. Circuit insulation methods and systems for vehicle door latches
JP2006249338A (ja) * 2005-03-11 2006-09-21 Nichias Corp 導電性エポキシ樹脂組成物及び燃料電池用セパレータ
US20070090654A1 (en) * 2005-10-20 2007-04-26 Honeywell International Inc. System and method for registering the drive mechanism position of a latch apparatus after power loss
JP2008041444A (ja) * 2006-08-07 2008-02-21 Nichias Corp 燃料電池用セパレータ用組成物、燃料電池用セパレータ及びその製造方法
DE102011118760A1 (de) * 2011-11-15 2013-05-16 Alzchem Ag Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen
CN102863746A (zh) * 2012-09-20 2013-01-09 常熟市永祥机电有限公司 阻燃的酚醛环氧复合材料
JP6094601B2 (ja) * 2015-01-09 2017-03-15 マツダ株式会社 射出成形装置
JP6094602B2 (ja) * 2015-01-09 2017-03-15 マツダ株式会社 射出成形装置及び射出成形方法
JP6056878B2 (ja) * 2015-01-09 2017-01-11 マツダ株式会社 射出成形装置及び射出成形方法
KR101822565B1 (ko) * 2016-02-26 2018-01-26 서울과학기술대학교 산학협력단 핫 러너를 적용한 렌즈용 사출 성형품
US11598342B2 (en) * 2021-06-03 2023-03-07 Chin-Ping Wu Heat dissipation fan of magnetic suspension structure
CN115847704B (zh) * 2022-12-03 2025-07-22 扬州市瑞晟机械铸造有限公司 汽车内饰件模具快速成型工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386955A (en) * 1966-01-14 1968-06-04 American Cyanamid Co Substituted ureas as low temperature epoxy curing agents
US3819312A (en) * 1972-07-25 1974-06-25 Pennwalt Corp Cold runner injection mold for thermosetting resins
CH624603A5 (fr) * 1978-01-25 1981-08-14 Bucher Guyer Ag Masch
US4309379A (en) * 1978-12-21 1982-01-05 Hooker Chemicals & Plastics Corp. Method and apparatus for runnerless injection-compression molding thermosetting materials
US4540541A (en) * 1982-03-25 1985-09-10 General Electric Company Method for making plastic articles from resin
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
GB8432606D0 (en) * 1984-12-22 1985-02-06 Ciba Geigy Ag Heat curable epoxide resin compositions
JPS63210121A (ja) * 1987-02-27 1988-08-31 Mitsui Petrochem Ind Ltd 射出成形可能なエポキシ樹脂組成物
JPH0733430B2 (ja) * 1987-05-30 1995-04-12 三井石油化学工業株式会社 エポキシ樹脂組成物
JPH0289613A (ja) * 1988-09-27 1990-03-29 Somar Corp エポキシ樹脂組成物の射出成形方法及びそれに用いる組成物
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
DE69325936T2 (de) * 1992-04-14 2000-03-30 Hitachi Chemical Co., Ltd. Verfahren zur Herstellung von Platten für gedruckte Schaltungen

Also Published As

Publication number Publication date
US6231800B1 (en) 2001-05-15
EP0810248A2 (fr) 1997-12-03
CN1173423A (zh) 1998-02-18
EP0810248A3 (fr) 1998-09-30
CA2206384A1 (fr) 1997-11-29

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