SG55323A1 - Substrate treating system and substrate treating method - Google Patents

Substrate treating system and substrate treating method

Info

Publication number
SG55323A1
SG55323A1 SG1997001757A SG1997001757A SG55323A1 SG 55323 A1 SG55323 A1 SG 55323A1 SG 1997001757 A SG1997001757 A SG 1997001757A SG 1997001757 A SG1997001757 A SG 1997001757A SG 55323 A1 SG55323 A1 SG 55323A1
Authority
SG
Singapore
Prior art keywords
substrate treating
treating method
substrate
treating system
treating
Prior art date
Application number
SG1997001757A
Other languages
English (en)
Inventor
Junichi Kitano
Hiroshi Shinya
Takayuki Katano
Hidetami Yaegashi
Yasunori Kawakami
Fumihiko Kawano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13726396A external-priority patent/JP3416397B2/ja
Priority claimed from JP24726196A external-priority patent/JP3774277B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG55323A1 publication Critical patent/SG55323A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG1997001757A 1996-05-30 1997-05-28 Substrate treating system and substrate treating method SG55323A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13726396A JP3416397B2 (ja) 1996-05-30 1996-05-30 処理システム
JP24726196A JP3774277B2 (ja) 1996-08-29 1996-08-29 被処理基板の搬送方法及び処理システム

Publications (1)

Publication Number Publication Date
SG55323A1 true SG55323A1 (en) 1998-12-21

Family

ID=26470634

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001757A SG55323A1 (en) 1996-05-30 1997-05-28 Substrate treating system and substrate treating method

Country Status (5)

Country Link
US (1) US5876280A (ko)
EP (3) EP1385195A3 (ko)
KR (1) KR970077124A (ko)
SG (1) SG55323A1 (ko)
TW (1) TW333658B (ko)

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JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
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KR100602104B1 (ko) 1999-05-25 2006-07-19 동경 엘렉트론 주식회사 레지스트 도포현상처리장치
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JP2001345241A (ja) * 2000-05-31 2001-12-14 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP3616748B2 (ja) * 2000-11-07 2005-02-02 東京エレクトロン株式会社 現像処理方法，現像処理装置及び処理装置
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JP4038352B2 (ja) * 2001-08-24 2008-01-23 株式会社日立産機システム クリーンルーム
JP4003163B2 (ja) * 2002-01-15 2007-11-07 富士フイルム株式会社 多層塗布膜の製造装置
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KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
KR20060056709A (ko) * 2004-11-22 2006-05-25 삼성전자주식회사 도어 입구에 에어 커튼을 가지는 반도체 제조 장비
JP4471865B2 (ja) * 2005-02-18 2010-06-02 東京エレクトロン株式会社 液処理装置及びその方法
US20060222478A1 (en) * 2005-03-31 2006-10-05 Tokyo Electron Limited Processing apparatus, and system and program for monitoring and controlling fan filter unit
JP4781049B2 (ja) * 2005-08-30 2011-09-28 キヤノン株式会社 露光装置およびデバイス製造方法
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JP4951301B2 (ja) * 2006-09-25 2012-06-13 富士フイルム株式会社 光学フィルムの乾燥方法及び装置並びに光学フィルムの製造方法
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
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JP6606551B2 (ja) * 2015-08-04 2019-11-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
KR102139249B1 (ko) * 2018-04-03 2020-07-29 우범제 이에프이엠
KR102234521B1 (ko) * 2018-06-29 2021-03-31 코웨이 주식회사 양 방향 토출 유로를 포함하는 공기 청정기 및 이를 제어하는 방법
CN109085211B (zh) * 2018-08-07 2021-03-26 亚翔系统集成科技（苏州）股份有限公司 一种洁净室受害区检测方法
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Also Published As

Publication number Publication date
EP0810634A2 (en) 1997-12-03
US5876280A (en) 1999-03-02
EP0810634A3 (en) 2000-04-12
TW333658B (en) 1998-06-11
EP1385195A3 (en) 2004-03-17
KR970077124A (ko) 1997-12-12
EP1385195A2 (en) 2004-01-28
EP1400760A1 (en) 2004-03-24

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