SG63571A1 - Liquid crystal display apparatus structure for mounting semiconductor device method of mounting semiconductor device electronic optical apparatus and electronic printing apparatus - Google Patents
Liquid crystal display apparatus structure for mounting semiconductor device method of mounting semiconductor device electronic optical apparatus and electronic printing apparatusInfo
- Publication number
- SG63571A1 SG63571A1 SG1996003318A SG1996003318A SG63571A1 SG 63571 A1 SG63571 A1 SG 63571A1 SG 1996003318 A SG1996003318 A SG 1996003318A SG 1996003318 A SG1996003318 A SG 1996003318A SG 63571 A1 SG63571 A1 SG 63571A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- mounting semiconductor
- electronic
- liquid crystal
- crystal display
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23969892 | 1992-09-08 | ||
| JP15732393 | 1993-06-28 | ||
| JP15861093 | 1993-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG63571A1 true SG63571A1 (en) | 1999-03-30 |
Family
ID=27321144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1996003318A SG63571A1 (en) | 1992-09-08 | 1993-09-08 | Liquid crystal display apparatus structure for mounting semiconductor device method of mounting semiconductor device electronic optical apparatus and electronic printing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| SG (1) | SG63571A1 (mo) |
| TW (1) | TW255974B (mo) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7038239B2 (en) | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| TWI512697B (zh) * | 2010-12-31 | 2015-12-11 | Innolux Corp | 顯示裝置與可拆卸重工裝置 |
| TWI790878B (zh) * | 2021-12-28 | 2023-01-21 | 奇景光電股份有限公司 | 顯示系統及適用於顯示系統的墊片配置 |
-
1993
- 1993-09-01 TW TW082107140A patent/TW255974B/zh active
- 1993-09-08 SG SG1996003318A patent/SG63571A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW255974B (mo) | 1995-09-01 |
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