TW255974B - - Google Patents
Info
- Publication number
- TW255974B TW255974B TW082107140A TW82107140A TW255974B TW 255974 B TW255974 B TW 255974B TW 082107140 A TW082107140 A TW 082107140A TW 82107140 A TW82107140 A TW 82107140A TW 255974 B TW255974 B TW 255974B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23969892 | 1992-09-08 | ||
| JP15732393 | 1993-06-28 | ||
| JP15861093 | 1993-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW255974B true TW255974B (mo) | 1995-09-01 |
Family
ID=27321144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082107140A TW255974B (mo) | 1992-09-08 | 1993-09-01 |
Country Status (2)
| Country | Link |
|---|---|
| SG (1) | SG63571A1 (mo) |
| TW (1) | TW255974B (mo) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7955975B2 (en) | 2002-04-09 | 2011-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| TWI512697B (zh) * | 2010-12-31 | 2015-12-11 | Innolux Corp | 顯示裝置與可拆卸重工裝置 |
| TWI790878B (zh) * | 2021-12-28 | 2023-01-21 | 奇景光電股份有限公司 | 顯示系統及適用於顯示系統的墊片配置 |
-
1993
- 1993-09-01 TW TW082107140A patent/TW255974B/zh active
- 1993-09-08 SG SG1996003318A patent/SG63571A1/en unknown
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7955975B2 (en) | 2002-04-09 | 2011-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US7994504B2 (en) | 2002-04-09 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US7999263B2 (en) | 2002-04-09 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US8120033B2 (en) | 2002-04-09 | 2012-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US8502215B2 (en) | 2002-04-09 | 2013-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US8946717B2 (en) | 2002-04-09 | 2015-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US8946718B2 (en) | 2002-04-09 | 2015-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| US9105727B2 (en) | 2002-04-09 | 2015-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| TWI512697B (zh) * | 2010-12-31 | 2015-12-11 | Innolux Corp | 顯示裝置與可拆卸重工裝置 |
| TWI790878B (zh) * | 2021-12-28 | 2023-01-21 | 奇景光電股份有限公司 | 顯示系統及適用於顯示系統的墊片配置 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG63571A1 (en) | 1999-03-30 |