SG63750A1 - Integrated circuit device and process for its manufacture - Google Patents

Integrated circuit device and process for its manufacture

Info

Publication number
SG63750A1
SG63750A1 SG1997003478A SG1997003478A SG63750A1 SG 63750 A1 SG63750 A1 SG 63750A1 SG 1997003478 A SG1997003478 A SG 1997003478A SG 1997003478 A SG1997003478 A SG 1997003478A SG 63750 A1 SG63750 A1 SG 63750A1
Authority
SG
Singapore
Prior art keywords
manufacture
integrated circuit
circuit device
integrated
circuit
Prior art date
Application number
SG1997003478A
Other languages
English (en)
Inventor
Hugh Ralph Brown
Kenneth Raymond Carter
Hyuk-Jin Cha
Richard Anthony Dipietro
James Lupton Hedrick
John Patrick Hummel
Robert Dennis Miller
Do Yeung Yoon
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SG63750A1 publication Critical patent/SG63750A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
SG1997003478A 1996-10-28 1997-09-20 Integrated circuit device and process for its manufacture SG63750A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/739,144 US5962113A (en) 1996-10-28 1996-10-28 Integrated circuit device and process for its manufacture

Publications (1)

Publication Number Publication Date
SG63750A1 true SG63750A1 (en) 1999-03-30

Family

ID=24971025

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003478A SG63750A1 (en) 1996-10-28 1997-09-20 Integrated circuit device and process for its manufacture

Country Status (8)

Country Link
US (1) US5962113A (fr)
EP (1) EP0838853A3 (fr)
JP (1) JPH10135202A (fr)
KR (1) KR100315936B1 (fr)
CN (1) CN1151558C (fr)
MY (1) MY118011A (fr)
SG (1) SG63750A1 (fr)
TW (1) TW436946B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323549B1 (en) 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
CN1171290C (zh) * 1998-06-05 2004-10-13 佐治亚技术研究公司 多孔性绝缘材料及其制备方法
US6143643A (en) * 1998-07-08 2000-11-07 International Business Machines Corporation Process for manufacture of integrated circuit device using organosilicate insulative matrices
US6299721B1 (en) 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
JP3865115B2 (ja) * 1999-09-13 2007-01-10 Ｈｏｙａ株式会社 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード
US6420441B1 (en) 1999-10-01 2002-07-16 Shipley Company, L.L.C. Porous materials
US6903006B2 (en) * 2000-03-17 2005-06-07 Matsushita Electric Industrial Co., Ltd. Interlayer dielectric film, and method for forming the same and interconnection
TWI226103B (en) * 2000-08-31 2005-01-01 Georgia Tech Res Inst Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
AU2001288954A1 (en) 2000-09-13 2002-03-26 Shipley Company, L.L.C. Electronic device manufacture
US6998148B1 (en) 2001-03-28 2006-02-14 Shipley Company, L.L.C. Porous materials
JP3505520B2 (ja) * 2001-05-11 2004-03-08 松下電器産業株式会社 層間絶縁膜
TW562822B (en) * 2002-09-03 2003-11-21 Chang Chun Plastics Co Ltd Organic-inorganic hybrid film material and its preparation
WO2006109514A1 (fr) * 2005-03-30 2006-10-19 Nippon Steel Chemical Co., Ltd. Composition de resine photosensible et substrat pour circuit l’utilisant
US8952119B2 (en) * 2010-11-18 2015-02-10 Aspen Aerogels, Inc. Organically modified hybrid aerogels
TWI540396B (zh) * 2014-02-18 2016-07-01 奇美實業股份有限公司 感光性聚矽氧烷組成物、保護膜及具有保護膜的元件
CN108864711A (zh) * 2018-06-15 2018-11-23 王娟娟 一种用于芯片封装的有机硅胶材料及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1356919A (en) * 1970-04-17 1974-06-19 Ici Ltd Glass reinforced polymer composites
US3835207A (en) * 1972-05-03 1974-09-10 Westinghouse Electric Corp Method for forming reverse osmosis membranes composed of polyamic acid salts
US4141877A (en) * 1977-09-06 1979-02-27 Corning Glass Works Processing organic polymers with hydrated glasses
US4430153A (en) * 1983-06-30 1984-02-07 International Business Machines Corporation Method of forming an RIE etch barrier by in situ conversion of a silicon containing alkyl polyamide/polyimide
US4535099A (en) * 1984-04-03 1985-08-13 Imi-Tech Corporation Polyimide foam from mixture of silicon containing diamine and different aromatic diamine
US4758476A (en) * 1984-12-12 1988-07-19 Hitachi Chemical Company, Ltd. Polyimide precursor resin composition and semiconductor device using the same
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
JPH0749482B2 (ja) * 1988-02-26 1995-05-31 チッソ株式会社 低吸湿性かつ高接着性のシリコン含有ポリイミド及びその前駆体の製造方法
US5094919A (en) * 1988-06-30 1992-03-10 Nippon Steel Chemical Co., Ltd. Polyimide copolymers and process for preparing the same
US5043369A (en) * 1988-10-17 1991-08-27 Corning Incorporated Glass/glass-ceramic-plastic alloy articles
JP2619515B2 (ja) * 1989-02-02 1997-06-11 チッソ株式会社 シリコンポリイミド前駆体組成物
US5036145A (en) * 1989-07-10 1991-07-30 Armstrong World Industries, Inc. Alkoxysilane and alkoxysilane terminated polyamic or polyimide lacquer composition
US5206337A (en) * 1990-05-10 1993-04-27 Sumitomo Bakelite Company Limited Solvent-soluble polyimidesiloxane oligomer and process for producing the same
US5288842A (en) * 1991-01-30 1994-02-22 International Business Machines Corporation Morphological composite materials formed from different precursors
US5252654A (en) * 1991-07-03 1993-10-12 E. I. Du Pont De Nemours And Company Organic-inorganic polymeric composites
US5412016A (en) * 1992-09-28 1995-05-02 E. I. Du Pont De Nemours And Company Process for making polymeric inorganic-organic compositions
US5371047A (en) * 1992-10-30 1994-12-06 International Business Machines Corporation Chip interconnection having a breathable etch stop layer
US5384376A (en) * 1992-12-23 1995-01-24 Eastman Kodak Company Organic/inorganic hybrid materials
JP3395269B2 (ja) * 1993-07-16 2003-04-07 チッソ株式会社 低熱伝導率ポリイミドシロキサンフィルム
US5767014A (en) * 1996-10-28 1998-06-16 International Business Machines Corporation Integrated circuit and process for its manufacture

Also Published As

Publication number Publication date
KR100315936B1 (ko) 2002-02-19
CN1188987A (zh) 1998-07-29
EP0838853A2 (fr) 1998-04-29
CN1151558C (zh) 2004-05-26
MY118011A (en) 2004-08-30
US5962113A (en) 1999-10-05
JPH10135202A (ja) 1998-05-22
EP0838853A3 (fr) 2000-01-05
TW436946B (en) 2001-05-28
KR19980032201A (ko) 1998-07-25

Similar Documents

Publication Publication Date Title
SG54456A1 (en) Semconductor integrated circuit device and method for manufacturing the same
SG53076A1 (en) Integrated circuit device and process for its manufacture
SG73471A1 (en) Integrated circuit and process for its manufacture
GB9624715D0 (en) Electronic device manufacture
SG54470A1 (en) Semiconductor device and process for manufacturing the same
AU3267797A (en) Integrated circuit device and method of making the same
SG75953A1 (en) Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device
GB9504272D0 (en) Fan device for integrated circuit
EP0943157A4 (fr) Circuit electronique integre
SG90064A1 (en) Semiconductor device and manufacturing method thereof
SG74035A1 (en) Semiconductor device and manufacturing method thereof
GB9613065D0 (en) Electronic device manufacture
GB2313954B (en) Semiconductor device and method for manufacturing same
SG63750A1 (en) Integrated circuit device and process for its manufacture
GB9606083D0 (en) Electronic device manufacture
GB9417244D0 (en) Integrated circuit device and test method therefor
SG54398A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
SG60044A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
GB9617885D0 (en) Electronic device manufacture
SG70082A1 (en) Semiconductor integrated circuit device and process for manufacturing the same
GB9610878D0 (en) Electronic device manufacture
GB9406263D0 (en) Integrated circuit
GB2296587B (en) Integrated circuit
US5806571C1 (en) Apparatus and method for forming the external leads of an integrated circuit
TW310120U (en) High-frequency circuit device and manufacturing method thereof