SG66408A1 - Heat-conductive paste - Google Patents

Heat-conductive paste

Info

Publication number
SG66408A1
SG66408A1 SG1997004007A SG1997004007A SG66408A1 SG 66408 A1 SG66408 A1 SG 66408A1 SG 1997004007 A SG1997004007 A SG 1997004007A SG 1997004007 A SG1997004007 A SG 1997004007A SG 66408 A1 SG66408 A1 SG 66408A1
Authority
SG
Singapore
Prior art keywords
heat
conductive paste
paste
conductive
Prior art date
Application number
SG1997004007A
Other languages
English (en)
Inventor
Yushi Sakamoto
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG66408A1 publication Critical patent/SG66408A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Position Input By Displaying (AREA)
SG1997004007A 1996-11-29 1997-11-11 Heat-conductive paste SG66408A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32055496 1996-11-29

Publications (1)

Publication Number Publication Date
SG66408A1 true SG66408A1 (en) 1999-07-20

Family

ID=18122733

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004007A SG66408A1 (en) 1996-11-29 1997-11-11 Heat-conductive paste

Country Status (8)

Country Link
US (1) US5908881A (de)
EP (1) EP0845499B1 (de)
KR (1) KR19980042885A (de)
CN (1) CN1105161C (de)
DE (1) DE69722145T2 (de)
MY (1) MY133103A (de)
SG (1) SG66408A1 (de)
TW (1) TW432085B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19905869C1 (de) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Bindemittel enthaltende Masse für die Beschichtung von Leiterplatten , Verwendung als Leiterplatten und Verfahren zur Herstellung
JP2003531941A (ja) * 2000-04-21 2003-10-28 ヘンケル ロックタイト コーポレイション レオロジー調整したエポキシ系組成物
JP3854103B2 (ja) * 2001-06-28 2006-12-06 住友ベークライト株式会社 導電性ペースト及び該ペーストを用いてなる半導体装置
US6565772B2 (en) * 2001-09-25 2003-05-20 Midwest Thermal Spray Conductive resin composition
IE20020293A1 (en) * 2002-04-23 2003-10-29 Loctite R & D Ltd Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates
KR20020060926A (ko) * 2001-11-16 2002-07-19 (주)켐트론 반도체 다이 본딩용 열전도성 페이스트
US20030036587A1 (en) * 2002-08-26 2003-02-20 Kozak Kyra M Rheology-controlled epoxy-based compositons
KR100652236B1 (ko) * 2005-03-18 2006-12-01 엘에스산전 주식회사 배선용차단기의 순시트립장치
FR2921666B1 (fr) * 2007-10-01 2012-11-09 Saint Gobain Abrasives Inc Composition resinique liquide pour articles abrasifs
CN102174241B (zh) * 2010-12-31 2015-04-22 东莞市阿比亚能源科技有限公司 一种用于光伏组件的银浆
CN102277111B (zh) * 2011-05-30 2012-11-07 天津安品有机硅材料有限公司 基于丙烯酸的无基材导热贴片的制备方法
WO2018084518A1 (ko) 2016-11-02 2018-05-11 (주)바이오니아 코어-쉘 구조의 은 코팅된 구리 나노와이어를 포함하는 에폭시 페이스트 조성물 및 이를 포함하는 도전성 필름
KR20180095410A (ko) * 2017-02-17 2018-08-27 주식회사 동진쎄미켐 도전성 접착제 조성물
WO2019187414A1 (ja) * 2018-03-30 2019-10-03 京セラ株式会社 電子部品接着用樹脂組成物、小型チップ部品の接着方法、電子回路基板の製造方法および電子回路基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0042693B1 (de) * 1980-06-21 1985-03-27 LUCAS INDUSTRIES public limited company Baugruppe mit Leistungshalbleitern und Verfahren zur Herstellung derselben
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
CN1054092A (zh) * 1989-11-14 1991-08-28 戴维·杜兰特 抗潮导电粘合剂及其制造和使用方法
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
KR950009152B1 (ko) * 1990-01-25 1995-08-16 신에쓰 가가꾸 고오교 가부시끼가이샤 에폭시 수지 조성물 및 반도체 장치
EP0501734B1 (de) * 1991-02-26 1997-10-15 Toray Industries, Inc. Epoxyharzzusammensetzung zur Verkapselung einer Halbleiteranordnung
JPH0817052B2 (ja) * 1991-07-02 1996-02-21 住友ベークライト株式会社 導電性樹脂ペースト
JPH0669257A (ja) * 1992-08-21 1994-03-11 Hitachi Chem Co Ltd 半導体素子用接着剤および半導体装置
JPH0790239A (ja) * 1993-09-27 1995-04-04 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JP2974902B2 (ja) * 1993-12-24 1999-11-10 住友ベークライト株式会社 導電性樹脂ペースト
US5575956A (en) * 1995-07-19 1996-11-19 Hughes Aircraft Company Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives

Also Published As

Publication number Publication date
KR19980042885A (ko) 1998-08-17
EP0845499A2 (de) 1998-06-03
CN1184138A (zh) 1998-06-10
DE69722145T2 (de) 2004-04-08
EP0845499A3 (de) 1998-09-16
TW432085B (en) 2001-05-01
US5908881A (en) 1999-06-01
DE69722145D1 (de) 2003-06-26
CN1105161C (zh) 2003-04-09
EP0845499B1 (de) 2003-05-21
MY133103A (en) 2007-10-31

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