SG71753A1 - Optical curing process for integrated circuit package assembly - Google Patents

Optical curing process for integrated circuit package assembly

Info

Publication number: SG71753A1
Authority: SG; Singapore
Prior art keywords: integrated circuit; curing process; circuit package; package assembly; optical curing
Prior art date: 1994-06-07

Application number

SG1998000252A

Other languages

English (en)

Inventor

Ming Yang

Leslie E Stark

Gonzalo Amador

Original Assignee

Texas Instruments Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-06-07

Filing date

1995-06-07

Publication date

2000-04-18

1995-06-07 Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc

2000-04-18 Publication of SG71753A1 publication Critical patent/SG71753A1/en

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1412—Infrared [IR] radiation
- B29C65/1416—Near-infrared radiation [NIR]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07335—Applying EM radiation, e.g. induction heating or using a laser
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
- H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

SG1998000252A 1994-06-07 1995-06-07 Optical curing process for integrated circuit package assembly SG71753A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US25520094A	1994-06-07	1994-06-07

Publications (1)

Publication Number	Publication Date
SG71753A1 true SG71753A1 (en)	2000-04-18

Family

ID=22967277

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG1998000252A SG71753A1 (en)	1994-06-07	1995-06-07	Optical curing process for integrated circuit package assembly

Country Status (5)

Country	Link
US (1)	US5846476A (fr)
EP (2)	EP0691679A3 (fr)
JP (1)	JPH08340013A (fr)
KR (1)	KR100377981B1 (fr)
SG (1)	SG71753A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6041994A (en) *	1994-06-07	2000-03-28	Texas Instruments Incorporated	Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source
US5783025A (en) *	1994-06-07	1998-07-21	Texas Instruments Incorporated	Optical diebonding for semiconductor devices
TW312045B (en)	1995-04-25	1997-08-01	Texas Instruments Inc	Radiant chamber and method for lid seal in ceramic packaging
TW315493B (en) *	1996-02-28	1997-09-11	Tokyo Electron Co Ltd	Heating apparatus and heat treatment apparatus
US5993591A (en) *	1996-12-18	1999-11-30	Texas Instruments Incorporated	Coring of leadframes in carriers via radiant heat source
US6730541B2 (en) *	1997-11-20	2004-05-04	Texas Instruments Incorporated	Wafer-scale assembly of chip-size packages
ID21876A (id) *	1998-02-26	1999-08-05	Sumitomo Wiring Systems	Pembawa angkutan, sistem pemanasan untuk penggunaan bersamanya dan metoda untuk menutup bagian sambungan kawat
US6299804B1 (en) *	1999-09-16	2001-10-09	Husky Injection Molding Systems Ltd.	Air cooling system for preform molding
DE10147789B4 (de) *	2001-09-27	2004-04-15	Infineon Technologies Ag	Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips
JP3786097B2 (ja) *	2002-03-25	2006-06-14	セイコーエプソン株式会社	圧電デバイスの蓋封止方法及び圧電デバイスの製造方法並びに圧電デバイスの蓋封止装置
JP4421218B2 (ja) *	2003-05-21	2010-02-24	大日本スクリーン製造株式会社	熱処理装置
US7288472B2 (en) *	2004-12-21	2007-10-30	Intel Corporation	Method and system for performing die attach using a flame
DE102005029407B4 (de) *	2005-06-24	2008-06-19	Mühlbauer Ag	Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
US7826724B2 (en) *	2006-04-24	2010-11-02	Nordson Corporation	Electronic substrate non-contact heating system and method
DE102006054357A1 (de) *	2006-11-17	2008-05-21	Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH	Sockel für eine Reflektor-Lampenanordnung
KR101049369B1 (ko) *	2009-03-10	2011-07-14	오성엘에스티(주)	인라인 타입 큐어장치
US20130256281A1 (en) *	2012-03-30	2013-10-03	Tatsumi Tsuchiya	Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
CN107112248B (zh) *	2015-11-05	2021-07-27	古河电气工业株式会社	芯片接合装置以及芯片接合方法
JP6419256B1 (ja) *	2017-04-28	2018-11-07	株式会社後島精工	ボンディング装置の不活性ガスフローシステム
CN111656505B (zh) *	2018-01-25	2024-01-30	库利克和索夫工业公司	用于焊接机的焊接工具、用于焊接半导体元件的焊接机及相关方法

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US2388042A (en) *	1943-02-17	1945-10-30	Gen Motors Corp	Method of sealing storage batteries
US2638633A (en) *	1949-09-08	1953-05-19	United Shoe Machinery Corp	Molding of resin dispersions
US2941934A (en) *	1957-01-16	1960-06-21	Gen Aniline & Film Corp	Polymerization by temperature controlled irradiation
US4167669A (en) *	1971-09-09	1979-09-11	Xenon Corporation	Apparatus for rapid curing of resinous materials and method
JPS5475065A (en) *	1977-11-28	1979-06-15	Asahi Chemical Ind	Preparation of film circuit substrate
JPS562646A (en) *	1979-06-22	1981-01-12	Hitachi Ltd	Removal and reinstallation of silicon chip
US4460537A (en) *	1982-07-26	1984-07-17	Motorola, Inc.	Slot transfer molding apparatus and methods
JPS5930470A (ja) *	1982-08-13	1984-02-18	Hitachi Ltd	配線基板のハンダ付方法
EP0114258A1 (fr) *	1982-11-30	1984-08-01	Kabushiki Kaisha Toshiba	Capsulation en résine de dispositifs photovoltaiques à semi-conducteur
US4699888A (en) *	1985-09-16	1987-10-13	Technology Glass Corporation	Die/attach composition
FR2592221B1 (fr) *	1985-12-20	1988-02-12	Radiotechnique Compelec	Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique
JPH0674479B2 (ja) *	1986-10-09	1994-09-21	スカイアルミニウム株式会社	リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPS63283054A (ja) *	1987-03-11	1988-11-18	Fuji Plant Kogyo Kk	ピン保持部付リードフレームの製造方法
JPS6442136A (en) *	1987-08-07	1989-02-14	Nitto Denko Corp	Manufacture of semiconductor device
JPS6451619A (en) *	1987-08-21	1989-02-27	Dainippon Screen Mfg	Heat treatment equipment for substrate
EP0307608B1 (fr) *	1987-09-16	1992-05-13	Siemens Aktiengesellschaft	Appareillage et procédé pour le recuit de plaquettes de semi-conducteurs
DE3744764A1 (de) *	1987-11-20	1989-06-01	Messerschmitt Boelkow Blohm	Verfahren zur herstellung von klebeverbindungen mittels laser
DE3806738C1 (fr) *	1988-03-02	1989-09-07	Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
JP2684677B2 (ja) *	1988-05-25	1997-12-03	株式会社日立製作所	半導体装置の製造方法
US4913930A (en) *	1988-06-28	1990-04-03	Wacker Silicones Corporation	Method for coating semiconductor components on a dielectric film
EP0407585A4 (en) *	1988-07-15	1992-06-10	Toray Silicone Co. Ltd.	Semiconductor device sealed with resin and a method of producing the same
JPH0322543A (ja) *	1989-06-05	1991-01-30	Siemens Ag	電子デバイスの被覆方法及び装置
JPH0482215A (ja) *	1990-07-25	1992-03-16	Sumitomo Electric Ind Ltd	ランプアニール装置
US4996170A (en) *	1990-07-30	1991-02-26	Motorola, Inc.	Molding process for encapsulating semiconductor devices using a thixotropic compound
DE4127009C2 (de) *	1991-08-16	1994-07-28	Brkljacic Silva Geb Marjanovic	Verfahren zum Prüfen von fotopolymeren Lötabdeckmasken, die auf Leiterplatten aus glasfaserverstärktem Epoxidharz aufgetragen sind und Vorrichtung zur Durchführung des Verfahrens
JP3175979B2 (ja) *	1992-09-14	2001-06-11	株式会社東芝	樹脂封止型半導体装置

1995
- 1995-06-05 KR KR1019950014791A patent/KR100377981B1/ko not_active Expired - Fee Related
- 1995-06-06 JP JP7139337A patent/JPH08340013A/ja active Pending
- 1995-06-07 EP EP95108776A patent/EP0691679A3/fr not_active Withdrawn
- 1995-06-07 SG SG1998000252A patent/SG71753A1/en unknown
- 1995-06-07 EP EP96105280A patent/EP0723289A3/fr not_active Ceased
1997
- 1997-05-02 US US08/848,942 patent/US5846476A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH08340013A (ja)	1996-12-24
KR960002709A (ko)	1996-01-26
EP0691679A2 (fr)	1996-01-10
KR100377981B1 (ko)	2003-05-27
EP0691679A3 (fr)	1996-05-01
EP0723289A2 (fr)	1996-07-24
US5846476A (en)	1998-12-08
EP0723289A3 (fr)	1997-04-09

Publication	Publication Date	Title
SG71753A1 (en)	2000-04-18	Optical curing process for integrated circuit package assembly
GB2306775B (en)	2000-09-20	Integrated circuit package
AU1835595A (en)	1996-05-06	Integrated circuit package
IL112825A (en)	1997-09-30	Housing for optical components
EP0691680A4 (fr)	1996-04-03	Boitier pour composant electronique
ZA953337B (en)	1996-01-09	Modified epoxy resin
IL121154A (en)	2000-02-17	Mount for optical components
GB2274740B (en)	1996-07-10	Optical integrated circuit
GB2292468B (en)	1998-04-15	Manufacturing method for an optical waveguide
GB2300187B (en)	1998-09-02	Cure-accelerator for epoxy resin
AU3820195A (en)	1996-05-15	Leadframe for an encapsulated optocomponent
GB2283042B (en)	1996-12-18	Method for fabricating long-fibre-reinforced components
AU7199994A (en)	1995-08-01	Improved low-cost package for electronic components
GB9406263D0 (en)	1994-05-18	Integrated circuit
GB2296587B (en)	1997-03-12	Integrated circuit
SG28288A1 (en)	1996-04-01	Optical curing process for integrated circuit package assembly
GB9504786D0 (en)	1995-04-26	Integrated optical circuit
GB2284713B (en)	1997-11-12	Integrated circuit package
GB2301361B (en)	1997-09-17	High temperature epoxy resins
GB2296585B (en)	1997-03-19	Integrated circuit
GB2321971B (en)	1999-05-26	Method for manufacturing an integrated optical circuit
GB2309540B (en)	1999-04-28	Integrated optical circuit
GB2299891B (en)	1999-06-16	Integrated circuit packages
CA74618S (en)	1994-08-25	Package for contact lens contaibers
KR100224484B1 (en)	1999-10-15	Integrated circuit package