SG72768A1 - Processing apparatus - Google Patents

Processing apparatus

Info

Publication number
SG72768A1
SG72768A1 SG1997003974A SG1997003974A SG72768A1 SG 72768 A1 SG72768 A1 SG 72768A1 SG 1997003974 A SG1997003974 A SG 1997003974A SG 1997003974 A SG1997003974 A SG 1997003974A SG 72768 A1 SG72768 A1 SG 72768A1
Authority
SG
Singapore
Prior art keywords
processing apparatus
processing
Prior art date
Application number
SG1997003974A
Other languages
English (en)
Inventor
Masami Akimoto
Yoichi Deguchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29684096A external-priority patent/JP3320622B2/ja
Priority claimed from JP31265896A external-priority patent/JP3421521B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG72768A1 publication Critical patent/SG72768A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0448Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
SG1997003974A 1996-11-08 1997-11-06 Processing apparatus SG72768A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29684096A JP3320622B2 (ja) 1996-11-08 1996-11-08 処理装置および処理方法
JP31265896A JP3421521B2 (ja) 1996-11-11 1996-11-11 処理装置

Publications (1)

Publication Number Publication Date
SG72768A1 true SG72768A1 (en) 2000-05-23

Family

ID=26560871

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003974A SG72768A1 (en) 1996-11-08 1997-11-06 Processing apparatus

Country Status (6)

Country Link
US (1) US5937223A (fr)
EP (1) EP0841688B1 (fr)
KR (1) KR100340235B1 (fr)
DE (1) DE69735042T2 (fr)
SG (1) SG72768A1 (fr)
TW (1) TW353777B (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6247479B1 (en) * 1997-05-27 2001-06-19 Tokyo Electron Limited Washing/drying process apparatus and washing/drying process method
SG76561A1 (en) * 1997-09-22 2000-11-21 Tokyo Electron Ltd Processing apparatus and method
JP3422799B2 (ja) * 1998-05-01 2003-06-30 東京エレクトロン株式会社 膜厚測定装置、基板処理方法並びに基板処理装置
JP3517121B2 (ja) * 1998-08-12 2004-04-05 東京エレクトロン株式会社 処理装置
TW425598B (en) * 1998-10-30 2001-03-11 Tokyo Electron Ltd Processing system
US6350316B1 (en) * 1998-11-04 2002-02-26 Tokyo Electron Limited Apparatus for forming coating film
US6533531B1 (en) * 1998-12-29 2003-03-18 Asml Us, Inc. Device for handling wafers in microelectronic manufacturing
US6616394B1 (en) 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
JP3542919B2 (ja) * 1999-03-18 2004-07-14 東京エレクトロン株式会社 基板処理装置
JP3851751B2 (ja) * 1999-03-24 2006-11-29 東京エレクトロン株式会社 処理システム
JP4021118B2 (ja) * 1999-04-28 2007-12-12 東京エレクトロン株式会社 基板処理装置
JP4343326B2 (ja) * 1999-05-14 2009-10-14 キヤノン株式会社 基板搬送装置および露光装置
JP3416078B2 (ja) 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
US6402400B1 (en) * 1999-10-06 2002-06-11 Tokyo Electron Limited Substrate processing apparatus
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR100348938B1 (ko) * 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
US6676757B2 (en) * 1999-12-17 2004-01-13 Tokyo Electron Limited Coating film forming apparatus and coating unit
EP1124252A2 (fr) * 2000-02-10 2001-08-16 Applied Materials, Inc. Appareil et méthode de traitement de substrats
US20020045967A1 (en) * 2000-10-17 2002-04-18 Masayuki Nakano Substrate processing system
JP3713447B2 (ja) * 2001-04-05 2005-11-09 東京エレクトロン株式会社 現像処理装置
US7067010B2 (en) * 2002-04-05 2006-06-27 Biddle Harold A Indexing spray machine
JP2003347186A (ja) * 2002-05-23 2003-12-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004071730A (ja) * 2002-08-05 2004-03-04 Sendai Nikon:Kk レチクルハンドリング方法、レチクルハンドリング装置及び露光装置
KR100483428B1 (ko) * 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
CN100407371C (zh) * 2003-08-29 2008-07-30 株式会社尼康 曝光装置和器件加工方法
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4589853B2 (ja) * 2005-09-22 2010-12-01 東京エレクトロン株式会社 基板搬送システム及び基板搬送方法
JP4666494B2 (ja) * 2005-11-21 2011-04-06 大日本スクリーン製造株式会社 基板処理装置
JP4767783B2 (ja) * 2006-07-26 2011-09-07 東京エレクトロン株式会社 液処理装置
KR100897850B1 (ko) * 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Sokudo 基板処理装置
DE102007051726A1 (de) * 2007-10-25 2009-04-30 Hänel & Co. Lageranordnung mit vorgebbarer Lagerungsatmosphäre
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Sokudo 基板処理装置
JP5318403B2 (ja) 2007-11-30 2013-10-16 株式会社Sokudo 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Sokudo 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Sokudo 基板処理装置
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
JP6503281B2 (ja) 2015-11-13 2019-04-17 株式会社Screenホールディングス 基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP2559617B2 (ja) * 1988-03-24 1996-12-04 キヤノン株式会社 基板処理装置
JP2919925B2 (ja) * 1990-07-26 1999-07-19 東京エレクトロン株式会社 処理装置
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
JP2928432B2 (ja) * 1993-02-16 1999-08-03 東京エレクトロン株式会社 半導体ウエハの蒸気乾燥装置及びその消火方法及び洗浄システム
JP3196917B2 (ja) * 1994-06-17 2001-08-06 大日本スクリーン製造株式会社 基板処理装置
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
JP3213748B2 (ja) * 1994-08-04 2001-10-02 東京エレクトロン株式会社 処理システム
TW297910B (fr) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
TW353777B (en) 1999-03-01
DE69735042T2 (de) 2006-08-24
EP0841688A3 (fr) 1999-12-29
US5937223A (en) 1999-08-10
DE69735042D1 (de) 2006-03-30
EP0841688A2 (fr) 1998-05-13
KR100340235B1 (ko) 2002-10-12
EP0841688B1 (fr) 2006-01-04
KR19980042217A (ko) 1998-08-17

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