SG85624A1 - Epoxy resin composition and resin-encapsulated semiconductor device - Google Patents

Epoxy resin composition and resin-encapsulated semiconductor device

Info

Publication number
SG85624A1
SG85624A1 SG9901099A SG1999001099A SG85624A1 SG 85624 A1 SG85624 A1 SG 85624A1 SG 9901099 A SG9901099 A SG 9901099A SG 1999001099 A SG1999001099 A SG 1999001099A SG 85624 A1 SG85624 A1 SG 85624A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
encapsulated semiconductor
resin composition
epoxy resin
resin
Prior art date
Application number
SG9901099A
Other languages
English (en)
Inventor
Matsuoka Yoshiki
Hirano Yasuhiro
Nakajima Nobuyuki
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6330498A external-priority patent/JPH11256010A/ja
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG85624A1 publication Critical patent/SG85624A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG9901099A 1998-03-13 1999-03-11 Epoxy resin composition and resin-encapsulated semiconductor device SG85624A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6330498A JPH11256010A (ja) 1998-03-13 1998-03-13 エポキシ樹脂組成物および製造方法
JP11328898 1998-04-23

Publications (1)

Publication Number Publication Date
SG85624A1 true SG85624A1 (en) 2002-01-15

Family

ID=26404402

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901099A SG85624A1 (en) 1998-03-13 1999-03-11 Epoxy resin composition and resin-encapsulated semiconductor device

Country Status (7)

Country Link
US (1) US6255409B1 (ko)
EP (1) EP0943639A3 (ko)
KR (1) KR19990077791A (ko)
CA (1) CA2265216A1 (ko)
MY (1) MY126565A (ko)
SG (1) SG85624A1 (ko)
TW (1) TW459016B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3911690B2 (ja) 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板
US6899917B2 (en) * 2001-12-27 2005-05-31 3M Innovative Properties Company Powdered epoxy composition
WO2013009114A2 (en) * 2011-07-12 2013-01-17 Lg Innotek Co., Ltd. Epoxy resin compound and radiant heat circuit board using the same
JP6060904B2 (ja) * 2011-09-29 2017-01-18 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP2014091744A (ja) * 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
KR101713315B1 (ko) * 2014-10-13 2017-03-08 주식회사 이알지 휴대용 셰일가스 환경오염물질 실시간 모니터링 장치
KR101882564B1 (ko) * 2015-12-09 2018-07-27 삼성에스디아이 주식회사 에폭시 수지의 제조방법, 에폭시 수지, 이를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용해 성형된 성형품

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0507271A2 (en) * 1991-04-03 1992-10-07 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5458929A (en) * 1994-02-15 1995-10-17 The Dow Chemical Company Cure controlled catalyzed mixtures of epoxy resins and curing agents containing mesogenic moieties, B-staged and cured products therefrom
EP0739877A2 (en) * 1995-04-27 1996-10-30 Sumitomo Chemical Company Limited Epoxy resin, resin composition, and resin-encapsulated semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02300255A (ja) 1989-05-15 1990-12-12 Toyo Tire & Rubber Co Ltd エポキシ樹脂組成物及びその製造法
US5414058A (en) * 1990-05-28 1995-05-09 Somar Corporation Powder coating composition comprising conventional epoxides with crystalline epoxides and curing agents
JPH04198211A (ja) 1990-11-27 1992-07-17 Sumitomo Bakelite Co Ltd 樹脂組成物
CA2066497A1 (en) * 1991-05-01 1992-11-02 Michael K. Gallagher Epoxy molding composition for surface mount applications
JPH0776268B2 (ja) * 1991-06-25 1995-08-16 ソマール株式会社 エポキシ樹脂粉体組成物の製造方法
JP2991849B2 (ja) * 1992-01-28 1999-12-20 住友ベークライト株式会社 エポキシ樹脂組成物
JPH06298902A (ja) * 1993-04-16 1994-10-25 Toto Kasei Kk エポキシ樹脂組成物
JPH08311168A (ja) * 1995-05-16 1996-11-26 Hitachi Chem Co Ltd 光半導体素子封止用エポキシ樹脂組成物及び該エポキシ樹脂組成物を用いた光半導体装置
TW565592B (en) * 1997-03-31 2003-12-11 Sumitomo Chemical Co Epoxy resin composition and method for producing the same
TW593528B (en) * 1997-03-31 2004-06-21 Sumitomo Chemical Co Epoxy resin composition
JP3734602B2 (ja) * 1997-05-29 2006-01-11 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0507271A2 (en) * 1991-04-03 1992-10-07 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5458929A (en) * 1994-02-15 1995-10-17 The Dow Chemical Company Cure controlled catalyzed mixtures of epoxy resins and curing agents containing mesogenic moieties, B-staged and cured products therefrom
EP0739877A2 (en) * 1995-04-27 1996-10-30 Sumitomo Chemical Company Limited Epoxy resin, resin composition, and resin-encapsulated semiconductor device

Also Published As

Publication number Publication date
KR19990077791A (ko) 1999-10-25
EP0943639A3 (en) 2001-02-07
TW459016B (en) 2001-10-11
US6255409B1 (en) 2001-07-03
EP0943639A2 (en) 1999-09-22
CA2265216A1 (en) 1999-09-13
MY126565A (en) 2006-10-31

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