SG87205A1 - Chemically amplified positive resist composition - Google Patents

Chemically amplified positive resist composition

Info

Publication number
SG87205A1
SG87205A1 SG200100871A SG200100871A SG87205A1 SG 87205 A1 SG87205 A1 SG 87205A1 SG 200100871 A SG200100871 A SG 200100871A SG 200100871 A SG200100871 A SG 200100871A SG 87205 A1 SG87205 A1 SG 87205A1
Authority
SG
Singapore
Prior art keywords
resist composition
positive resist
chemically amplified
amplified positive
chemically
Prior art date
Application number
SG200100871A
Other languages
English (en)
Inventor
Uetani Yasunori
Fujishima Hiroaki
Takata Yoshiyuki
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG87205A1 publication Critical patent/SG87205A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
SG200100871A 2000-02-28 2001-02-16 Chemically amplified positive resist composition SG87205A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000051018 2000-02-28

Publications (1)

Publication Number Publication Date
SG87205A1 true SG87205A1 (en) 2002-03-19

Family

ID=18572727

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100871A SG87205A1 (en) 2000-02-28 2001-02-16 Chemically amplified positive resist composition

Country Status (6)

Country Link
US (1) US6495307B2 (fr)
EP (1) EP1128212A3 (fr)
KR (1) KR100687464B1 (fr)
CN (1) CN1259595C (fr)
SG (1) SG87205A1 (fr)
TW (1) TW573225B (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529245B2 (ja) * 1999-12-03 2010-08-25 住友化学株式会社 化学増幅型ポジ型レジスト組成物
KR20010054851A (ko) * 1999-12-08 2001-07-02 윤종용 지환식 감광성 폴리머 및 이를 포함하는 레지스트조성물과 그 제조방법
US6777157B1 (en) * 2000-02-26 2004-08-17 Shipley Company, L.L.C. Copolymers and photoresist compositions comprising same
JP4329214B2 (ja) * 2000-03-28 2009-09-09 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP3962893B2 (ja) * 2001-02-09 2007-08-22 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP2002341541A (ja) * 2001-05-18 2002-11-27 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US6635401B2 (en) * 2001-06-21 2003-10-21 International Business Machines Corporation Resist compositions with polymers having 2-cyano acrylic monomer
JP4149154B2 (ja) * 2001-09-28 2008-09-10 富士フイルム株式会社 ポジ型レジスト組成物
JP3822101B2 (ja) * 2001-12-26 2006-09-13 株式会社ルネサステクノロジ 感放射線組成物及びパタン形成方法及び半導体装置の製造方法
WO2004059392A1 (fr) * 2002-12-26 2004-07-15 Tokyo Ohka Kogyo Co., Ltd. Composition de reserve positive et procede de formation d'un motif de reserve
JP2004333548A (ja) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物およびレジストパターン形成方法
JP4439270B2 (ja) * 2003-06-18 2010-03-24 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4401840B2 (ja) * 2003-07-07 2010-01-20 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
EP1666971A1 (fr) * 2003-09-25 2006-06-07 Tokyo Ohka Kogyo Co., Ltd. Composition de resine positive et lamine de resine pour faisceau electronique a faible acceleration et procede de formation de motif
KR100591007B1 (ko) * 2004-01-14 2006-06-22 금호석유화학 주식회사 신규한 중합체 및 이를 함유한 화학 증폭형 레지스트
JP2005258438A (ja) * 2004-03-08 2005-09-22 Rohm & Haas Electronic Materials Llc シアノアダマンチル化合物およびポリマーおよびこれを含有するフォトレジスト
JP4279237B2 (ja) 2004-05-28 2009-06-17 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
KR20060056237A (ko) * 2004-11-19 2006-05-24 동우 화인켐 주식회사 화학증폭형 포지티브 타입 레지스트 조성물
CN1779569B (zh) * 2004-11-22 2010-09-29 北京科华微电子材料有限公司 氟代环烯烃聚合物及在深紫外类光刻胶中的应用
TW200715067A (en) * 2005-09-06 2007-04-16 Koninkl Philips Electronics Nv Lithographic method
TW200715068A (en) * 2005-09-06 2007-04-16 Koninkl Philips Electronics Nv Lithographic method
JP2007199412A (ja) * 2006-01-26 2007-08-09 Tokyo Ohka Kogyo Co Ltd 液浸露光用ポジ型レジスト組成物およびレジストパターン形成方法
JP7144797B2 (ja) * 2018-04-05 2022-09-30 青島海爾洗衣机有限公司 縦型洗濯機
CN111378082B (zh) * 2018-12-30 2021-10-22 中国科学院沈阳自动化研究所 一种双基团光敏明胶的制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0836119A1 (fr) * 1996-10-11 1998-04-15 Samsung Electronics Co., Ltd. Composition chimiquement amplifiée pour réserve
US5968713A (en) * 1995-06-28 1999-10-19 Fujitsu Limited Chemically amplified resist compositions and process for the formation of resist patterns
JPH11305444A (ja) * 1998-02-19 1999-11-05 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
US6004720A (en) * 1993-12-28 1999-12-21 Fujitsu Limited Radiation sensitive material and method for forming pattern
EP0982628A2 (fr) * 1998-08-26 2000-03-01 Sumitomo Chemical Company, Limited Composition de photoréserve positive chimiquement amplifiée

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2881969B2 (ja) 1990-06-05 1999-04-12 富士通株式会社 放射線感光レジストとパターン形成方法
JP3751065B2 (ja) 1995-06-28 2006-03-01 富士通株式会社 レジスト材料及びレジストパターンの形成方法
JP3380128B2 (ja) 1996-11-29 2003-02-24 富士通株式会社 レジスト材料及びレジストパターンの形成方法
US5843624A (en) 1996-03-08 1998-12-01 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
JPH10739A (ja) 1996-06-12 1998-01-06 Hideki Nishioka トラック荷台のベルトコンベア
US6030747A (en) 1997-03-07 2000-02-29 Nec Corporation Chemically amplified resist large in transparency and sensitivity to exposure light less than 248 nanometer wavelength and process of forming mask
JP2973998B2 (ja) 1997-03-07 1999-11-08 日本電気株式会社 感光性樹脂組成物およびそれを用いたパターン形成方法
JP3972438B2 (ja) * 1998-01-26 2007-09-05 住友化学株式会社 化学増幅型のポジ型レジスト組成物
JP4434358B2 (ja) 1998-05-25 2010-03-17 ダイセル化学工業株式会社 フォトレジスト用化合物およびフォトレジスト用樹脂組成物
EP1443363B1 (fr) 1998-05-25 2013-07-10 Daicel Chemical Industries, Ltd. Composition de photoréserve
KR100704423B1 (ko) * 1999-03-31 2007-04-06 스미또모 가가꾸 가부시키가이샤 화학 증폭형 포지티브 레지스트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004720A (en) * 1993-12-28 1999-12-21 Fujitsu Limited Radiation sensitive material and method for forming pattern
US5968713A (en) * 1995-06-28 1999-10-19 Fujitsu Limited Chemically amplified resist compositions and process for the formation of resist patterns
EP0836119A1 (fr) * 1996-10-11 1998-04-15 Samsung Electronics Co., Ltd. Composition chimiquement amplifiée pour réserve
JPH11305444A (ja) * 1998-02-19 1999-11-05 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
EP0982628A2 (fr) * 1998-08-26 2000-03-01 Sumitomo Chemical Company, Limited Composition de photoréserve positive chimiquement amplifiée

Also Published As

Publication number Publication date
KR100687464B1 (ko) 2007-02-27
US20010046641A1 (en) 2001-11-29
CN1259595C (zh) 2006-06-14
US6495307B2 (en) 2002-12-17
EP1128212A3 (fr) 2001-09-19
EP1128212A2 (fr) 2001-08-29
CN1311459A (zh) 2001-09-05
TW573225B (en) 2004-01-21
KR20010085612A (ko) 2001-09-07

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