SG91806A1 - Method of producing epoxy resin-encapsulated semiconductor device - Google Patents

Method of producing epoxy resin-encapsulated semiconductor device

Info

Publication number
SG91806A1
SG91806A1 SG9803602A SG1998003602A SG91806A1 SG 91806 A1 SG91806 A1 SG 91806A1 SG 9803602 A SG9803602 A SG 9803602A SG 1998003602 A SG1998003602 A SG 1998003602A SG 91806 A1 SG91806 A1 SG 91806A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
epoxy resin
encapsulated semiconductor
producing epoxy
producing
Prior art date
Application number
SG9803602A
Other languages
English (en)
Inventor
Ito Hideo
Minami Katsunori
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG91806A1 publication Critical patent/SG91806A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14549—Coating rod-like, wire-like or belt-like articles
    • B29C45/14565—Coating rod-like, wire-like or belt-like articles at spaced locations, e.g. coaxial-cable wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/74—Heating or cooling of the injection unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG9803602A 1996-01-31 1996-07-22 Method of producing epoxy resin-encapsulated semiconductor device SG91806A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1524896 1996-01-31
JP1524796 1996-01-31

Publications (1)

Publication Number Publication Date
SG91806A1 true SG91806A1 (en) 2002-10-15

Family

ID=26351369

Family Applications (2)

Application Number Title Priority Date Filing Date
SG9803602A SG91806A1 (en) 1996-01-31 1996-07-22 Method of producing epoxy resin-encapsulated semiconductor device
SG1996010299A SG48465A1 (en) 1996-01-31 1996-07-22 Method of producing epoxy resin-encapsulated semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG1996010299A SG48465A1 (en) 1996-01-31 1996-07-22 Method of producing epoxy resin-encapsulated semiconductor device

Country Status (7)

Country Link
US (1) US5672549A (de)
EP (2) EP0787569B1 (de)
KR (1) KR100429046B1 (de)
CN (1) CN1096706C (de)
DE (2) DE69625623T2 (de)
MY (1) MY112215A (de)
SG (2) SG91806A1 (de)

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US6523254B1 (en) * 2000-04-19 2003-02-25 Micron Technology, Inc. Method for gate blocking x-outs during a molding process
CN1309037C (zh) * 2003-11-05 2007-04-04 黄伟鹏 一种一体化接收头的塑模制造方法及其复合塑料模粒
NL1025905C2 (nl) * 2004-04-08 2005-10-11 Fico Bv Werkwijze en inrichting voor het aan een vormholte toevoeren van omhulmateriaal.
SI2409707T1 (sl) 2004-04-15 2015-07-31 Alkermes Pharma Ireland Limited Naprava s podaljšanim sproščanjem na osnovi polimerov
US7456254B2 (en) * 2004-04-15 2008-11-25 Alkermes, Inc. Polymer-based sustained release device
US11246913B2 (en) 2005-02-03 2022-02-15 Intarcia Therapeutics, Inc. Suspension formulation comprising an insulinotropic peptide
JP4890804B2 (ja) * 2005-07-19 2012-03-07 富士通セミコンダクター株式会社 半導体装置及びその製造方法
BRPI0709403A2 (pt) * 2006-03-27 2011-07-12 Matteo Amoruso método para fabricar um cartão de segurança (protegido) pessoal dotado de dois processadores e cartão
EP2049081B1 (de) 2006-08-09 2012-11-14 Intarcia Therapeutics, Inc. Osmotische freisetzungssysteme und kolbenanordnungen
JP4858966B2 (ja) 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
TW200830573A (en) * 2007-01-03 2008-07-16 Harvatek Corp Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip
HRP20130259T1 (hr) 2007-04-23 2013-04-30 Intarcia Therapeutics, Inc. Suspenzijske formulacije inzulinotropnih peptida i njihove uporabe
KR100852463B1 (ko) 2007-08-24 2008-08-14 세크론 주식회사 에폭시 몰딩 컴파운드 공급 방법 및 장치
DK2240155T3 (da) 2008-02-13 2012-09-17 Intarcia Therapeutics Inc Indretninger, formuleringer og fremgangsmåder til levering af flere gavnlige midler
SMT201700583T1 (it) 2009-09-28 2018-01-11 Intarcia Therapeutics Inc Instaurazione e/o terminazione rapida di erogazione di farmaci in modo sostanzialmente stazionario
PL2987600T3 (pl) * 2009-12-24 2018-07-31 Curti Costruzioni Meccaniche S.P.A. Wtryskarka
JP5456548B2 (ja) * 2010-04-12 2014-04-02 住友重機械工業株式会社 樹脂成形金型及び射出成形方法
US20120208755A1 (en) 2011-02-16 2012-08-16 Intarcia Therapeutics, Inc. Compositions, Devices and Methods of Use Thereof for the Treatment of Cancers
KR101354781B1 (ko) * 2012-06-11 2014-01-23 앰코 테크놀로지 코리아 주식회사 반도체 디바이스의 제조 방법
US9889085B1 (en) 2014-09-30 2018-02-13 Intarcia Therapeutics, Inc. Therapeutic methods for the treatment of diabetes and related conditions for patients with high baseline HbA1c
CN104387601B (zh) 2014-11-06 2017-02-08 东莞市德聚胶接技术有限公司 一种uv环氧树脂滴注成型方法及应用
US10925639B2 (en) 2015-06-03 2021-02-23 Intarcia Therapeutics, Inc. Implant placement and removal systems
RU2760007C2 (ru) 2016-05-16 2021-11-22 Интарсия Терапьютикс, Инк. Полипептиды, селективные к рецепторам глюкагона, и способы их применения
USD860451S1 (en) 2016-06-02 2019-09-17 Intarcia Therapeutics, Inc. Implant removal tool
USD840030S1 (en) 2016-06-02 2019-02-05 Intarcia Therapeutics, Inc. Implant placement guide
CN110225762A (zh) 2017-01-03 2019-09-10 因塔西亚制药公司 包括glp-1受体激动剂的连续施用和药物的共同施用的方法
USD933219S1 (en) 2018-07-13 2021-10-12 Intarcia Therapeutics, Inc. Implant removal tool and assembly
KR102153725B1 (ko) * 2018-12-12 2020-09-09 주식회사 디에스시동탄 시트프레임 어셈블리 및 그 제조방법
CN114589852B (zh) * 2022-03-17 2024-11-29 黄高维 一种工业生产用树脂井盖上料装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119734A (ja) * 1983-12-01 1985-06-27 Japan Steel Works Ltd:The 電子部品の樹脂封止方法
DE3819686A1 (de) * 1988-06-09 1989-12-14 Siemens Ag Verfahren zum umspritzen von elektrischen bauelementen mit duroplastischen kunststoffen
EP0419737A2 (de) * 1988-09-27 1991-04-03 Somar Corporation Formverfahren
EP0539109A1 (de) * 1991-10-24 1993-04-28 AT&T Corp. Presspritzform mit Kompensationseinspritzkanal
US5356283A (en) * 1992-10-14 1994-10-18 Nec Corporation Metal mold for sealing semiconductor devices with a resin
JPH07137083A (ja) * 1993-11-18 1995-05-30 Sumitomo Jukikai Plast Mach Kk 射出成形装置
JPH0867745A (ja) * 1994-08-30 1996-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物

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WO1985004418A1 (fr) 1984-03-27 1985-10-10 Transgene S.A. Vecteurs d'expression de l'hirudine, cellules transformees et procede de preparation de l'hirudine
DE3438296A1 (de) 1984-04-18 1985-11-07 Hoechst Ag, 6230 Frankfurt Neue polypeptide mit blutgerinnungshemmender wirkung, verfahren zu deren herstellung bzw. gewinnung, deren verwendung und diese enthaltende mittel
ATE64956T1 (de) 1984-06-14 1991-07-15 Ciba Geigy Ag Verfahren zur herstellung von thrombininhibitoren.
DE3445517C2 (de) 1984-12-13 1993-11-18 Ciba Geigy Für ein Hirudin-ähnliches Protein codierende DNA-Sequenz und Verfahren zur Herstellung eines Hirudin-ähnlichen Proteins
DE3506992A1 (de) 1985-02-27 1986-08-28 Plantorgan Werk Heinrich G.E. Christensen, KG, 2903 Bad Zwischenahn Modifizierte hirudine, verfahren zu deren herstellung und pharmazeutische mittel, die diese wirkstoffe enthalten
ES2055149T3 (es) 1985-04-11 1994-08-16 Hoechst Ag Derivado de hirudina.
FR2593518B1 (fr) 1985-05-02 1989-09-08 Transgene Sa Vecteurs d'expression et de secretion de l'hirudine par les levures transformees
DE3689525D1 (de) 1985-07-17 1994-02-24 Hoechst Ag Neue Polypeptide mit blutgerinnungshemmender Wirkung, Verfahren zu deren Herstellung bzw. Gewinnung, deren Verwendung und diese enthaltende Mittel.
US5179039A (en) * 1988-02-05 1993-01-12 Citizen Watch Co., Ltd. Method of making a resin encapsulated pin grid array with integral heatsink
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JPH02306639A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 半導体装置の樹脂封入方法
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US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119734A (ja) * 1983-12-01 1985-06-27 Japan Steel Works Ltd:The 電子部品の樹脂封止方法
DE3819686A1 (de) * 1988-06-09 1989-12-14 Siemens Ag Verfahren zum umspritzen von elektrischen bauelementen mit duroplastischen kunststoffen
EP0419737A2 (de) * 1988-09-27 1991-04-03 Somar Corporation Formverfahren
EP0539109A1 (de) * 1991-10-24 1993-04-28 AT&T Corp. Presspritzform mit Kompensationseinspritzkanal
US5356283A (en) * 1992-10-14 1994-10-18 Nec Corporation Metal mold for sealing semiconductor devices with a resin
JPH07137083A (ja) * 1993-11-18 1995-05-30 Sumitomo Jukikai Plast Mach Kk 射出成形装置
JPH0867745A (ja) * 1994-08-30 1996-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
KR970060461A (ko) 1997-08-12
CN1156329A (zh) 1997-08-06
KR100429046B1 (ko) 2004-09-18
EP0985513B1 (de) 2003-01-02
US5672549A (en) 1997-09-30
EP0985513A3 (de) 2000-03-22
EP0787569A2 (de) 1997-08-06
DE69625623D1 (de) 2003-02-06
CN1096706C (zh) 2002-12-18
DE69625623T2 (de) 2003-11-06
SG48465A1 (en) 1998-04-17
EP0787569B1 (de) 2002-10-02
EP0787569A3 (de) 1999-04-21
MY112215A (en) 2001-04-30
DE69624087D1 (de) 2002-11-07
EP0985513A2 (de) 2000-03-15
DE69624087T2 (de) 2003-06-05

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