SU643473A1 - Frit - Google Patents

Description

The invention relates to electronics, electronics, mechanical engineering, instrument making, and other areas of technology that use vacuum-tight junctions of corundum ceramics and sapphire to metals. The known paste is for combining corundum ceramics with sapphire, into which the components (in wt.%) SiOj 21-38.8, MpO 57.5-26, Ae „O.12-35, 2-0.1, Wed About 7-0.05 CUgO 0.05-0.15 EI. However, these pastes have a high firing temperature (14pO-1650C), which is why it is impossible to combine the paste firing process directly with the technological process of brazing or welding ceramics with metal. In addition, in a number of cases, for example, when metals are joined to thin (0.5–1 mm) ceramic plates with substrates, the use of such pastes is not acceptable, since their high temperature burning leads to warping. The closest to the proposed is the composition of the Frit, including (in wt.%) SiO 38-52, 3-7, 1-4, CaO 10-16, Mgro 0.1-4, MpO 20-31, Na ,, O 3-10, KjjO 1-3, AO 1-4, 5-12, G 3-7 2. The KTP of the specified frit of the order of 10010 does not provide a connection for a corundum core, aka or sapphire with a metal. The purpose of the invention is to obtain a spa of corundum ceramics and sapphire with a metal when combining heat with soldering or welding of a dielectric with a metal, which greatly simplifies and shortens the technological process of manufacturing the metal-ceramic assembly as a whole. This is achieved by the fact that the composition contains (in BGC.%) SiO 35-46, 20-48, CaFj 2-8, ye "O,. 2-7, MpO 3-14, 1-4, BjOg 1-5, K „O Re, 0z O5-ZGotov t mixture of oxides or components, providing the following ingredients in the firing process, weight,%: SiOi 40, MpO 32, 4, FejOg 2, Vd.od 3, KdO 12, 3, CaFg (composition C-11). The mixture is heated at 1400-1450 0 in any gas atmosphere for 1-2. After cooling, the glass ee .-- 1 is ground to a specific surface / ft L f in CHM ... E ..o where the grains are 3 microns

at least 80%. The resulting powder is mixed with an organic binder and applied to the surface of the dielectric {on the surface of a ceramic or sapphire) by methods known in the ceramic technology: spraying, brush, organic film, etc. The thickness of the applied layer is 10-30 microns.

The connection of the dielectric with the metal; 1llom produced by the method of thermal compression welding (or by soldering under pressure)

at 1050 ° C. This combines the process of burning paste into the surface of the dielectric with the process of direct joining of ceramics with metal.

Glass Fiber Compositions. and some physical and chemical properties are given in the table. The boundary values of the components, as well as their intermediate ratios, provide properties with stable characteristics.

Metal-ceramic copper-corundum ceramics A-995 (ACjOj 5.99.9 wt.%), Obtained by the method of thermocompression welding using this composition, have an increased mechanical tensile strength exceeding about 2.5 times the strength of similar nodes in which the paste was not used. At the same time, the ceramic plates are not boxed, they retain their original geometrical dimensions. The sufficiently high linear expansion coefficient of the glass frit (WO-S1 / t) provides a reliable connection of a corundum dielectric with metals having a high thermal expansion coefficient, for example, with copper O. All this confirms the rather high efficiency of the found technical solution.

Claims (1)

Invention Formula The frit, including SiO, MnD,, KgO, BgOj, tl ı s and so that, in order to ensure the liver, the connection of corundum ceramics and sapphire with metal while combining the processes of burning and soldering, it additionally contains Ca p2 in the following ratio of components, weight. %: 35-46 2-7 20-48 0.5-3 8-14 1-5 1-4 2-8. Sources of information taken into account in the examination one . USSR Author's Certificate No. 383703, cl. From 04 To 41/14, 1971. 2 „USSR Author's Certificate No. 383700, cl. From 03 to 7/06, 1971.